Patents by Inventor Wen-Jung Yang

Wen-Jung Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11937415
    Abstract: A method of forming a semiconductor device includes providing a substrate including a circuit region and a well strap region, forming a mandrel extending from the circuit region to the well strap region, depositing mandrel spacers on sidewalls of the mandrel, removing the mandrel in the circuit region, while the mandrel in the well strap region remains intact, patterning the substrate with the mandrel spacers in the circuit region and the mandrel in the well strap region as an etch mask, thereby forming at least a first fin in the circuit region and a second fin in the well strap region, and epitaxially growing a first epitaxial feature over the first fin in the circuit region and a second epitaxial feature over the second fin in the well strap region. A width of the second fin is larger than a width of the first fin.
    Type: Grant
    Filed: July 27, 2022
    Date of Patent: March 19, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chih-Chuan Yang, Kuo-Hsiu Hsu, Feng-Ming Chang, Wen-Chun Keng, Lien Jung Hung
  • Publication number: 20050215910
    Abstract: A remote control for controlling an electronic device includes a housing, a remote control module installed inside the housing for controlling the electronic device according to an input signal, and a body temperature measuring module installed inside the housing, for sensing body temperature by infrared rays.
    Type: Application
    Filed: March 23, 2004
    Publication date: September 29, 2005
    Inventors: Wen-Jung Yang, Chang-Szu Tsai
  • Publication number: 20050098427
    Abstract: The present disclosure provides a system and method for providing improved film uniformity from an ion metal plasma source. The system includes a deposition chamber and a coil. The coil is comprised of a first metal and includes opposite terminal ends disposed within the deposition chamber. At least one of the opposite terminal ends of the coil is angled less than ninety degrees.
    Type: Application
    Filed: November 11, 2003
    Publication date: May 12, 2005
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Jui-Mu Cho, Wen-Cheng Yang, Wen-Jung Yang, Y-Chih Lo, Tay-Lang Huang, Te-Hung Hsieh