Patents by Inventor Wen-Ken Huang

Wen-Ken Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Image sensor package with trench insulator and fabrication method thereof
    Patent number: 9190362
    Abstract: The invention provides a chip package and a fabrication method thereof. In one embodiment, the chip package includes: a substrate having a semiconductor device and a conductive pad thereon; an insulator ring filling a trench formed in the substrate, wherein the insulator ring surrounds an intermediate layer below the conductive pad; and a conductive layer disposed below a backside of the substrate and electrically connected to the conductive pad.
    Type: Grant
    Filed: July 8, 2014
    Date of Patent: November 17, 2015
    Assignee: XINTEC INC.
    Inventors: Wen-Cheng Chien, Wen-Ken Huang, Chien-Hung Liu, Joey Lai
  • IMAGE SENSOR PACKAGE WITH TRENCH INSULATOR AND FABRICATION METHOD THEREOF
    Publication number: 20140319670
    Abstract: The invention provides a chip package and a fabrication method thereof. In one embodiment, the chip package includes: a substrate having a semiconductor device and a conductive pad thereon; an insulator ring filling a trench formed in the substrate, wherein the insulator ring surrounds an intermediate layer below the conductive pad; and a conductive layer disposed below a backside of the substrate and electrically connected to the conductive pad.
    Type: Application
    Filed: July 8, 2014
    Publication date: October 30, 2014
    Inventors: Wen-Cheng CHIEN, Wen-Ken HUANG, Chien-Hung LIU, Joey LAI
  • Image sensor package with trench insulator and fabrication method thereof
    Patent number: 8772919
    Abstract: The invention provides a chip package and a fabrication method thereof. In one embodiment, the chip package includes: a substrate having a semiconductor device and a conductive pad thereon; an insulator ring filling a trench formed in the substrate, wherein the insulator ring surrounds an intermediate layer below the conductive pad; and a conductive layer disposed below a backside of the substrate and electrically connected to the conductive pad.
    Type: Grant
    Filed: April 2, 2010
    Date of Patent: July 8, 2014
    Inventors: Wen-Cheng Chien, Wen-Ken Huang, Chien-Hung Liu, Joey Lai
  • IMAGE SENSOR PACKAGE WITH TRENCH INSULATOR AND FABRICATION METHOD THEREOF
    Publication number: 20110193210
    Abstract: The invention provides a chip package and a fabrication method thereof. In one embodiment, the chip package includes: a substrate having a semiconductor device and a conductive pad thereon; an insulator ring filling a trench formed in the substrate, wherein the insulator ring surrounds an intermediate layer below the conductive pad; and a conductive layer disposed below a backside of the substrate and electrically connected to the conductive pad.
    Type: Application
    Filed: April 2, 2010
    Publication date: August 11, 2011
    Inventors: Wen-Cheng CHIEN, Wen-Ken HUANG, Chien-Hung LIU, Joey LAI