Abstract: A wavelength converting material including a wavelength converting activator and a scatter is provided. The wavelength converting activator is suitable for being activated by a light with a wavelength ?1, so as to emit a light with a wavelength ?2. The scatter is disposed on the wavelength converting activator. The scatter is suitable for scattering a first light and a second light irradiated to a surface thereof. As a result of that the scatters on the wavelength converting activators increases the gap of two wavelength converting activators adjacent to each other, the wavelength converting activators could be sufficiently activated for emitting a light with wavelength ?2 while the wavelength converting materials are irradiated by the light with ?1. Therefore, the brightness of a light emitting diode with the wavelength converting material is enhanced.

Abstract: The present invention discloses a surface mount type light-emitting diode package device and a light-emitting element package device. In the device, the encapsulation layer comprises an encapsulation material and at least one material having a refraction index different from the encapsulation material distributed therein. The distribution of the material having a refraction index different from the encapsulation material is in a way such that the refraction index of the encapsulation layer is gradually reduced from the bottom portion upward to the top portion or the inner portion outward to the outer portion of the encapsulation layer. Accordingly, a difference between the refraction indexes of two adjoining media can be reduced to eliminate a total reflection and the Fresnel loss and enhance light extraction efficiency.

Abstract: A light emitting diode includes two lead-frames, one or a plurality of light emitting chip, a casing, and a packaging colloid; the casing comprised of two pairs of a first and a second side units to surround a compartment; the first side unit being higher than the second side unit; the packaging colloid being received in the compartment; and the packaging colloid protruding from the casing to indicate a convex so to change angle of incidence of the light after leaving the packaging colloid and to improve light use efficiency and light emitting angle.

Abstract: The invention discloses a surface mount type light emitting diode (LED) package device, which has a cup-shaped structure and comprises a specific lens bulged out over the cup opening. The lens is an aspheric lens having a specific curved surface not fully symmetric with respect to its central point, while it exhibits a similarly symmetric curved surface with respect to a bisector line or a diagonal line passing through the central point. The LED package device according to the present invention may have a wider view angle.

Abstract: An LED package includes a carrier, an LED chip and a light scattering material. The LED chip is disposed on the carrier, electrically connected with the carrier and adapted to emitting a light with wavelength ?1. The light scattering material is disposed on the carrier and includes scatters for scattering a light. A material of the scatters is a birefringent material (e.g. barium carbonate, strontium carbonate, lithium carbonate, sodium carbonate, potassium carbonate, magnesium carbonate and so forth) or nitride (e.g. boron nitride). The present invention further provides a direct type and an edge type backlight modules whose diffusion plates have the scatters. Since the light can be scattered by the scatters, an effect of light mixing in the LED package and the uniformity of the backlight modules can be enhanced.

Abstract: The present invention discloses a surface mount type light-emitting diode package device and a light-emitting element package device. In the device, the encapsulation layer comprises an encapsulation material and at least one material having a refraction index different from the encapsulation material distributed therein. The distribution of the material having a refraction index different from the encapsulation material is in a way such that the refraction index of the encapsulation layer is gradually reduced from the bottom portion upward to the top portion or the inner portion outward to the outer portion of the encapsulation layer. Accordingly, a difference between the refraction indexes of two adjoining media can be reduced to eliminate a total reflection and the Fresnel loss and enhance light extraction efficiency.

Abstract: A light emitting diode includes two lead-frames, one or a plurality of light emitting chip, a casing, and a packaging colloid; the casing comprised of two pairs of a first and a second side units to surround a compartment; the first side unit being higher than the second side unit; the packaging colloid being received in the compartment; and the packaging colloid protruding from the casing to indicate a convex so to change angle of incidence of the light after leaving the packaging colloid and to improve light use efficiency and light emitting angle.

Abstract: A wavelength converting material including a wavelength converting activator and a scatter is provided. The wavelength converting activator is suitable for being activated by a light with a wavelength ?1, so as to emit a light with a wavelength ?2. The scatter is disposed on the wavelength converting activator. The scatter is suitable for scattering a first light and a second light irradiated to a surface thereof. As a result of that the scatters on the wavelength converting activators increases the gap of two wavelength converting activators adjacent to each other, the wavelength converting activators could be sufficiently activated for emitting a light with wavelength ?2 while the wavelength converting materials are irradiated by the light with ?1. Therefore, the brightness of a light emitting diode with the wavelength converting material is enhanced.

Abstract: An anti-fingerprint coating construction (23) for application to a surface of a substrate (21) includes a layer formed of a material selected from the group consisting of a hydrophobic nano-composite material, an oleophobic nano-composite material, and a super-amphiphobic nano-composite material. When the anti-fingerprint coating construction is employed on a metal surface or a nonmetal surface, sweat or/and grease on fingers of a user is not liable to be adhered to the surface. Therefore a fingerprint of the user is prevented from being imprinted on the surface, and the surface can remain clean and aesthetically pleasing. Because the anti-fingerprint coating construction is easy to clean, the anti-fingerprint coating construction has good anti-corrosion and antibacterial properties. The anti-fingerprint coating construction contains no chromium, and therefore does not need to be processed by an acid or alkali solution. This makes the anti-fingerprint coating construction environmentally friendly.