Abstract: An electronic package is provided, in which a circuit structure is stacked on a carrier structure having a routing layer via support structures, where electronic elements are disposed on upper and lower sides of the circuit structure and the carrier structure, and the electronic elements and the support structures are encapsulated by a cladding layer, such that the electronic package can effectively increase the packaging density to meet the requirements of multi-functional end products.

Abstract: An electronic package is provided and includes at least one electronic element, at least one first conductive structure and a second conductive structure disposed on one side of a carrier structure with at least one circuit layer, and an encapsulation layer covering the electronic element, the first conductive structure and the second conductive structure, where the first conductive structure is exposed from the encapsulation layer to externally connect required elements according to functional requirements.

Abstract: An electronic package is provided with a plurality of electronic elements disposed on a carrier structure and a shielding structure located between two adjacent electronic elements, where the shielding structure is formed with at least one cavity and shielding members located on opposite sides of the cavity, such that the shielding members are arranged between the two electronic elements. Therefore, the electromagnetic signal will be reflected via the shielding members to prevent the two electronic elements from electromagnetically interfering with each other.

Abstract: A display module has a touch display area, a non-touch display area and a frame area surrounding them. The display module includes a cover plate, an ink layer, a touch display panel, a non-touch display panel and an optical matching layer. The ink layer is disposed on the cover plate and corresponds to the frame area. The touch display panel and the non-touch display panel are disposed on a side of the ink layer opposite to the cover plate and respectively correspond to the touch display area and the non-touch display area. The optical matching layer is disposed between the cover plate and one of the touch display panel and the non-touch display panel. A difference of average reflectance to external light between any two of the above areas is less than 1.5%, and a chromaticity difference between any two of the above areas is less than 1.5.

Abstract: An electronic package is provided, which includes a plurality of electronic components encapsulated by an encapsulation layer. A spacer is defined in the encapsulation layer and located between at least two adjacent electronic components of the plurality of electronic components, and a recess is formed in the spacer and used as a thermal insulation area. With the design of the thermal insulation area, the plurality of electronic components can be effectively thermally insulated from one another to prevent heat generated by one electronic component of high power from being conducted to another electronic component of low power that would thermally affect the operation of the low-power electronic component. A method for manufacturing the electronic package is also provided.

Abstract: An antenna module is provided with a plurality of antenna structures and a shielding structure arranged on a plate body, and the shielding structure is located between two adjacent antenna structures, where the shielding structure includes a concave portion formed on the plate body and a dielectric material formed between the concave portion and the antenna structure to generate different impedance characteristics, thereby improving the antenna isolation.

Abstract: An electronic package is provided, which includes a plurality of electronic components encapsulated by an encapsulation layer. A spacer is defined in the encapsulation layer and located between at least two adjacent electronic components of the plurality of electronic components, and a recess is formed in the spacer and used as a thermal insulation area. With the design of the thermal insulation area, the plurality of electronic components can be effectively thermally insulated from one another to prevent heat generated by one electronic component of high power from being conducted to another electronic component of low power that would thermally affect the operation of the low-power electronic component. A method for manufacturing the electronic package is also provided.

Abstract: An electronic package is formed by disposing an electronic element and a lead frame having a plurality of conductive posts on a carrier structure having an antenna function, and encapsulating the electronic element and the lead frame with an encapsulant. The encapsulant is defined with a first encapsulating portion and a second encapsulating portion lower than the first encapsulating portion. The electronic element is positioned in the first encapsulating portion, and the plurality of conductive posts are positioned in the second encapsulating portion. End surfaces of the plurality of conductive posts are exposed from a surface of the second encapsulating portion so as to be electrically connected to a connector.

Abstract: Provided is an electronic package, in which a conductive structure and an encapsulation layer covering the conductive structure are arranged on one side of a carrier structure having a circuit layer, and an electronic component is arranged on the other side of the carrier structure. The rigidity of the carrier structure is increased by the encapsulation layer, and problems such as warpage or wavy deformations caused by increasing the volume of the electronic package due to functional requirements can be eliminated.

Abstract: An electronic package is provided, including at least an electronic element and at least an antenna structure disposed on a carrier structure. The antenna structure includes a base portion configured with an antenna body and a plurality of support portions disposed on the base portion. As such, the base portion is disposed over the carrier structure through the support portions and a plurality of open areas are formed between the base portion and the carrier structure to serve as an air gap, thereby effectively improving the performance gain and efficiency of the antenna body.

Abstract: An electronic package is provided and uses a plurality of bonding wires as a shielding structure. The bonding wires are stitch bonded onto a carrier carrying electronic components, such that the problem of the shielding structure peeling off or falling off from the carrier can be avoided due to the fact that the bonding wires are not affected by temperature, humidity and other environmental factors.

Abstract: An electronic package is formed by disposing an electronic element and a lead frame having a plurality of conductive posts on a carrier structure having an antenna function, and encapsulating the electronic element and the lead frame with an encapsulant. The encapsulant is defined with a first encapsulating portion and a second encapsulating portion lower than the first encapsulating portion. The electronic element is positioned in the first encapsulating portion, and the plurality of conductive posts are positioned in the second encapsulating portion. End surfaces of the plurality of conductive posts are exposed from a surface of the second encapsulating portion so as to be electrically connected to a connector.

Abstract: An electronic package is provided, in which a carrier structure provided with electronic components is disposed onto an antenna structure, where a stepped portion is formed at an edge of the antenna structure, so that a shielding body is arranged along a surface of the stepped portion. Therefore, the shielding body only covers a part of the surface of the antenna structure to prevent the shielding body from interfering with operation of the antenna structure.

Abstract: An electronic package is provided and uses a plurality of bonding wires as a shielding structure. The bonding wires are stitch bonded onto a carrier carrying electronic components, such that the problem of the shielding structure peeling off or falling off from the carrier can be avoided due to the fact that the bonding wires are not affected by temperature, humidity and other environmental factors.

Abstract: An electronic package is provided, which includes a plurality of electronic components encapsulated by an encapsulation layer. A spacer is defined in the encapsulation layer and located between at least two adjacent electronic components of the plurality of electronic components, and a recess is formed in the spacer and used as a thermal insulation area. With the design of the thermal insulation area, the plurality of electronic components can be effectively thermally insulated from one another to prevent heat generated by one electronic component of high power from being conducted to another electronic component of low power that would thermally affect the operation of the low-power electronic component. A method for manufacturing the electronic package is also provided.

Abstract: An electronic package is provided, including at least an electronic element and at least an antenna structure disposed on a carrier structure. The antenna structure includes a base portion configured with an antenna body and a plurality of support portions disposed on the base portion. As such, the base portion is disposed over the carrier structure through the support portions and a plurality of open areas are formed between the base portion and the carrier structure to serve as an air gap, thereby effectively improving the performance gain and efficiency of the antenna body.

Abstract: An electronic package and a method for manufacturing the same are provided, where at least one substrate structure having a second antenna portion is disposed on a carrier structure having a first antenna portion, and then an antenna structure having a first antenna body and a second antenna body is stacked on the carrier structure by a plurality of supporting members to cover the first antenna portion and the second antenna portion, so that the first antenna body corresponds to the first antenna portion, and the second antenna body corresponds to the second antenna portion. The substrate structure is disposed on the carrier structure to generate 5G millimeter waves of different frequencies, such that the antenna structure can generate different antenna signals based on needs.

Abstract: An electronic package is formed by disposing an electronic element and a lead frame having a plurality of conductive posts on a carrier structure having an antenna function, and encapsulating the electronic element and the lead frame with an encapsulant. The encapsulant is defined with a first encapsulating portion and a second encapsulating portion lower than the first encapsulating portion. The electronic element is positioned in the first encapsulating portion, and the plurality of conductive posts are positioned in the second encapsulating portion. End surfaces of the plurality of conductive posts are exposed from a surface of the second encapsulating portion so as to be electrically connected to a connector.

Abstract: Provided is a packaging structure, which includes a carrier and an electronic component, an antenna module and a connector disposed on the carrier, and a packaging layer encapsulating the electronic component and the connector. A portion of a surface of the connector is exposed from the packaging layer so as to facilitate the electrical connection with a motherboard of an electronic product. A method for fabricating the packaging structure is also provided.

Abstract: An electronic package is formed by disposing an electronic element and a lead frame having a plurality of conductive posts on a carrier structure having an antenna function, and encapsulating the electronic element and the lead frame with an encapsulant. The encapsulant is defined with a first encapsulating portion and a second encapsulating portion lower than the first encapsulating portion. The electronic element is positioned in the first encapsulating portion, and the plurality of conductive posts are positioned in the second encapsulating portion. End surfaces of the plurality of conductive posts are exposed from a surface of the second encapsulating portion so as to be electrically connected to a connector.