Patents by Inventor Wen-Jia Ren

Wen-Jia Ren has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8380262
    Abstract: A slide phone includes a first body, a main sheet, a second body, a pair of lever, a keypad, and a pair of supports. The main sheet is mounted on the first body. The second body is slidably installed on the main sheet and capable of moving relative to the first body. When the slide phone is closed, the second body forms a receiving space together with the first body. The levers are positioned to opposite sides of the first body. The keypad is mounted on the levers and can be accommodated in the receiving space when the slide phone is closed, and can be lifted by the levers to be substantially coplanar with an upper surface of the second body when the slide phone is opened. The pair of supports is mounted on the first body adjacent to the lever correspondingly.
    Type: Grant
    Filed: January 20, 2010
    Date of Patent: February 19, 2013
    Assignees: Ambit Microsystems (Shanghai) Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Pei Liu, Xin-Long Fang, Wen-Jia Ren, Jin-Shui Chen, Zhong-You Li, Zhan-Xing Ma
  • Patent number: 7986533
    Abstract: A shielding assembly comprises at least two shielding modules, each comprising a frame and a cover mounted on the frame. Each of the at least two covers comprises a plurality of engaging portions and a plurality of slots between each two adjacent engaging portions, and one portion of one of the at least two frames abuts one portion of another of the at least two frames. Each of the plurality of engaging portions of one of the at least two covers is received in a corresponding slot of another of the at least two covers to connect the at least two shielding covers to form a cover to reduce electromagnetic interference for an electronic components positioned on a circuit board.
    Type: Grant
    Filed: May 7, 2009
    Date of Patent: July 26, 2011
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Wen-Jia Ren, Xiao-Yan Qin
  • Publication number: 20110092259
    Abstract: A slide phone includes a first body, a main sheet, a second body, a pair of lever, a keypad, and a pair of supports. The main sheet is mounted on the first body. The second body is slidably installed on the main sheet and capable of moving relative to the first body. When the slide phone is closed, the second body forms a receiving space together with the first body. The levers are positioned to opposite sides of the first body. The keypad is mounted on the levers and can be accommodated in the receiving space when the slide phone is closed, and can be lifted by the levers to be substantially coplanar with an upper surface of the second body when the slide phone is opened. The pair of supports is mounted on the first body adjacent to the lever correspondingly.
    Type: Application
    Filed: January 20, 2010
    Publication date: April 21, 2011
    Applicants: AMBIT MICROSYSTEMS (SHANGHAI) LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: PEI LIU, XIN-LONG FANG, WEN-JIA REN, JIN-SHUI CHEN, ZHONG-YOU LI, ZHAN-XING MA
  • Publication number: 20100149780
    Abstract: A shielding assembly comprises at least two shielding modules, each comprising a frame and a cover mounted on the frame. Each of the at least two covers comprises a plurality of engaging portions and a plurality of slots between each two adjacent engaging portions, and one portion of one of the at least two frames abuts one portion of another of the at least two frames. Each of the plurality of engaging portions of one of the at least two covers is received in a corresponding slot of another of the at least two covers to connect the at least two shielding covers to form a cover to reduce electromagnetic interference for an electronic components positioned on a circuit board.
    Type: Application
    Filed: May 7, 2009
    Publication date: June 17, 2010
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: WEN-JIA REN, XIAO-YAN QIN