Patents by Inventor Wen-Jen Lin
Wen-Jen Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240154309Abstract: A multi-band antenna includes a substrate with a first surface and a second surface, a first antenna structure with a first antenna coupling segment, a second antenna structure with a second antenna coupling segment, a first grounding section, a coupling section, a via hole, and a second grounding section. Both of the first antenna structure and the second antenna structure are disposed on the first surface. The first grounding section is connected to the first antenna coupling segment. The coupling section is disposed on the second surface and projected onto the first surface to form a coupling region. Both of the first antenna coupling segment and the second antenna coupling segment at least partially overlap the coupling region. The via hole penetrates through the substrate and is connected between the coupling section and the second antenna coupling segment. The second grounding section is connected to the coupling section.Type: ApplicationFiled: November 2, 2023Publication date: May 9, 2024Inventors: Hung-Ying LIN, Wen Tai TSENG, Kuo Jen LAI
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Patent number: 11961944Abstract: A semiconductor device and a manufacturing method thereof are provided. The semiconductor device includes a semiconductor substrate, active devices and transparent conductive patterns. The active devices are formed on the semiconductor substrate. The transparent conductive patterns are formed over the active devices and electrically connected to the active devices. The transparent conductive patterns are made of a metal oxide material. The metal oxide material has a first crystalline phase with a prefer growth plane rich in oxygen vacancy, and has a second crystalline phase with a prefer growth plane poor in oxygen vacancy.Type: GrantFiled: January 31, 2023Date of Patent: April 16, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chen-En Yen, Ming-Da Cheng, Mirng-Ji Lii, Wen-Hsiung Lu, Cheng-Jen Lin, Chin-Wei Kang, Chang-Jung Hsueh
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Patent number: 11942445Abstract: A semiconductor device is provided. The semiconductor device includes a substrate having a surface. The semiconductor device includes a conductive pad over a portion of the surface. The conductive pad has a curved top surface, and a width of the conductive pad increases toward the substrate. The semiconductor device includes a device over the conductive pad. The semiconductor device includes a solder layer between the device and the conductive pad. The solder layer covers the curved top surface of the conductive pad, and the conductive pad extends into the solder layer.Type: GrantFiled: August 23, 2021Date of Patent: March 26, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chen-En Yen, Chin-Wei Kang, Kai-Jun Zhan, Wen-Hsiung Lu, Cheng-Jen Lin, Ming-Da Cheng, Mirng-Ji Lii
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Publication number: 20240083742Abstract: A micro electro mechanical system (MEMS) includes a circuit substrate comprising electronic circuitry, a support substrate having a recess, a bonding layer disposed between the circuit substrate and the support substrate, through holes passing through the circuit substrate to the recess, a first conductive layer disposed on a front side of the circuit substrate, and a second conductive layer disposed on an inner wall of the recess. The first conductive layer extends into the through holes and the second conductive layer extends into the through holes and coupled to the first conductive layer.Type: ApplicationFiled: November 15, 2023Publication date: March 14, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ting-Li YANG, Kai-Di WU, Ming-Da CHENG, Wen-Hsiung LU, Cheng Jen LIN, Chin Wei KANG
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Publication number: 20240079524Abstract: A semiconductor device comprises a first semiconductor structure, a second semiconductor structure located on the first semiconductor structure, and an active layer located between the first semiconductor structure and the second semiconductor structure. The first semiconductor structure has a first conductivity type, and includes a plurality of first layers and a plurality of second layers alternately stacked. The second semiconductor structure has a second conductivity type opposite to the first conductivity type. The plurality of first layers and the plurality of second layers include indium and phosphorus, and the plurality of first layers and the plurality of second layers respectively have a first indium atomic percentage and a second indium atomic percentage. The second indium atomic percentage is different from the first indium atomic percentage.Type: ApplicationFiled: September 6, 2023Publication date: March 7, 2024Inventors: Wei-Jen HSUEH, Shih-Chang LEE, Kuo-Feng HUANG, Wen-Luh LIAO, Jiong-Chaso SU, Yi-Chieh LIN, Hsuan-Le LIN
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Patent number: 11885690Abstract: A high-precision non-contact temperature measurement device includes: a thermal insulation box made of a thermal insulation material and having therein a receiving space; a dynamic constant-temperature feedback control module for controlling temperature of the receiving space; and a non-temperature-sensing thermal imager disposed in the receiving space. The device achieves system thermal insulation within a non-contact temperature measurement gauge, maintains the overall closed system dynamically at constant temperature, compensates for effects of internal chip self-heating effect and visual field background temperature variation, and finally calculates average temperature of surfaces of a target precisely with an imaging, non-contact temperature measurement gauge and a temperature calibration algorithm widely used in thermal-imaging non-contact temperature measurement.Type: GrantFiled: December 17, 2020Date of Patent: January 30, 2024Assignee: NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Shiang-Feng Tang, Shun-Lung Yen, Kun-Chi Lo, Wen-Jen Lin
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Patent number: 11630182Abstract: A system and method for a second wireless device to establish distance and location of a first device which is transmitting radio waves includes the first and second devices. Each second device includes two or more (N in number) receiving antennas. An angle between the directions in which adjacent receiving antennas receive the strongest signals is 360°/N. The second device obtains a received signal strength indicator (RSSI) of each receiving antenna receiving signals from the first device, and from the two strongest receiving antennas, calculation of an angle between the first device and one of the adjacent receiving antennas can be performed. The distance between the first device and the second device can also be calculated.Type: GrantFiled: July 2, 2021Date of Patent: April 18, 2023Assignee: Nanning FuLian FuGui Precision Industrial Co., Ltd.Inventors: Wen-Jen Lin, Ming-Chieh Cheng
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Patent number: 11254043Abstract: The present invention aims at providing a high-accuracy contactless measurement method for measuring the temperature of a metal thermoforming mold, which is capable of timely monitoring the metal temperature in multiple areas and also has threshold warning functionalities for delivering real-time notifications, in order to save the labor costs for long-term monitoring.Type: GrantFiled: December 23, 2018Date of Patent: February 22, 2022Assignee: National Chung-Shan Institute of Science and TechnologyInventors: Shiang-Feng Tang, Shun-Lung Yen, Kun-Chi Lo, Wen-Jen Lin
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Publication number: 20210333355Abstract: A system and method for a second wireless device to establish distance and location of a first device which is transmitting radio waves includes the first and second devices. Each second device includes two or more (N in number) receiving antennas. An angle between the directions in which adjacent receiving antennas receive the strongest signals is 360°/N. The second device obtains a received signal strength indicator (RSSI) of each receiving antenna receiving signals from the first device, and from the two strongest receiving antennas, calculation of an angle between the first device and one of the adjacent receiving antennas can be performed. The distance between the first device and the second device can also be calculated.Type: ApplicationFiled: July 2, 2021Publication date: October 28, 2021Inventors: WEN-JEN LIN, MING-CHIEH CHENG
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Patent number: 11125625Abstract: A microbolometer read-out circuit includes an extraction circuit configured to detect a voltage signal of a temperature variation; an analog-to-digital converter coupled to the extraction circuit and configured to digitalize the voltage signal of the temperature variation; an image processing circuit coupled to the analog-to-digital converter; and wherein the image processing circuit is coupled to a gain digital-to-analog converter and an offset digital-to-analog converter.Type: GrantFiled: December 24, 2018Date of Patent: September 21, 2021Assignee: National Chung-Shan Institute of Science and TechnologyInventors: Ping-Kuo Weng, Yin-Yi Wu, Shiang-Feng Tang, Wen-Jen Lin, Yau-Tang Gau
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Patent number: 11112484Abstract: A system and method for a second wireless device to establish distance and location of a first device which is transmitting radio waves includes the first and second devices. Each second device includes two or more (N in number) receiving antennas. An angle between the directions in which adjacent receiving antennas receive the strongest signals is 360°/N. The second device obtains a received signal strength indicator (RSSI) of each receiving antenna receiving signals from the first device, and from the two strongest receiving antennas, calculation of an angle between the first device and one of the adjacent receiving antennas can be performed. The distance between the first device and the second device can also be calculated.Type: GrantFiled: May 15, 2019Date of Patent: September 7, 2021Assignee: NANNING FUGUI PRECISION INDUSTRIAL CO., LTD.Inventors: Wen-Jen Lin, Ming-Chieh Cheng
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Publication number: 20210190596Abstract: A high-precision non-contact temperature measurement device includes: a thermal insulation box made of a thermal insulation material and having therein a receiving space; a dynamic constant-temperature feedback control module for controlling temperature of the receiving space; and a non-temperature-sensing thermal imager disposed in the receiving space. The device achieves system thermal insulation within a non-contact temperature measurement gauge, maintains the overall closed system dynamically at constant temperature, compensates for effects of internal chip self-heating effect and visual field background temperature variation, and finally calculates average temperature of surfaces of a target precisely with an imaging, non-contact temperature measurement gauge and a temperature calibration algorithm widely used in thermal-imaging non-contact temperature measurement.Type: ApplicationFiled: December 17, 2020Publication date: June 24, 2021Inventors: SHIANG-FENG TANG, SHUN-LUNG YEN, KUN-CHI LO, WEN-JEN LIN
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Patent number: 10969280Abstract: A temperature measurement correction method for a temperature detection device is provided. The temperature detection device includes a case and a focal plane array module disposed on an inner of the case. The temperature measurement correction method includes measuring an ambient temperature, a temperature of the case and a temperature of the focal plane array module, determining a plurality of radiometric regression coefficients according to the ambient temperature, the temperature of the case and the temperature of the focal plane array module, utilizing the temperature detection device to sense infrared energy radiated from an object to generate an electrical signal, and calculating an actual temperature value of the object according to the plurality of radiometric regression coefficients and the electrical signal.Type: GrantFiled: September 6, 2018Date of Patent: April 6, 2021Assignee: National Chung-Shan Institute of Science and TechnologyInventors: Shiang-Feng Tang, Shun-Lung Yen, Kun-Chi Lo, Wen-Jen Lin
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Publication number: 20200363494Abstract: A system and method for a second wireless device to establish distance and location of a first device which is transmitting radio waves includes the first and second devices. Each second device includes two or more (N in number) receiving antennas. An angle between the directions in which adjacent receiving antennas receive the strongest signals is 360°/N. The second device obtains a received signal strength indicator (RSSI) of each receiving antenna receiving signals from the first device, and from the two strongest receiving antennas, calculation of an angle between the first device and one of the adjacent receiving antennas can be performed. The distance between the first device and the second device can also be calculated.Type: ApplicationFiled: May 15, 2019Publication date: November 19, 2020Inventors: WEN-JEN LIN, MING-CHIEH CHENG
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Publication number: 20200200609Abstract: A microbolometer read-out circuit includes an extraction circuit configured to detect a voltage signal of a temperature variation; an analog-to-digital converter coupled to the extraction circuit and configured to digitalize the voltage signal of the temperature variation; an image processing circuit coupled to the analog-to-digital converter; and wherein the image processing circuit is coupled to a gain digital-to-analog converter and an offset digital-to-analog converter.Type: ApplicationFiled: December 24, 2018Publication date: June 25, 2020Inventors: Ping-Kuo Weng, Yin-Yi Wu, Shiang-Feng Tang, Wen-Jen Lin, Yau-Tang Gau
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Publication number: 20200198219Abstract: The present invention aims at providing a high-accuracy contactless measurement method for measuring the temperature of a metal thermoforming mold, which is capable of timely monitoring the metal temperature in multiple areas and also has threshold warning functionalities for delivering real-time notifications, in order to save the labor costs for long-term monitoring.Type: ApplicationFiled: December 23, 2018Publication date: June 25, 2020Inventors: Shiang-Feng Tang, Shun-Lung Yen, Kun-Chi Lo, Wen-Jen Lin
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Patent number: 10591646Abstract: An infrared anti-reflection film structure, an anti-reflection film layer, including a material of zinc oxide, comprising a top anti-reflection film layer and a bottom anti-reflection film layer, wherein the top anti-reflection film layer is disposed on a top side of the base material and the bottom anti-reflection film layer is disposed on a bottom side of the base material; and the base material is manufactured by a floating zone crystal growth method. Through the silicon base material manufactured by the high purity crystal growth method, the silicon base material replaces germanium as the high refractive index material and base material. And coating the anti-reflection film layer on the surface of the silicon base material, so as to apply the infrared anti-reflection film structure to the thermal imaging technology.Type: GrantFiled: December 20, 2017Date of Patent: March 17, 2020Assignee: National Chung-Shan Institute of Science and TechnologyInventors: Shih-Hao Chan, Shiang-Feng Tang, Shao-Ze Tseng, Kun-Chi Lo, Sheng-Hui Chen, Wen-Jen Lin
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Publication number: 20190195694Abstract: A temperature measurement correction method for a temperature detection device is provided. The temperature detection device includes a case and a focal plane array module disposed on an inner of the case. The temperature measurement correction method includes measuring an ambient temperature, a temperature of the case and a temperature of the focal plane array module, determining a plurality of radiometric regression coefficients according to the ambient temperature, the temperature of the case and the temperature of the focal plane array module, utilizing the temperature detection device to sense infrared energy radiated from an object to generate an electrical signal, and calculating an actual temperature value of the object according to the plurality of radiometric regression coefficients and the electrical signal.Type: ApplicationFiled: September 6, 2018Publication date: June 27, 2019Inventors: Shiang-Feng Tang, Shun-Lung Yen, Kun-Chi Lo, Wen-Jen Lin
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Publication number: 20190187334Abstract: An infrared anti-reflection film structure, an anti-reflection film layer, including a material of zinc oxide, comprising a top anti-reflection film layer and a bottom anti-reflection film layer, wherein the top anti-reflection film layer is disposed on a top side of the base material and the bottom anti-reflection film layer is disposed on a bottom side of the base material; and the base material is manufactured by a floating zone crystal growth method. Through the silicon base material manufactured by the high purity crystal growth method, the silicon base material replaces germanium as the high refractive index material and base material. And coating the anti-reflection film layer on the surface of the silicon base material, so as to apply the infrared anti-reflection film structure to the thermal imaging technology.Type: ApplicationFiled: December 20, 2017Publication date: June 20, 2019Inventors: Shih-Hao Chan, Shiang-Feng Tang, Shao-Ze Tseng, Kun-Chi Lo, Sheng-Hui Chen, Wen-Jen Lin
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Patent number: 9671218Abstract: A quick subpixel absolute positioning device and method are introduced.Type: GrantFiled: December 22, 2014Date of Patent: June 6, 2017Assignee: NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Yi-Yuh Hwang, Wei-Guo Chang, Chin-Der Hwang, Guang-Sheen Liu, Wen-Jen Lin, Ping-Ya Ko