Patents by Inventor Wen-Jen Liau

Wen-Jen Liau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Portable electronic device
    Patent number: 7889504
    Abstract: A portable electronic device includes: a printed circuit board having opposite first and second surfaces and provided with at least one electronic component, the first surface being provided with at least one conductive pad that is electrically coupled to the electronic component; and a flexible circuit board having a main part stacked on the second surface of the printed circuit board, and an extension part extending and folded from the main part and stacked on the first surface of the printed circuit board. The extension part is provided with at least one conductive bump thereon. An outer surface of the main part is provided with at least one input key that is electrically coupled to the conductive bump. The conductive pad is bonded to the conductive bump.
    Type: Grant
    Filed: December 20, 2007
    Date of Patent: February 15, 2011
    Assignee: Universal Scientific Industrial Co., Ltd.
    Inventors: Wen-Jen Liau, Jin-Ching Guo, Ching-Sheng Chang, Hsin-Shun Chen
  • PORTABLE ELECTRONIC DEVICE
    Publication number: 20090116206
    Abstract: A portable electronic device includes: a printed circuit board having opposite first and second surfaces and provided with at least one electronic component, the first surface being provided with at least one conductive pad that is electrically coupled to the electronic component; and a flexible circuit board having a main part stacked on the second surface of the printed circuit board, and an extension part extending and folded from the main part and stacked on the first surface of the printed circuit board. The extension part is provided with at least one conductive bump thereon. An outer surface of the main part is provided with at least one input key that is electrically coupled to the conductive bump. The conductive pad is bonded to the conductive bump.
    Type: Application
    Filed: December 20, 2007
    Publication date: May 7, 2009
    Applicant: UNIVERSAL SCIENTIFIC INDUSTRIAL CO., LTD.
    Inventors: Wen-Jen LIAU, Jin-Ching GUO, Ching-Sheng CHANG, Hsin-Shun CHEN