Patents by Inventor Wen-Kai Shao

Wen-Kai Shao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LIGHT EMITTING DIODE PACKAGE
    Publication number: 20150091034
    Abstract: A light-emitting diode (LED) package structure includes a lead frame, a LED chip, a package body, N opaque spacer and N+1 encapsulating glues. The LED chip is disposed on the lead frame; the package body covers the lead frame and exposes the LED chip. The package body has an accommodation space, divided by the N opaque spacers disposed on the LED chip into N+1 chambers. The N+1 encapsulating glues are filled into the N+1 chambers, where N is a natural number.
    Type: Application
    Filed: July 21, 2014
    Publication date: April 2, 2015
    Inventors: Che-Ming HSU, Wen-Kai SHAO, Liang-Ta LIN
  • Light emitting diode package
    Patent number: 8981415
    Abstract: A light-emitting diode (LED) package structure includes a lead frame, a LED chip, a package body, N opaque spacer and N+1 encapsulating glues. The LED chip is disposed on the lead frame; the package body covers the lead frame and exposes the LED chip. The package body has an accommodation space, divided by the N opaque spacers disposed on the LED chip into N+1 chambers. The N+1 encapsulating glues are filled into the N+1 chambers, where N is a natural number.
    Type: Grant
    Filed: July 21, 2014
    Date of Patent: March 17, 2015
    Assignee: Lextar Electronics Corporation
    Inventors: Che-Ming Hsu, Wen-Kai Shao, Liang-Ta Lin
  • LIGHT-EMITTING DIODE PACKAGE STRUCTURE AND LIGHT-EMITTING DIODE LIGHT BULB
    Publication number: 20150029723
    Abstract: The disclosure provides a light-emitting diode (LED) package structure, including: a lead frame; at least two light-emitting diode chips having different light-emitting wavelengths disposed on the lead frame; an encapsulant disposed over the lead frame and covering the light-emitting diode chips, wherein the encapsulant has a first concave portion; and an optical glue disposed in the first concave portion, wherein the optical glue has a plurality of scattering particles to uniformly mix the lights of different wavelengths emitted by the light-emitting diode chips.
    Type: Application
    Filed: April 11, 2014
    Publication date: January 29, 2015
    Applicant: LEXTAR ELECTRONICS CORPORATION
    Inventors: Shih-Ju Lo, Cheng-Ping Chang, Hui-Kai Hsu, I-Chun Lee, Wen-Kai Shao