Abstract: A projection device includes a casing, a light source module, a light valve module, a projection lens, a heat dissipation module, and a fan disposed in the casing. The casing has at least one air inlet, a first air outlet, and a second air outlet. The heat dissipation module is coupled to the light source module and the light valve module and configured to cool the light source module and the light valve module. The fan has a first air exhaust and a second air exhaust. The first air exhaust and the second air exhaust are respectively disposed at positions adjacent to the first air outlet and the second air outlet of the casing.

Abstract: An optical engine module including a housing, an optical element, a positioning member, and a heat dissipation assembly is provided. The optical element and the positioning member are arranged in the housing. The positioning member abuts and positions the optical element. The heat dissipation assembly is coupled to the positioning member. The heat dissipation assembly absorbs heat generated by the optical element through the positioning member and transmits the heat outside the housing. A projection device is also provided.

Abstract: A light source heat-dissipating device is disposed in a projection apparatus having a casing with an air inlet. The light source heat-dissipating device has a heat-dissipating fin assembly disposed in the casing and having an air intake side, and first and second heat-dissipating fin assemblies, a first air duct, and a fan adjacent to the first and second heat-dissipating fin assemblies. The second heat-dissipating fin assembly is stacked on the first one. The first heat-dissipating fin assembly is between the second one and the air inlet. The first air duct is adjacently-disposed at the air intake side, has a first entrance end connected with the air inlet and a first exit end opposite to the first entrance. The light source heat-dissipating device and projection apparatus improve temperature and life consistency between light source modules. The heat dissipation performances of the first and second heat-dissipating fin assemblies tend to be consistent.

Abstract: A heat dissipation module is configured to dissipate heat generated by at least one heating element of a projection device. The heat dissipation module includes at least one first heat pipe, at least one second heat pipe and a heat dissipation fin assembly. The first heat pipe includes a first section connected to the heating element and a second section. The second heat pipe includes a third section connected to the heating element and a fourth section. The length of the first heat pipe is less than that of the second heat pipe. The heat dissipation fin assembly includes a plurality of heat dissipation fins. The second section and the fourth section pass through the heat dissipation fin assembly, and the number of heat dissipation fins through which the second section passes is 70% or below of the number of heat dissipation fins through which the fourth section passes.

Abstract: A projection apparatus includes a casing, a projection lens, a first fan, a second fan, and a heat sink assembly. The casing has an air inlet and an air outlet. The projection lens is disposed in the casing, and between the air inlet and the air outlet. The first fan is disposed in the casing, and between the projection lens and the air inlet. The second fan is disposed in the casing, and between the projection lens and the air outlet. The heat sink assembly is disposed in the casing and between the projection lens and the air inlet. The first fan has a first rotational speed, the second fan has a second rotational speed. The second rotational speed is larger than the first rotational speed. The projection apparatus has the advantages of low development cost and effectively lowering the influence of the heat on the image quality.

Abstract: The disclosure provides a wavelength conversion module and a projection device. The wavelength conversion module includes a housing, a wavelength conversion element, and a heat transfer fluid. The housing has a sealed space. The wavelength conversion element is disposed in the sealed space of the housing. The heat transfer fluid is filled in the sealed space of the housing, wherein the thermal conductivity of the heat transfer fluid is at least 5 times the thermal conductivity of air. The wavelength conversion module and the projection device can provide better heat dissipation capability to improve the optical reaction efficiency of the wavelength conversion element, and have better projection quality and product competitiveness.

Abstract: A projection apparatus includes a casing, a projection lens, a first fan, a second fan, and a heat sink assembly. The casing has an air inlet and an air outlet. The projection lens is disposed in the casing, and between the air inlet and the air outlet. The first fan is disposed in the casing, and between the projection lens and the air inlet. The second fan is disposed in the casing, and between the projection lens and the air outlet. The heat sink assembly is disposed in the casing and between the projection lens and the air inlet. The first fan has a first rotational speed, the second fan has a second rotational speed. The second rotational speed is larger than the first rotational speed. The projection apparatus has the advantages of low development cost and effectively lowering the influence of the heat on the image quality.

Abstract: A heat dissipation module is configured to dissipate heat generated by at least one heating element of a projection device. The heat dissipation module includes at least one first heat pipe, at least one second heat pipe and a heat dissipation fin assembly. The first heat pipe includes a first section connected to the heating element and a second section. The second heat pipe includes a third section connected to the heating element and a fourth section. The length of the first heat pipe is less than that of the second heat pipe. The heat dissipation fin assembly includes a plurality of heat dissipation fins. The second section and the fourth section pass through the heat dissipation fin assembly, and the number of heat dissipation fins through which the second section passes is 70% or below of the number of heat dissipation fins through which the fourth section passes.

Abstract: A light source heat-dissipating device is disposed in a projection apparatus having a casing with an air inlet. The light source heat-dissipating device has a heat-dissipating fin assembly disposed in the casing and having an air intake side, and first and second heat-dissipating fin assemblies, a first air duct, and a fan adjacent to the first and second heat-dissipating fin assemblies. The second heat-dissipating fin assembly is stacked on the first one. The first heat-dissipating fin assembly is between the second one and the air inlet. The first air duct is adjacently-disposed at the air intake side, has a first entrance end connected with the air inlet and a first exit end opposite to the first entrance. The light source heat-dissipating device and projection apparatus improve temperature and life consistency between light source modules. The heat dissipation performances of the first and second heat-dissipating fin assemblies tend to be consistent.

Abstract: The present invention discloses a conductive paste for solar cell, including the following composition: (a) a silver powder; (b) a filler which can be coated with a conductor; (c) a glass frit; and further (d) a dispersing agent, an organic vehicle, and at least one additive. The filler, especially conductor coated, is used to replace part of silver powder as an ingredient of the conductive paste and thus reduces manufacturing cost without conductivity diminishing. This conductive paste can be utilized to form the front-side electrode of the substrate for solar cell.

Abstract: This present disclosure relates to conductive aluminum paste for fabricating a silicon solar cell. Herein, the conductive aluminum paste is composed of organic carrier, aluminum powder, nano-scale metal particle, and glass frit, wherein the nano-scale metal particle has a particle size distribution D50 in the range from 10 nanometers to 1000 nanometers and the weight percentage of the nano-scale metal particle associated with the conductive aluminum paste is around 0.1 through 10 wt %. Furthermore, the characteristics of the conductive aluminum paste are for reducing the sheet resistance value of the electrode, increasing the adhesion in the silicon solar cell package module, and enhancing the electro-optical conversion efficiency of the silicon solar cell.

Abstract: This present disclosure relates to conductive aluminum paste for fabricating a silicon solar cell. Herein, the conductive aluminum paste is composed of organic carrier, aluminum powder, nano-scale metal particle, and glass frit, wherein the nano-scale metal particle has a particle size distribution D50 in the range from 10 nanometers to 1000 nanometers and the weight percentage of the nano-scale metal particle associated with the conductive aluminum paste is around 0.1 through 10 wt %. Furthermore, the characteristics of the conductive aluminum paste are for reducing the sheet resistance value of the electrode, increasing the adhesion in the silicon solar cell package module, and enhancing the electro-optical conversion efficiency of the silicon solar cell.

Abstract: This present disclosure relates to conductive aluminum paste for fabricating a silicon solar cell. Herein, the conductive aluminum paste is composed of organic carrier, aluminum powder, nano-scale metal particle, and glass frit, wherein the nano-scale metal particle has a particle size distribution D50 in the range from 10 nanometers to 1000 nanometers and the weight percentage of the nano-scale metal particle associated with the conductive aluminum paste is around 0.1 through 10 wt %. Furthermore, the characteristics of the conductive aluminum paste are for reducing the sheet resistance value of the electrode, increasing the adhesion in the silicon solar cell package module, and enhancing the electro-optical conversion efficiency of the silicon solar cell.

Abstract: A conductive paste includes: at least one metal powder, an organic vehicle, a glass and a surfactant having a representative formula as follows: Mx(R)y(Q)z, wherein M is selected from a metal element and a semiconductive element, R is hydrophilic group directly connected to M and one will be able to hydrolyze by water to form another hydrophilic group, and Q is a hydrophobic group. The hydrophilic functional group of the surfactant will attach on the metal powder surface closely. Therefore, the surfactant can disperse the metal powder in the organic vehicle well and prevent paste from aggregating.

Abstract: A solar cell, comprising: a substrate, including p-n doping structure formed within said substrate; material attached to the back of said substrate, where said material includes glass mixture, aluminum material, organic medium and additive. Wherein said glass needs to be formed by combining two or more glasses: the main composition for post-mixed glass should include Al2O3, Bi2O5, B2O3, SiO2, PbO, Tl2O3 and other metal and non-metal oxides. For the material composition, aluminum powder content is 60˜80 mass %, with approximately 90 to 99.99% purity. Additives include C10˜C24 stearic acid, with the content of less than 5 mass %. The C10˜C24 stearic acid may include oleic acid. Organic medium content is roughly 20˜35 mass %. Wherein said organic medium includes 60˜90 mass % ether class organic solvent, 10˜20 mass % cellulosic resin and 1˜5 mass % of leveling agent, rheological agent or thixotropic agent.

Abstract: A solar cell comprises a substrate with a p-n junction formed therein. A buffer layer is formed on the substrate, wherein the buffer layer has a plurality of grooves formed therein. The material for forming the buffer layer includes silicon oxide, nitride, oxynitride or the combination thereof. The buffer layer is formed by sputtering method. Metal layers are formed onto the buffer layer and filled into the grooves.

Abstract: The present invention discloses system and method for measuring coefficient variance of resonance frequency of musculoskeletal system. In this regards, the system comprises a signal generation module, a signal retrieval module, and a signal analysis module. The purpose of the system is to measure resonance frequencies of a musculoskeletal system which implanted with an arthroplasty in order to form a statistical sampling space of resonance frequencies. Therefore a coefficient variance of the statistical sampling space of resonance frequencies can be derived. Consequently, the magnitude of this coefficient variance is used for determining whether the implated arthroplasty loose.