Abstract: An improved structure of case body includes receiving containers for receiving wheel sets to stow therein. When the case is moved, especially when the case is pushed or pulled, the wheel sets stowed in the receiving containers can be selectively extended outside the case to allow 360 degree rotation with the aid of wheels of the wheel sets and when a user wishes to place the case for the purposes of for example shipping or transportation of baggage, the wheel sets mounted to the bottom of the case can be first retracted back into and stowed in the receiving containers of the case to avoid undesired impact of the wheel sets during the transportation of the case to thereby extend the service life thereof and also to reduce the amount of space needed between adjacent case.

Abstract: A heat dissipation structure includes a base, a light emission module, a heat dissipation module, and a control circuit module. The base has two ends respectively forming an electrical connector section and an open cavity. The light emission module includes a substrate mounted in the open cavity and a plurality of light emission elements mounted on the substrate. The heat dissipation module includes a plurality of heat dissipation plates stacked on the substrate to form a concentrated heat dissipation zone. Each heat dissipation plate has a circumference forming a plurality of included side wing sections. The side wing sections of different heat dissipation plates have different inclination angle and form an expanded heat dissipation zone. The control circuit module is received in the base and is electrically connected to the substrate and the electrical connector section.

Abstract: A heat dissipation structure of light-emitting diode includes a package housing, which forms a recessed cavity. A heat dissipation frame is mounted inside the recessed cavity of the package housing to have a portion of the heat dissipation frame located inside the recessed cavity of the package housing and opposite ends of the heat dissipation frame being bent downward to overlap a bottom surface of the heat dissipation frame. A plurality of light-emitting chips is set on the heat dissipation frame located inside the recessed cavity. A plurality of conductive pins is arranged in the recessed cavity of the package housing and extends outside opposite ends of the package housing through opposite end walls of the recessed cavity. A plurality of conductive wires respectively connects between the light-emitting chips and the conductive pins inside the recessed cavity to thereby form the heat dissipation structure of light-emitting diode.

Abstract: A light-emitting diode (LED) heat dissipation structure is provided, including a package body, a heat dissipation frame, at least one light emitting die, a plurality of conductive leads, and a plurality of conductive wires. The package body forms a cavity and has an outside surface. The heat dissipation frame is coupled to the package body and has a portion disposed inside the cavity. The end section of the heat dissipation frame that projects beyond the lateral segment of the outside surface is bent to extend along the outside surface. The light emitting die is accommodated in the cavity and set on the heat dissipation frame. The conductive leads are disposed in the cavity and each extends through a side wall of the cavity to project beyond a lateral segment of the outside surface. The conductive wires connect the light emitting die and the conductive leads inside the cavity.

Abstract: A lateral-type light-emitting diode and a method of manufacture thereof are disclosed. The manufacture method comprises the steps of: (1) forming an outer shell on a substrate on which two metal electrodes are mounted; (2) forming chips and bonding wires on the inside of the outer shell; (3) injecting a transparent resin into the outer shell for forming a light-emitting diode package; and (4) finishing the manufacture process by cutting apart the center region of the light-emitting diode package between these two chips. The outer shell of the obtained lateral-type light-emitting diode is open on one side so the thickness of the lateral-type light-emitting diode can be reduced.

Abstract: A high-power light-emitting diode comprises a pillar, at least one light-emitting chip, a substrate, at least two conducting wires, and a transparent layer. The pillar has an integrally cast structure. The pillar has a block on which a recessed cup is formed. In addition, a screw bolt is extended from a lower portion of the block. The light-emitting chip is mounted on the inside of the recessed cup formed on the block of the pillar. Two conducting layers are mounted on the substrate. The substrate is located to encircle the recessed cup on the block. The light-emitting chip is connected with the substrate via these two conducting wires. The recessed cup, the light-emitting chip, and the substrate are covered with the transparent layer. Accordingly, the heat energy can be dissipated quickly and the product can be assembled easily.

Abstract: A multidirectional light-emitting diode comprises a frame, at least one light-emitting chip, at least two connection wires, and a transparent material for covering above-mentioned components, wherein the light-emitting chip is connected with the frame via the connection wires, and the light-emitting chip, the connection wires, and partial portion of the frame are covered by the transparent material so as to suspend the light-emitting chip for generating 360-degree omni-directional light beams.

Abstract: This specification discloses a package structure of surface mounting light emitting diodes (LEDs) and the method of manufacturing the same. The package of the surface mounting LEDs is achieved by providing a substrate having a cavity and a plurality of pads. The plurality of pads are isolated from each other. The cavity is formed from the upper surface of the substrate downward to the bottom so that the LED chips are wholly inlaid in the cavity. Bonding wires couple the LED chips and the plurality of pads. A cope is filled in the cavity and covers the surface of the substrate for protecting the LED chips sand the bonding wire. In comparison with prior arts, the thickness of the structure disclosed in the invention is reduced by inlaying the LED chips in the cavity. Furthermore, the light emits from multiple surface of the LED.