Patents by Inventor Wen-Jung Tsai
Wen-Jung Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20250132273Abstract: An electronic package is formed by disposing an electronic element and a lead frame having a plurality of conductive posts on a carrier structure having an antenna function, and encapsulating the electronic element and the lead frame with an encapsulant. The encapsulant is defined with a first encapsulating portion and a second encapsulating portion lower than the first encapsulating portion. The electronic element is positioned in the first encapsulating portion, and the plurality of conductive posts are positioned in the second encapsulating portion. End surfaces of the plurality of conductive posts are exposed from a surface of the second encapsulating portion so as to be electrically connected to a connector.Type: ApplicationFiled: January 2, 2025Publication date: April 24, 2025Inventors: Chih-Hsien Chiu, Wen-Jung Tsai
-
Publication number: 20250125237Abstract: Provided is an electronic package, in which a conductive structure and an encapsulation layer covering the conductive structure are arranged on one side of a carrier structure having a circuit layer, and an electronic component is arranged on the other side of the carrier structure. The rigidity of the carrier structure is increased by the encapsulation layer, and problems such as warpage or wavy deformations caused by increasing the volume of the electronic package due to functional requirements can be eliminated.Type: ApplicationFiled: December 20, 2024Publication date: April 17, 2025Inventors: Chih-Hsien Chiu, Ko-Wei Chang, Wen-Jung Tsai, Che-Wei Yu, Chia-Yang Chen
-
Publication number: 20250096153Abstract: An electronic package and a manufacturing method thereof are provided, in which an electronic component is disposed on a substrate and covered with an encapsulation layer, and a frame body is embedded in the encapsulation layer and protrudes from the substrate. Therefore, the frame body can disperse thermal stress, thereby preventing warping from occurring to the electronic package.Type: ApplicationFiled: January 30, 2024Publication date: March 20, 2025Inventors: Chih-Hsien CHIU, Wen-Jung TSAI, Chien-Cheng LIN, Chun-Chong CHIEN, Shih-Shiung KUO
-
Patent number: 12224255Abstract: An electronic package is formed by disposing an electronic element and a lead frame having a plurality of conductive posts on a carrier structure having an antenna function, and encapsulating the electronic element and the lead frame with an encapsulant. The encapsulant is defined with a first encapsulating portion and a second encapsulating portion lower than the first encapsulating portion. The electronic element is positioned in the first encapsulating portion, and the plurality of conductive posts are positioned in the second encapsulating portion. End surfaces of the plurality of conductive posts are exposed from a surface of the second encapsulating portion so as to be electrically connected to a connector.Type: GrantFiled: March 18, 2024Date of Patent: February 11, 2025Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Chih-Hsien Chiu, Wen-Jung Tsai
-
Publication number: 20250038061Abstract: An electronic package and a manufacturing method thereof are provided, in which an electronic component and a heat dissipation structure having an opening are arranged on a carrier structure, a heat sink is arranged in the opening and bonded to the electronic component, and the electronic component, the heat dissipation structure and the heat sink are covered with an encapsulation layer, such that the heat sink can be arranged according to a heat source of a specific part of the electronic component so as to effectively dissipate heat.Type: ApplicationFiled: January 12, 2024Publication date: January 30, 2025Inventors: Chih-Hsien CHIU, Wen-Jung TSAI, Chia-Yang CHEN, Chien-Ming CHANG, Po-Hsin TSAI
-
Patent number: 12211776Abstract: Provided is an electronic package, in which a conductive structure and an encapsulation layer covering the conductive structure are arranged on one side of a carrier structure having a circuit layer, and an electronic component is arranged on the other side of the carrier structure. The rigidity of the carrier structure is increased by the encapsulation layer, and problems such as warpage or wavy deformations caused by increasing the volume of the electronic package due to functional requirements can be eliminated.Type: GrantFiled: January 13, 2022Date of Patent: January 28, 2025Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Chih-Hsien Chiu, Ko-Wei Chang, Wen-Jung Tsai, Che-Wei Yu, Chia-Yang Chen
-
Publication number: 20250022809Abstract: An electronic package and a manufacturing method thereof are provided, in which an electronic element is disposed on a carrier structure, then a cladding layer is formed to cover the electronic element, and a shielding layer is formed on the cladding layer to cover the electronic element. The cladding layer is bonded to a shielding structure, and the shielding structure is located between the shielding layer and the electronic element, so as to prevent the electronic element from being subjected to external electromagnetic interference via multiple shielding mechanisms of the shielding structure and the shielding layer.Type: ApplicationFiled: October 12, 2023Publication date: January 16, 2025Inventors: Wen-Jung TSAI, Chih-Hsien CHIU, Chien-Cheng LIN, Shao-Tzu TANG, Ko-Wei CHANG
-
Publication number: 20240421023Abstract: An electronic package is provided, in which an electronic element and a heat dissipation member are disposed on different areas of a carrier structure having a heat dissipation layer, where the electronic element is covered by an encapsulation layer, and the heat dissipation member is thermally connected to the electronic element via the heat dissipation layer, so that the heat energy generated by the electronic element can be prevented from conducting into the encapsulation layer during the heat dissipation process, such that the problem of overheating around the electronic element can be avoided.Type: ApplicationFiled: September 12, 2023Publication date: December 19, 2024Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Chih-Hsien CHIU, Wen-Jung TSAI, Chin-Chiang HE, Wan-Chin CHUNG, Che-Wei YU
-
Publication number: 20240364001Abstract: An antenna module is provided with a plurality of antenna structures and a shielding structure arranged on a plate body, and the shielding structure is located between two adjacent antenna structures, where the shielding structure includes a concave portion formed on the plate body and a dielectric material formed between the concave portion and the antenna structure to generate different impedance characteristics, thereby improving the antenna isolation.Type: ApplicationFiled: July 10, 2024Publication date: October 31, 2024Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Shao-Tzu TANG, Chih-Hsien CHIU, Wen-Jung TSAI, Ko-Wei CHANG, Chia-Chu LAI
-
Publication number: 20240321784Abstract: An electronic package is formed by disposing an electronic element and a lead frame having a plurality of conductive posts on a carrier structure having an antenna function, and encapsulating the electronic element and the lead frame with an encapsulant. The encapsulant is defined with a first encapsulating portion and a second encapsulating portion lower than the first encapsulating portion. The electronic element is positioned in the first encapsulating portion, and the plurality of conductive posts are positioned in the second encapsulating portion. End surfaces of the plurality of conductive posts are exposed from a surface of the second encapsulating portion so as to be electrically connected to a connector.Type: ApplicationFiled: March 18, 2024Publication date: September 26, 2024Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Chih-Hsien Chiu, Wen-Jung Tsai
-
Publication number: 20240321769Abstract: An electronic package and a manufacturing method thereof are provided, in which a plurality of electronic components and a shielding part are disposed on a carrier structure, the shielding part is located between two of the electronic components, and the plurality of electronic components and the shielding part are covered by an encapsulating layer, where a surface of the shielding part has a protruding portion. Therefore, a periphery surface of the shielding part is a non-straight surface, so as to prevent the reflection of electromagnetic waves in the encapsulating layer from interfering with the signal transmission of the electronic components.Type: ApplicationFiled: July 12, 2023Publication date: September 26, 2024Inventors: Chih-Hsien CHIU, Wen-Jung TSAI, Wan-Chin CHUNG, Chih-Chiang HE, Chun-Chong CHIEN
-
Patent number: 12100641Abstract: An electronic package is provided, which includes a plurality of electronic components encapsulated by an encapsulation layer. A spacer is defined in the encapsulation layer and located between at least two adjacent electronic components of the plurality of electronic components, and a recess is formed in the spacer and used as a thermal insulation area. With the design of the thermal insulation area, the plurality of electronic components can be effectively thermally insulated from one another to prevent heat generated by one electronic component of high power from being conducted to another electronic component of low power that would thermally affect the operation of the low-power electronic component. A method for manufacturing the electronic package is also provided.Type: GrantFiled: July 18, 2023Date of Patent: September 24, 2024Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Chih-Hsien Chiu, Siang-Yu Lin, Wen-Jung Tsai, Chia-Yang Chen, Chien-Cheng Lin
-
Publication number: 20240297126Abstract: An electronic package is provided in which an electronic component is arranged on a wiring structure and covered with a packaging layer, and a frame body that does not contact the wiring structure is embedded in the packaging layer. Therefore, thermal stress is dispersed through the frame body to avoid warpage of the electronic package, so as to facilitate the arrangement of other electronic components around the electronic component.Type: ApplicationFiled: May 10, 2024Publication date: September 5, 2024Inventors: Chih-Hsien CHIU, Wen-Jung TSAI, Chien-Cheng LIN, Ko-Wei CHANG, Yu-Wei YEH, Shun-Yu CHIEN, Chia-Yang CHEN
-
Publication number: 20240290728Abstract: An electronic package and a manufacturing method thereof are provided, in which a cover is disposed on a carrier structure having an electronic element, and the electronic element is covered by the cover. A magnetic conductive member is arranged between the cover and the electronic element, and an air gap is formed between the magnetic conductive member and the cover to enhance the shielding effect of the electronic package.Type: ApplicationFiled: June 14, 2023Publication date: August 29, 2024Inventors: Wen-Jung TSAI, Chih-Hsien CHIU, Chien-Cheng LIN, Ming-Fan TSAI, Cheng-You JENG, Hui-Jing CHANG
-
Patent number: 12068535Abstract: An antenna module is provided with a plurality of antenna structures and a shielding structure arranged on a plate body, and the shielding structure is located between two adjacent antenna structures, where the shielding structure includes a concave portion formed on the plate body and a dielectric material formed between the concave portion and the antenna structure to generate different impedance characteristics, thereby improving the antenna isolation.Type: GrantFiled: May 19, 2022Date of Patent: August 20, 2024Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Shao-Tzu Tang, Chih-Hsien Chiu, Wen-Jung Tsai, Ko-Wei Chang, Chia-Chu Lai
-
Patent number: 12057409Abstract: An electronic package and a manufacturing method of the electronic package are provided, in which an electronic component is arranged on a wiring structure and covered with a packaging layer, and a frame body that does not contact the wiring structure nor cover the electronic component is embedded in the packaging layer.Type: GrantFiled: January 10, 2022Date of Patent: August 6, 2024Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Chih-Hsien Chiu, Wen-Jung Tsai, Chien-Cheng Lin, Ko-Wei Chang, Yu-Wei Yeh, Shun-Yu Chien, Chia-Yang Chen
-
Publication number: 20240213134Abstract: An electronic package is provided, in which an electronic element is disposed on a carrier with a circuit layer, and an encapsulation layer encapsulating the electronic element has an opening exposing the circuit layer, where a metal structure can be contact-bonded on a wall surface of the opening, and a conductive element is formed on the metal structure and electrically connected to the circuit layer. Therefore, no gap is formed between the conductive element and the wall surface of the opening, such that the DC resistance of the conductive element can be reduced.Type: ApplicationFiled: April 28, 2023Publication date: June 27, 2024Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Chih-Hsien CHIU, Wen-Jung TSAI, Wei-Hao LI, Chih-Yi LIAO, Cheng-Wei HSU, Chih-Yuan TSAI, Ko-Wei CHANG, Guo-Yu WU
-
Publication number: 20240203900Abstract: An electronic package is provided, in which a first shielding part bonded with a first electronic component are disposed on a carrier structure, and the first electronic component and the first shielding part are covered by an encapsulation layer. The first shielding part includes a semiconductor block and a magnetized layer formed on the semiconductor block, and the first shielding part is bonded to the first electronic component, such that the semiconductor block separates the magnetized layer and the first electronic component. Therefore, a distance defined by a thickness of a single semiconductor block is maintained between the magnetized layer and the first electronic component, thereby preventing a magnetic field operation of the first electronic component from being interfered by a magnetic field of the magnetized layer.Type: ApplicationFiled: April 11, 2023Publication date: June 20, 2024Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Chih-Hsien CHIU, Wen-Jung TSAI, Ko-Wei CHANG, Jyun-Hao YANG, Chia-Yang CHEN
-
Publication number: 20240170415Abstract: An electronic package and a method thereof are provided, in which an electronic component, conductive structures and conductive components are disposed on one side of a carrier and electrically connected to the carrier. The electronic component, the conductive structures and the conductive components are encapsulated by an encapsulation layer. A shielding layer is formed on the encapsulation layer to cover the electronic component, where the shielding layer is electrically connected to the conductive structures and free from being electrically connected to the conductive components. A shielding structure is formed to cover the other side of the carrier.Type: ApplicationFiled: April 11, 2023Publication date: May 23, 2024Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Chih-Hsien CHIU, Wen-Jung TSAI, Ko-Wei CHANG, Chia-Yang CHEN
-
Publication number: 20240170355Abstract: An electronic package is provided, in which an electronic element is disposed on a carrier structure, and an interposer is stacked on the electronic element. Further, a wire is connected to the interposer and grounds the carrier structure, such that the wire and the interposer surround the electronic element. Therefore, the wire can be used as a shielding element when the electronic package is in operation to prevent the electronic element from being subjected to external electromagnetic interference.Type: ApplicationFiled: February 24, 2023Publication date: May 23, 2024Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Chih-Hsien CHIU, Wen-Jung TSAI, Ko-Wei CHANG, Chien-Cheng LIN