Abstract: A semiconductor device comprises a first semiconductor structure, a second semiconductor structure located on the first semiconductor structure, and an active layer located between the first semiconductor structure and the second semiconductor structure. The first semiconductor structure has a first conductivity type, and includes a plurality of first layers and a plurality of second layers alternately stacked. The second semiconductor structure has a second conductivity type opposite to the first conductivity type. The plurality of first layers and the plurality of second layers include indium and phosphorus, and the plurality of first layers and the plurality of second layers respectively have a first indium atomic percentage and a second indium atomic percentage. The second indium atomic percentage is different from the first indium atomic percentage.

Abstract: A grinding tool includes a substrate having a working surface, and a plurality of abrasive particles distributed over the working surface and protruding outward from the working surface, wherein at least some of the abrasive particles are machined to form abrasive particles respectively having an obliquely truncated pyramid shape. Some embodiments described herein also include a method of manufacturing the grinding tool.

Abstract: Provided is a CMP conditioner comprising: a substrate, multiple abrasive bars, and multiple slide blocks. The substrate is divided into a central surface and an outer surface. The central surface is a recessed part. The outer surface encompasses the central surface. Multiple mounting holes are recessed from the outer surface. The abrasive bars are each respectively mounted in the mounting holes. Each of the multiple abrasive bars comprises a bar body and an abrasive particle. The abrasive particle is mounted on a top surface of the abrasive bar. The multiple slide blocks are distributed among the mounting holes of the outer surface. Each of the multiple slide blocks comprises a slide dressing surface. The present invention utilizes the slide blocks to reduce the contact between the substrate and a polishing mat efficiently. The slide blocks may decrease dissolving out of metal components within the substrate and the pollution induced.

Abstract: A chemical mechanical polishing conditioner comprises a substrate and at least one abrasive unit. The abrasive unit is provided on the substrate, and the abrasive unit comprises a supporting layer, an abrasive layer and a stress-relief layer. The supporting layer is provided with a working face far away from the substrate and a non-working face opposite to the working face. The abrasive layer is provided on the working face of the supporting layer, and the abrasive layer is a first diamond-plated film formed by chemical vapor deposition method. The first diamond-plated film is provided with a plurality of abrasive tips. The stress-relief layer is provided on the non-working face of the supporting layer, and the stress-relief layer is a second diamond-plated film formed by chemical vapor deposition method. A thermal stress-relieving effect may be exerted by the stress-relief layer, so as to reduce warpage or deformation of the supporting layer.

Abstract: A hybridized CMP conditioner includes a base, a first abrasive unit and a plurality of second abrasive units. The first abrasive unit includes a first bonding layer, a substrate for abrasive unit provided on the first bonding layer and an abrasive layer provided on the substrate for abrasive unit. The abrasive layer is a diamond coating. The diamond coating is provided on the surface thereof with a plurality of abrasive tips. Each second abrasive unit includes a second bonding layer, a carrying post provided on the second bonding layer, an abrasive particle provided on the carrying post and an abrasive material-bonding layer provided between the carrying post and the abrasive particle. The CMP conditioner is provided with both excellent cutting force and flattening capability through the first abrasive unit provided with the abrasive layer and the second abrasive units provided with the abrasive particles.

Abstract: Provided is a chemical mechanical polishing (CMP) conditioner comprising: a substrate comprising a horizontal top surface and multiple abrasive units mounted on the horizontal top surface. Each abrasive unit comprises a base of the abrasive unit, an abrasive layer, and a binding layer. The base of the abrasive unit comprises an upper surface and a lower surface. The abrasive layer is formed on the upper surface and comprises multiple abrasive tips. The binding layer is formed between the lower surface and the substrate, and an inclined plane is formed towards the lower surface. The present invention further provides a method for manufacturing the CMP conditioner. The polishing capabilities of different regions of CMP conditioner can be regulated by the abrasive units. Then the CMP conditioner of the present invention satisfies the requirements in the current industry about different polishing capabilities.

Abstract: A grinding tool includes a substrate having a working surface, and a plurality of abrasive particles distributed across the working surface and protruding outward from the working surface, wherein at least some of the abrasive particles are machined to form abrasive particles respectively having a pyramid shape, the pyramid shape being a right square pyramid or a right hexagonal pyramid.

Abstract: A grinding tool includes a substrate having a working surface, and a plurality of abrasive particles distributed over the working surface and protruding outward from the working surface, wherein at least some of the abrasive particles are machined to form abrasive particles respectively having an obliquely truncated pyramid shape. Some embodiments described herein also include a method of manufacturing the grinding tool.

Abstract: Provided is a CMP conditioner comprising: a substrate, multiple abrasive bars, and multiple slide blocks. The substrate is divided into a central surface and an outer surface. The central surface is a recessed part. The outer surface encompasses the central surface. Multiple mounting holes are recessed from the outer surface. The abrasive bars are each respectively mounted in the mounting holes. Each of the multiple abrasive bars comprises a bar body and an abrasive particle. The abrasive particle is mounted on a top surface of the abrasive bar. The multiple slide blocks are distributed among the mounting holes of the outer surface. Each of the multiple slide blocks comprises a slide dressing surface. The present invention utilizes the slide blocks to reduce the contact between the substrate and a polishing mat efficiently. The slide blocks may decrease dissolving out of metal components within the substrate and the pollution induced.

Abstract: Provided is a CMP conditioner with brushes comprising: a substrate comprising a surface, multiple concave parts formed in the surface; multiple abrasive assemblies, each abrasive assembly comprising a metal bar and an abrasive particle, the metal bar comprising a connecting end and a dressing end, the abrasive particle mounted in the dressing end of the metal bar and protruding a tip, wherein vertical distances between the tips and a level of the surface are equal; and multiple brushes mounted in the surface, wherein ends of the brushes are higher than the tips, vertical distances between the ends of the brushes and a level of the tips ranging from 0.1 mm to 1 mm. The present invention, with precise control of the vertical distance between the tips and the level of the surface, and of the vertical distance between the ends of the brushes and a level of the tips improves the cleaning ability of the CMP conditioner with brushes for the scraps in holes of the surface of a pad and avoid problems, e.g.

Abstract: The present invention relates to a diamond screening apparatus, comprising: a working platform comprising a working plane; a conveyer disposed on the working plane of the working platform for carrying a diamond matrix unit; an image capture device forming one or a plurality of captured images in different regions of the diamond matrix unit; a display device; and an image recognition module, which is electrically connected to the image capture device and the display device, performs a geometric feature parameter analysis on the captured images to determine one or a plurality of risk diamonds of the diamond matrix unit.

Abstract: The present invention relates to a method for manufacturing a chemical mechanical polishing conditioner, comprising: (A) providing a non-planar substrate; (B) providing a binding layer disposed on the surface of the non-planar substrate; (C) providing a plurality of abrasive particles embedded in a surface of the binding layer, and (D) heat curing the binding layer, such that the non-planar substrate is deformed into a planar substrate during curing the binding layer, and the abrasive particles are fixed to a surface of the planar substrate by the binding layer; wherein, after step (D), tips of the abrasive particles have a leveled height. Therefore, the present can effectively improve the problem of thermal deformation of the substrate of the chemical mechanical polishing conditioner during a heat curing process, and enhance surface flatness of the chemical mechanical polishing conditioner.

Abstract: The present invention relates to a chemical mechanical polishing conditioner having different heights, comprising: a substrate; a binding layer disposed on the substrate; and multiple abrasive units placed on the binding layer. Each abrasive unit has an abrasive unit substrate and an abrasive layer which is a diamond film formed by chemical vapor deposition and has multiple abrasive tips. The abrasive units have a first tip height and a second tip height. The first tip height is different from the second tip height. The chemical mechanical polishing conditioner can adjust the surface roughness of the pad to be polished and improve the drainage of abrasive slurry.

Abstract: The present invention relates to a chemical mechanical polishing conditioner with high performance, comprising a substrate; a binding layer disposed on the substrate; and a plurality of abrasive particles fixed directly on the substrate by the binding layer, or each abrasive particle disposed on a metal fixing seat and the substrate have a plurality of blind holes and a plurality of through holes, so that the metal fixing seats are installed into the blind holes or the through holes, and the metal fixing seat fixed on the substrate by the binding layer; wherein the abrasive particles are treated by a surface processing treatment to make the abrasive particles have specific cutting edge angles, crystal structures, tip heights, or tip orientations. Therefore, the present invention can control the profile of each abrasive particle to accomplish the best polishing performance.

Abstract: The present invention relates to a chemical mechanical polishing conditioner made from a woven preform, comprising: a substrate; a bonding layer disposed on the substrate; and a plurality of abrasive particles embedded in the bonding layer and fixed on the substrate by the bonding layer; wherein the bonding layer is formed by heat-curing a woven preform, and the abrasive particles are fixed to the woven preform in advance. Therefore, the present invention can provide the bonding layer with a better flexibility by the woven preform, and solve the conventional problem of resin residue in a powder-form bonding layer, or thermal cracking or thermal deformation of a sheet-form bonding layer during the heating and curing process, and thus improve the polishing performance and service time of the chemical mechanical polishing conditioner.

Abstract: The present invention relates to a diamond screening apparatus, comprising: a working platform comprising a working plane; a conveyer disposed on the working plane of the working platform for carrying a diamond matrix unit; an image capture device forming one or a plurality of captured images in different regions of the diamond matrix unit; a display device; and an image recognition module, which is electrically connected to the image capture device and the display device, performs a geometric feature parameter analysis on the captured images to determine one or a plurality of risk diamonds of the diamond matrix unit.

Abstract: The present invention relates to a detection apparatus of chemical mechanical polishing conditioner, comprising: a working platform with a working plane; a placement base disposed on the working plane of the working platform, for carrying a chemical mechanical polishing conditioner; an image capture device forming one or a plurality of captured images on different regions of the chemical mechanical polishing conditioner; a display device; an image recognition module, wherein the captured images are performed a color matching by the image recognition module to determine one or a plurality of risk diamonds on the chemical mechanical polishing conditioner, and the coordinate location of the risk diamonds are outputted into the display device; and a mobile platform for moving the risk diamonds to specified locations. A detection method of the above mentioned detection apparatus is also disclosed.

Abstract: The present invention relates to a detection method and apparatus for the tip of the chemical mechanical polishing conditioner, which comprises: providing a dyeing apparatus comprising a dyeing layer; providing a chemical mechanical polishing conditioner comprising a substrate, a binding layer, and a plurality of abrasive particles, the abrasive particles fixed on the substrate by the binding layer; making the abrasive particles of the chemical mechanical polishing conditioner toward the dyeing apparatus and provide a downward force, so that the chemical mechanical polishing conditioner is contacted with the dyeing layer; and separating the chemical mechanical polishing conditioner and the dyeing apparatus, so that the abrasive particles with a particular protruding height form dyeing abrasive particles adhered the dyeing layer on their surface, and the dyeing abrasive particles are determined as a defect of destroying the flatness of chemical mechanical polishing conditioner.

Abstract: The present invention relates to a method for manufacturing a chemical mechanical polishing conditioner, comprising: (A) providing a non-planar substrate; (B) providing a binding layer disposed on the surface of the non-planar substrate; (C) providing a plurality of abrasive particles embedded in a surface of the binding layer, and (D) heat curing the binding layer, such that the non-planar substrate is deformed into a planar substrate during curing the binding layer, and the abrasive particles are fixed to a surface of the planar substrate by the binding layer; wherein, after step (D), tips of the abrasive particles have a leveled height. Therefore, the present can effectively improve the problem of thermal deformation of the substrate of the chemical mechanical polishing conditioner during a heat curing process, and enhance surface flatness of the chemical mechanical polishing conditioner.

Abstract: An optical lens forming mold is adapted to press and form a glass preform into an optical lens. The forming mold includes a sleeve, a lower mold core, and an upper mold core. The upper mold core and the lower mold core are disposed within the sleeve opposite to each other, and the glass preform is disposed between the upper mold core and the lower mold core. At least one edge of the upper mold core and the lower mold core is surroundingly arrangement with a baffle. The glass preform is pressed and formed into an optical lens by the upper mold core and the lower mold core, and a shape of the optical lens to be formed is controlled by the battle.