Abstract: A mobile device is disclosed. The mobile device includes a display, a touch panel, and a buffer structure. The touch panel is disposed on one side of the display. The buffer structure has a gas fluid layer and is disposed between the display and the touch panel.

Abstract: A touch panel and a method of manufacturing the same are disclosed in this invention. The touch panel is with a central induction region and a peripheral region, and at least includes an upper electrode portion having an upper substrate located in the central induction region and the peripheral region, a first signal induction layer located in the central induction region and the peripheral region, and a first circuit layer located in the peripheral region only. The first signal induction layer covers the upper substrate in the central induction region. The first circuit layer is sandwiched between the upper substrate and the first signal induction layer, and electrically connected the first signal induction layer.

Abstract: A heat dissipation unit for LED bulb includes a base seat formed with a receiving cavity and a base section, a first heat dissipation member having multiple heat dissipation sections and a perforation, a second heat dissipation member and a retainer member. The heat dissipation sections of the first heat dissipation section are arranged around the perforation. Each heat dissipation section has a first side attached to the base section and a second side. A first through hole is formed in the receiving cavity in communication with the receiving cavity and the perforation. The second heat dissipation member is formed with a second through hole and a spreading section attached to the second side of the heat dissipation section. The retainer member is fitted in the first and second through holes and the perforation to integrally connect the base seat with the first and second heat dissipation members.

Abstract: A mobile device is disclosed. The mobile device includes a display, a touch panel, and a buffer structure. The touch panel is disposed on one side of the display. The buffer structure has a gas fluid layer and is disposed between the display and the touch panel.

Abstract: A touch panel and a method of manufacturing the same are disclosed in this invention. The touch panel is with a central induction region and a peripheral region, and at least includes an upper electrode portion having an upper substrate located in the central induction region and the peripheral region, a first signal induction layer located in the central induction region and the peripheral region, and a first circuit layer located in the peripheral region only. The first signal induction layer covers the upper substrate in the central induction region. The first circuit layer is sandwiched between the upper substrate and the first signal induction layer, and electrically connected the first signal induction layer.

Abstract: A heat-dissipating structure of a LED bulb includes: a base, a heat-absorbing member, a heat-dissipating member, an assembling portion and a heat-conducting member. The base has a trough and a first hole in communication with the trough. The heat-absorbing member is provided in the trough and having a second hole in communication with the first hole. The heat-dissipating member has a third hole opposite to the first hole and a first heat-diffusing portion extending outwardly from the third hole. The first heat-diffusing portion and the base define a first heat-dissipating space there between. The assembling portion has a fourth hole and a second heat-diffusing portion extending outwardly from the fourth hole. The assembling portion and the heat-dissipating member define a second heat-dissipating space there between. A connecting end protrudes from an outer end of the second heat-diffusing portion away from the base.

Abstract: A High Intensity LED is disclosed to include a metal base, which has a through hole extending between the top and bottom surfaces thereof and a first electrode formed integral with and downwardly extending from the bottom surface, a second electrode inserted through the through hole and isolated from the metal base with an electrically insulative sleeve, an LED chip mounted on the top surface of the metal base and electrically contacting with the top surface of the metal base and the LED chip electrically connected to the top end of the second electrode with at least one gold wire, and an electrically insulative packaging shell surrounding the metal base and the LED chip excluding the first electrode and the bottom end of the second electrode. Red, green and/or blue color LED chips may be in contact with the top surface of the metal base to produce High Intensity light.