Abstract: Various embodiments of the present disclosure are directed towards a shared frontside pad/bridge layout for a three-dimensional (3D) integrated circuit (IC), as well as the 3D IC and a method for forming the 3D IC. A second IC die underlies the first IC die, and a third IC die underlies the second IC die. A first-die backside pad, a second-die backside pad, and a third die backside pad are in a row extending in a dimension and overlie the first, second, and third IC dies. Further, the first-die, second-die, and third-die backside pads are electrically coupled respectively to individual semiconductor devices of the first, second, and third IC dies. The second and third IC dies include individual pad/bridge structures at top metal (TM) layers of corresponding interconnect structures. The pad/bridge structures share the shared frontside pad/bridge layout and provide lateral routing in the dimension for the aforementioned electrical coupling.

Abstract: A method for fabricating an interposer is provided, which includes the steps of: providing a substrate body having a chip mounting side and an opposite external connection side and a plurality of conductive through holes communicating the chip mounting side and the external connection side, wherein the chip mounting side of the substrate body is covered with a protection layer; performing a singulation process on the external connection side of the substrate body; bonding the substrate body to a carrier via the external connection side thereof; removing the protection layer; and removing the carrier to form a plurality of interposers, thereby simplifying the fabrication process and improving the product yield.

Abstract: A method for fabricating an interposer is provided, which includes the steps of: providing a substrate body having a chip mounting side and an opposite external connection side and a plurality of conductive through holes communicating the chip mounting side and the external connection side, wherein the chip mounting side of the substrate body is covered with a protection layer; performing a singulation process on the external connection side of the substrate body; bonding the substrate body to a carrier via the external connection side thereof; removing the protection layer; and removing the carrier to form a plurality of interposers, thereby simplifying the fabrication process and improving the product yield.

Abstract: A heat-pipe engine structure applicable to heat-exchange system. The heat-pipe engine structure includes a metal mesh laminate composed of more than two metal meshes which are tightly laminated with each other to form numerous meshes several times the unlaminated meshes of any original metal mesh. An upper metal film and a lower metal film are respectively bonded to upper and lower faces of the metal mesh laminate. The peripheries of the metal films are sealed to form a housing enclosing the metal mesh laminate. The meshes of the metal mesh laminate form a first nature vapor chamber. A liquid ingress and a vapor egress are formed on the periphery of the housing in different positions for externally connecting with a circulating loop to form a loop heat-pipe for one-way circulation of incoming liquid and outgoing vapor.

Abstract: The invention is a flow guiding structure that is applied in a heat transfer apparatus which has no any driving power and it is a structure of subsystem to guide the flow direction of a fluid and it is also belonged to a passive and brought along system that can not be applied independently. The structure is comprised of at least one metal network and a working fluid. Through the symmetrical inlet and outlet for the flow paths of the fluid, the structure is connected and applied to the main system that is so-called a heat exchanging system, such as: any refrigeration, air-conditioning system, and looping heat pipe referred in the invention.

Abstract: A MICRO-LOOP HEAT PIPE, under the condition of no additional acting-force, removes the waste heat from the devices needed heat-dissipation to the well heat-dissipating circumstance by flexible contact. The MICRO-LOOP HEAT PIPE comprising: at least a flexible metal film, which forms a closed space in which fluid may circulate, and has a heat-absorbing zone and a heat-dissipating zone that both are connected by flow path; at least a wick structure by metal net, which is a flexible structure arranged in the heat-absorbing zone, and in which the transferred-into heat may be conducted uniformly; and a working fluid, may be filled into the flexible metal film, absorbs heat in the heat-absorbing zone, vaporizes into gas state, and generates a pressure source that may make the working fluid circulate inside the flexible metal film; the gasified working fluid may be cooled (or heat-dissipated) in the heat-dissipating zone and changed back to liquid state.