Abstract: A high-voltage semiconductor device structure is provided. The high-voltage semiconductor device structure includes a semiconductor substrate, a source ring in the semiconductor substrate, and a drain region in the semiconductor substrate. The high-voltage semiconductor device structure also includes a doped ring surrounding sides and a bottom of the source ring and a well region surrounding sides and bottoms of the drain region and the doped ring. The well region has a conductivity type opposite to that of the doped ring. The high-voltage semiconductor device structure further includes a conductor electrically connected to the drain region and extending over and across a periphery of the well region. In addition, the high-voltage semiconductor device structure includes a shielding element ring between the conductor and the semiconductor substrate. The shielding element ring extends over and across the periphery of the well region.

Abstract: The present invention discloses a unit coil, a coil assembly and a coreless type linear motor. The unit coil includes bent subcoils arranged adjacent to one another and disposed on a non-acting side axially. The coil assembly includes tri-phase unit coil modules arranged in an operating direction, and the tri-phase unit coil module is composed of three identical unit coils alternately stacked and sealed by a resin layer, and the unit coil is formed by bending and stacking sub-coils. The bent sub-coils are stacked to a sufficient thickness or arranged to a sufficient width to achieve the desired driving force, and then a magnetic rail is provided to form a coreless type linear motor. In the aforementioned structure, the unit coil composed by an alternately overlapping layout method effectively reduces the required space of the coil assembly, and the sub-coils can be manufactured easily and will not be damaged easily.

Abstract: The present invention discloses a unit coil, a coil assembly and a coreless type linear motor. The unit coil includes bent subcoils arranged adjacent to one another and disposed on a non-acting side axially. The coil assembly includes tri-phase unit coil modules arranged in an operating direction, and the tri-phase unit coil module is composed of three identical unit coils alternately stacked and sealed by a resin layer, and the unit coil is formed by bending and stacking sub-coils. The bent sub-coils are stacked to a sufficient thickness or arranged to a sufficient width to achieve the desired driving force, and then a magnetic rail is provided to form a coreless type linear motor. In the aforementioned structure, the unit coil composed by an alternately overlapping layout method effectively reduces the required space of the coil assembly, and the sub-coils can be manufactured easily and will not be damaged easily.