Abstract: A semiconductor device includes a substrate, an initial layer, and a superlattice stack. The initial layer is located on the substrate and includes aluminum nitride (AlN). The superlattice stack is located on the initial layer and includes a plurality of first films, a plurality of second films and at least one doped layer, and the first films and the second films are alternately stacked on the initial layer, wherein the at least one doped layer is arranged in one of the first films and the second films, and dopants of the at least one doped layer are selected from a group consisting of carbon, iron, and the combination thereof.

Abstract: Disclosed is a microfluidic detection device including a circuit substrate and a transparent substrate. The circuit substrate is provided with at least one first light-emitting device used to emit a detection beam, a photodetector used to receive the detection beam and send out a sensing signal, and a control circuit electrically connected to the first light-emitting device and the photodetector. The transparent substrate overlaps the circuit substrate and is provided with a microfluidic channel and a light guide structure. The light guide structure has a light incident surface disposed corresponding to the first light-emitting device and a light exiting surface disposed corresponding to the photodetector. The light guide structure extends from each of the light incident surface and the light exiting surface to the microfluidic channel and is adapted to transmit the detection beam into and out of the microfluidic channel.

Abstract: A pixel array substrate includes a pixel driving circuit, a first insulating layer, a pad group, and an adjustment structure. The first insulating layer is disposed on the pixel driving circuit. The pad group is electrically connected to the pixel driving circuit. The adjustment structure is disposed on the first insulating layer and is electrically connected to the pad group. The adjustment structure is located between the pad group and the pixel driving circuit. The adjustment structure includes a first adjustment part and a second adjustment part. At least a part of the first adjustment part overlaps the pad group. The second adjustment part is disposed outside the first adjustment part and is staggered from the pad group. An absorptance of the first adjustment part to a laser is higher than an absorptance of the second adjustment part to the laser.

Abstract: An anti-reflective integrated touch display panel includes an anti-reflective structure and touch electrodes. The anti-reflective structure includes a first insulating layer, a second insulating layer disposed on the first insulating layer, a conducting layer disposed on the second insulating layer, a third insulating layer disposed on the second insulating layer, and a fourth insulating layer disposed on the third insulating layer. The first insulating layer includes silicon oxide or silicon nitride, and has a thickness of 0.1 to 2 micrometers. The second insulating layer includes silicon oxide or strontium oxide, and has a thickness of 0.001 to 0.1 micrometer. The conducting layer includes molybdenum, and has a thickness of 0.01 to 0.05 micrometer. The fourth insulating layer includes silicon nitride, and has a thickness of 0.001 to 0.3 micrometer. The touch electrodes are disposed between the third insulating layer and the fourth insulating layer.

Abstract: An anti-reflective integrated touch display panel includes an anti-reflective structure and touch electrodes. The anti-reflective structure includes a first insulating layer, a second insulating layer disposed on the first insulating layer, a conducting layer disposed on the second insulating layer, a third insulating layer disposed on the second insulating layer, and a fourth insulating layer disposed on the third insulating layer. The first insulating layer includes silicon oxide or silicon nitride, and has a thickness of 0.1 to 2 micrometers. The second insulating layer includes silicon oxide or strontium oxide, and has a thickness of 0.001 to 0.1 micrometer. The conducting layer includes molybdenum, and has a thickness of 0.01 to 0.05 micrometer. The fourth insulating layer includes silicon nitride, and has a thickness of 0.001 to 0.3 micrometer. The touch electrodes are disposed between the third insulating layer and the fourth insulating layer.