Abstract: A semiconductor device includes an insulating base layer, a semiconductor layer, an insulating layer, an isolation trench and a gettering site. The semiconductor layer and the insulating layer are disposed on the insulating base layer in sequence, and the isolation trench is disposed in the semiconductor layer and passes through the insulating layer. The isolation trench includes a first cross-section, a second cross-section and a third cross-section from top to bottom. The first cross-section is higher than the bottom surface of the insulating layer, and the second cross-section and the third cross-section are lower than the bottom surface of the insulating layer. The gettering site is disposed in the semiconductor layer and in contact with the isolation trench, and the vertex of the gettering site is lower than the second cross-section.

Abstract: A temperature-sensing and humidity-controlling fiber includes a hydrophilic material and a temperature-sensing material. The temperature-sensing material has a lower critical solution temperature (LCST) between 31.2° C. and 32.5° C. when a light transmittance thereof is in a range from 3% to 80%, in which a wavelength of the light is between 450 nm and 550 nm.

Abstract: An LED bay light includes a heat pipe module, a light condenser and at least one LED light emitting module. The heat pipe module is coupled to a side of the light condenser, and both are made of a thermally conductive material. The light condenser includes a top plate and at least one reflecting plate. The LED light emitting module is installed on a side of the top plate and covered by an inner side of the reflecting plate, and the inner side of the reflecting plate is coated with a color layer. The LED bay light dissipates heat produced from the LED light emitting module by the heat pipe module and the light condenser simultaneously to improve the heat dissipation efficiency effectively, and the light of the LED bay light can change its color through the reflection from the reflecting plate or the color layer.

Abstract: An active heat dissipating LED illumination lamp includes a substrate holder, at least one LED illumination assembly, a plurality of heat pipes and a heat sink module. The LED illumination assembly is installed on a side of the substrate holder, and the heat pipes and the heat sink module are installed on the other side of the substrate holder, and a plurality of first diversion channels is formed between the heat pipes, and each heat dissipating fin has at least one ventilation hole occupying 12%˜60% of the total area to form a second diversion channel, and a second interval is defined between the bottom of the heat sink module and the substrate holder. When the heat generated by the LED illumination assembly is provided for performing heat conduction, the heat is guided actively to the second diversion channel to perform heat convection.

Abstract: A bidirectional heat dissipation structure includes a base, a plurality of heat pipes and a heat sink having a plurality of cooling fins. The cooling fins are installed with an interval apart on the heat pipes and stacked onto the base, and each cooling fin includes at least one guide slat. When assembled, a horizontal diversion channel is formed between the cooling fins, and the guide slats form a downward diversion channel. When used, a portion of the wind current dissipates the heat of the heat sink through the horizontal diversion channel, and the other portion of the wind current blows downwardly through the downward diversion channel to dissipate the heat around the electronic device directly, so as to enhance the heat dissipation efficiency significantly.

Abstract: A heat sink includes a heat dissipation fins assembly, a heat spreader, and a heat pipe. The heat dissipation fins assembly includes a plurality of heat dissipation fins. A guide plate extruding from a bottom of each of the heat dissipation fins. The guide plate being connected to an adjacent heat dissipation fins. The heat dissipation fins are connected in series by the guide plate thereby defining a number of air channels. Each heat dissipation fin includes a through hole defined therein and aligned with each other. The heat spreader is disposed under the heat dissipation fins assembly and a through groove is formed in the heat spreader. A heat pipe passes through the through hole and the through groove. The heat sink has improved heat dissipation efficiency.

Abstract: A LED lamp tube which includes a hollow transparent tube, a LED lamp assembly disposed in the transparent tube, two conductive caps provided on both ends of the transparent tube respectively, and a circuit control unit. The circuit control unit includes a plurality of separated sub-portions. The respective sub-portions of the circuit control unit are distributed uniformly on the circuit board of the LED lamp assembly. Via the uniform arrangement of respective sub-portions of the circuit control unit, the heat within the LED lamp tube can be distributed uniformly, thereby lowering the temperature and facilitating the heat dissipation.

Abstract: A vapor chamber includes a plate and a wick structure. The plate is provided therein with a working fluid, and the plate has a heated end and a condensed end. The wick structure includes a first wick portion adhered to be opposite to the heated end, a second wick portion overlapping on the first wick portion, and a third wick portion adhered on the rest portion of a chamber. The aperture diameter of the first wick portion is larger than that of the second wick portion, or the aperture density of the first wick portion is smaller than that of the second wick portion. The amount of working fluid attached to the second wick portion is smaller than that of the first wick portion. After heating, the working fluid attached to the second wick portion is vaporized more quickly.

Abstract: A method of flatting evaporating section of a heat pipe embedded in a heat dissipation device includes the following steps: (a) providing at least a heat pipe and a base of the heat dissipation device to be thermally connected with the heat pipe, the base defining at least a groove for embedding the heat pipe therein; (b) positioning an evaporating section of the heat pipe on the groove of the base; (c) pressing the evaporating section of the heat pipe to embed the evaporating section into the groove of the base with a partial uneven surface of the evaporating section protruding out of the base; (d) flatting the protruded uneven surface of the evaporating section by polishing.

Abstract: A light emitting diode (LED) lamp tube heat dissipating structure is capable of dissipating heat in a tube quickly to improve the heat dissipating efficiency. A circuit board with a light radiating surface and a heat dissipating surface is contained in the tube, and the light radiating surface of the circuit board is electrically connected to LED lamps. Two conductive bushings are sheathed onto both ends of the tube and electrically connected with the circuit board, and at least one heat dissipating hole is disposed separately on both distal surfaces of the tube that covers the heat dissipating surface of the circuit board, such that external air is entered into the tube from the heat dissipating hole on a distal surface of the tube and dispersed from the heat dissipating hole on another distal surface of the tube for dissipating the heat in the tube.

Abstract: A heat-dissipating device having an air-guiding structure includes a heat-conducting seat, a fin assembly, at least one heat pipe for serially connecting to the fin assembly and the heat-conducting seat, and a fan assembly unit. The fin assembly is positioned above the heat-conducting seat and formed by arranging a plurality of heat-dissipating fins at intervals. As a result, airflow paths are formed between each heat-dissipating fin. The fan assembly unit is laterally provided at one side of the fin assembly. A space for lateral flow is formed between the heat-conducting seat and the fin assembly. The other side of the fin assembly is provided with an air-guiding member. The air-guiding member has a guiding space for laterally communicating with the space. The air blown by the fan assembly unit can pass through the space and is received by the air-guiding member. Then, the air flow is guided to the portions to be heat-dissipated by the air-guiding member.

Abstract: A LED lamp tube which includes a hollow transparent tube, a LED lamp assembly disposed in the transparent tube, two conductive caps provided on both ends of the transparent tube respectively, and a circuit control unit. The circuit control unit includes a plurality of separated sub-portions. The respective sub-portions of the circuit control unit are distributed uniformly on the circuit board of the LED lamp assembly. Via the uniform arrangement of respective sub-portions of the circuit control unit, the heat within the LED lamp tube can be distributed uniformly, thereby lowering the temperature and facilitating the heat dissipation.

Abstract: A light emitting diode (LED) lamp tube heat dissipating structure is capable of dissipating heat in a tube quickly to improve the heat dissipating efficiency. A circuit board with a light radiating surface and a heat dissipating surface is contained in the tube, and the light radiating surface of the circuit board is electrically connected to LED lamps. Two conductive bushings are sheathed onto both ends of the tube and electrically connected with the circuit board, and at least one heat dissipating hole is disposed separately on both distal surfaces of the tube that covers the heat dissipating surface of the circuit board, such that external air is entered into the tube from the heat dissipating hole on a distal surface of the tube and dispersed from the heat dissipating hole on another distal surface of the tube for dissipating the heat in the tube.

Abstract: A vapor chamber includes a plate and a wick structure. The plate is provided therein with a working fluid, and the plate has a heated end and a condensed end. The wick structure comprises a first wick portion adhered to be opposite to the heated end, a second wick portion overlapping on the first wick portion, and a third wick portion adhered on the rest portion of a chamber. The aperture diameter of the first wick portion is larger than that of the second wick portion, or the aperture density of the first wick portion is smaller than that of the second wick portion. Therefore, the amount of working fluid attached to the second wick portion is smaller than of the first wick portion. As a result, after heated, the working fluid attached to the second wick portion will be vaporized more quickly, thereby increasing the efficiency of heat transfer and improving the heat-dissipating effect.

Abstract: A method of flatting evaporating section of a heat pipe embedded in a heat dissipation device includes the following steps: (a) providing at least a heat pipe and a base of the heat dissipation device to be thermally connected with the heat pipe, the base defining at least a groove for embedding the heat pipe therein; (b) positioning an evaporating section of the heat pipe on the groove of the base; (c) pressing the evaporating section of the heat pipe to embed the evaporating section into the groove of the base with a partial uneven surface of the evaporating section protruding out of the base; (d) flatting the protruded uneven surface of the evaporating section by polishing.

Abstract: An LED lamp with replaceable power supply includes a tubular body, a light module, a power supply, and two power connectors. The light module is disposed within the tubular body. The light module includes a circuit board and a plurality of LEDs. The LEDs are electrically coupled to the circuit board and are disposed on the bottom side of the circuit board. The power supply is replaceably disposed on the light module and is electrically coupled to the circuit board. The two power connectors are respectively coupled to the two ends of the tubular body and are electrically coupled to the power supply.

Abstract: A heat sink includes a heat dissipation fins assembly, a heat spreader, and a heat pipe. The heat dissipation fins assembly includes a plurality of heat dissipation fins. A guide plate extruding from a bottom of each of the heat dissipation fins. The guide plate being connected to an adjacent heat dissipation fins. The heat dissipation fins are connected in series by the guide plate thereby defining a number of air channels. Each heat dissipation fin includes a through hole defined therein and aligned with each other. The heat spreader is disposed under the heat dissipation fins assembly and a through groove is formed in the heat spreader. A heat pipe passes through the through hole and the through groove. The heat sink has improved heat dissipation efficiency.

Abstract: A juxtaposing structure for the heated ends of a plurality of heat pipes includes a plurality of heat pipes and a locking unit. Each heat pipe has a heated end. The surface of the heated end of each heat pipe has an upper plane and a lower plane facing to each other and sidewall faces formed between both sides of the two planes. Sidewall faces of any two adjacent heat pipes adjoin and abut against each other. The locking unit locks the heated end of each heat pipe to form into one body. With the combination of each lower plane, a heated surface having a larger area can be formed.

Abstract: A solar powered ventilation system using a blower of an air conditioner in an automobile is disclosed. The blower is driven by a solar generator mounted on a roof of the automobile. A relay is arranged between the solar generator and the blower for switching on/off. The relay is controlled by a controller. A thermosensor is connected to the controller for detecting inside temperature of the automobile. The controller controls the relay to switch on and controls the air conditioner into an external circulation mode when the automobile is choked and the inside temperature exceeds a threshold temperature.

Abstract: A high thermal conductivity thermal interface material compound includes 53% by weight of polyethylene glycol, 42% by weight of silicon carbide, and 5% by weight of lithium ions. The method of fabricating the thermal interface material includes the steps of: filling the above-described compound in a container and blending them to form aggregative compound by a blender; mixing the compound by a rolling machine to disperse the aggregative compound and filling the compound to another container; blending the compound and breaking the air bubble generated thereof, and pumping the air out of the container by a vacuum pump at the same time, to fabricate the high thermal conductivity thermal interface material compound without air bubbles.