Abstract: A control system and a method for controlling information process devices is disclosed using an additional input device with an application installed inside so that the plurality of information processing devices is controlled by a set of mouse and keyboard or the input device. The control system comprises: a mouse keyboard controller connects with a mouse, a keyboard, and an input device, wherein an application program is installed in the input device and drives the input device to communicate with the mouse keyboard controller and the plurality of information processing devices is controlled by the mouse keyboard controller.

Abstract: A control system and a method for controlling information process devices is disclosed using an additional input device with an application installed inside so that the plurality of information processing devices is controlled by a set of mouse and keyboard or the input device. The control system comprises: a mouse keyboard controller connects with a mouse, a keyboard, and an input device, wherein an application program is installed in the input device and drives the input device to communicate with the mouse keyboard controller and the plurality of information processing devices is controlled by the mouse keyboard controller.

Abstract: A control system and a method for display a plurality of video signals, the control system comprises at least one computer, at least one video device, at least one video command center (VCC) module, at least one mouse keyboard controller (MKC), a mouse, a keyboard, and at least one display device. The at least one video command center module simultaneously and separately multi-displays a plurality of input sources on at least two windows of the at least one display device, and the video command center module controlling one of the at least two windows that is selected in accordance with the mouse signal and the keyboard signal transmitted by the at least one mouse keyboard controller.

Abstract: The present invention is a wafer level integrating method for bonding an un-sliced wafer including image sensors and a wafer-sized substrate including optical components thereon. A zeroth order light reflective substrate is provided between the un-sliced wafer and the wafer-sized substrate. The image sensors are either CMOS or CCD image sensors. The wafer-sized substrate is a transparent plate and the optical components thereon include a blazed grating, a two-dimensional microlens array or other optical-functional elements. The wafer-sized substrate is bonded onto the zeroth order light reflective substrate by an appropriate optical adhesive to form a composite substrate. Bonding pads and bumps are provided at corresponding positions on the bonding surface of the un-sliced wafer and the composite substrate respectively so that the composite substrate and the un-sliced wafer can be bonded together through a reflow process.

Abstract: The present invention is a wafer level integrating method for bonding an un-sliced wafer including image sensors and a wafer-sized substrate including optical components thereon. A zeroth order light reflective substrate is provided between the un-sliced wafer and the wafer-sized substrate. The image sensors are either CMOS or CCD image sensors. The wafer-sized substrate is a transparent plate and the optical components thereon include a blazed grating, a two-dimensional microlens array or other optical-functional elements. The wafer-sized substrate is bonded onto the zeroth order light reflective substrate by an appropriate optical adhesive to form a composite substrate. Bonding pads and bumps are provided at corresponding positions on the bonding surface of the un-sliced wafer and the composite substrate respectively so that the composite substrate and the un-sliced wafer can be bonded together through a reflow process.

Abstract: An image sensor apparatus for converting an incident light into electric signal is disclosed. The apparatus has a color separation layer that comprises a body layer for receiving incident light. A surface of the body layer is covered by a two-dimensional microlens array of lenslets, and the other surface of the body layer is covered by a blazed diffraction grating layer. A zeroth-order reflection layer is disposed behind the color separation layer along the path of the incident light for reflecting away zeroth-order component of the incident light. An image sensor array is disposed further behind the zeroth-order reflection layer along the path of the incident light and comprises a two-dimensional array of light-sensing cells.

Abstract: A reflective-type diffraction grating structure for use in color display devices such as liquid crystal displays (LCDs). It contains: (1) a plurality of micro-lenses each having a smooth top surface and a blazed zig-zag-shaped grating surface at the bottom; (2) an optical coating formed below the zig-zag-shaped grating surface; and (3) a reflective member formed below the optical coating. With the cooperative actions of the zig-zag-shaped grating surface, the optical coating layer, and the reflective member, an incident light, when reflected, is separated into repeated sequences of red, green, and blue color components and a black matrix segregating the red, green, and blue color components. A sequence of micro-light valves are placed in the path of the reflected incident light to block the undesired color components. The reflective-type diffraction grating structure dispenses with the need for the various layers of color filters.