Abstract: A method for predicting clinical severity of a neurological disorder includes steps of: a) identifying, according to a magnetic resonance imaging (MRI) image of a brain, brain image regions each of which contains a respective portion of diffusion index values of a diffusion index, which results from image processing performed on the MRI image; b) for one of the brain image regions, calculating a characteristic parameter based on the respective portion of the diffusion index values; and c) calculating a severity score that represents the clinical severity of the neurological disorder of the brain based on the characteristic parameter of the one of the brain image regions via a prediction model associated with the neurological disorder.

Abstract: A light emitting device includes a heat dissipation casing and an LED module. The heat dissipation casing includes an upper cover, a lower cover and a plurality of side covers. The upper cover has a plurality of first holes. The lower cover and the upper cover are opposite to each other. The side covers are connected to the upper cover and the lower cover, wherein there are at least two chamfered surfaces between the at least two side covers and the upper cover, and the chamfered surfaces have a plurality of second holes. The LED module is disposed inside the heat dissipation casing and located on the lower cover. The LED module has a light emitting surface, and the light emitting surface and the first and the second holes are respectively located on opposite sides of the LED module.

Abstract: A light source module is adapted to perform a light irradiation process on an object. The light source module includes a transparent cover, a reflector and a light emitting unit. The reflector covers the transparent cover, and the reflector and the transparent cover define a containing space. The light emitting unit is disposed inside the containing space. A perpendicular working distance from the transparent cover to the object is WD, a semi-minor axis of the reflector is A, and a semi-major axis of the reflector is B, wherein WD=2 A-3 to 3.5 A-3, and B=2 A to 2.5 A.

Abstract: A light source module is adapted to perform a light irradiation process on an object. The light source module includes a transparent cover, a reflector and a light emitting unit. The reflector covers the transparent cover, and the reflector and the transparent cover define a containing space. The light emitting unit is disposed inside the containing space. A perpendicular working distance from the transparent cover to the object is WD, a semi-minor axis of the reflector is A, and a semi-major axis of the reflector is B, wherein WD=2A-3 to 3.5A-3, and B=2A to 2.5A.

Abstract: A light emitting device includes a heat dissipation casing and an LED module. The heat dissipation casing includes an upper cover, a lower cover and a plurality of side covers. The upper cover has a plurality of first holes. The lower cover and the upper cover are opposite to each other. The side covers are connected to the upper cover and the lower cover, wherein there are at least two chamfered surfaces between the at least two side covers and the upper cover, and the chamfered surfaces have a plurality of second holes. The LED module is disposed inside the heat dissipation casing and located on the lower cover. The LED module has a light emitting surface, and the light emitting surface and the first and the second holes are respectively located on opposite sides of the LED module.

Abstract: A package material for packaging a photoelectric device includes a first molding portion and a second molding portion. The first molding portion is disposed on the photoelectric device. The first molding portion includes a first molding compound and a plurality of nano-scale metal oxide particles, wherein the nano-scale metal oxide particles are doped in the first molding compound. The second molding portion is disposed on the first molding portion and away from the photoelectric device. The second molding portion includes a second molding compound and a plurality of submicron-scale metal oxide particles, wherein the submicron-scale metal oxide particles are doped in the second molding compound. A whole refractive index of the first molding portion is larger than a whole refractive index of the second molding portion.