Patents by Inventor Wen-Kuo Tsai

Wen-Kuo Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240363318
    Abstract: A fabrication system for fabricating IC is provided. A processing tool includes a RF sensor. The RF sensor wirelessly detects intensity of a RF signal. A computation device extracts statistical characteristics with a sampling rate. When the detected intensity of the RF signal exceeds a threshold value or a threshold range, a fault detection and classification (FDC) system notifies the processing tool to adjust the RF signal or stop tool to check parts damage.
    Type: Application
    Filed: July 8, 2024
    Publication date: October 31, 2024
    Inventors: Wun-Kai TSAI, Wen-Che LIANG, Chao-Keng LI, Zheng-Jie XU, Chih-Kuo CHANG, Sing-Tsung LI, Feng-Kuang WU, Hsu-Shui LIU
  • Patent number: 12057301
    Abstract: A fabrication system for fabricating IC is provided. A processing tool includes at least one electrode and a RF sensor. The electrode is configured to receive a radio frequency (RF) signal from an RF signal generator during first and second semiconductor manufacturing processes. The RF sensor wirelessly detects intensity of the RF signal. A computation device extracts statistical characteristics with a sampling rate based on the detected intensity of the RF signal. A fault detection and classification (FDC) system includes a processor. The processor is configured to determine whether or not the detected intensity of the RF signal exceeds a threshold value or a threshold range according to the extracted statistical characteristics. When the detected intensity of the RF signal exceeds the threshold value or the threshold range, the processor notifies the processing tool to adjust the RF signal or stop tool to check parts damage.
    Type: Grant
    Filed: April 18, 2023
    Date of Patent: August 6, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Wun-Kai Tsai, Wen-Che Liang, Chao-Keng Li, Zheng-Jie Xu, Chih-Kuo Chang, Sing-Tsung Li, Feng-Kuang Wu, Hsu-Shui Liu
  • Publication number: 20100038810
    Abstract: A method for making a foamed sole includes the steps of: a) preparing a mold having a lower mold part, an upper mold part, and an intermediate plate removably disposed between the lower and upper mold parts, the lower mold part having a lower mold cavity, the upper mold part having an upper mold cavity; b) molding a first molding material in one of the upper mold cavity and the lower mold cavity to form a first sole portion while the intermediate plate is placed between the upper and lower mold parts; c) removing the intermediate plate and covering the lower mold part with the upper mold part; and d) molding a second molding material in the other of the upper mold part and the lower mold part to form a second sole portion in the presence of the first sole portion.
    Type: Application
    Filed: April 21, 2009
    Publication date: February 18, 2010
    Inventor: Wen-Kuo Tsai
  • Publication number: 20100032865
    Abstract: A method for making a foamed sole includes the steps of: a) preparing a mold having a lower mold part and an upper mold part removably covering the lower mold part, the lower mold part having a top surface and a lower mold cavity recessed from the top surface, the upper mold part having a bottom surface to contact the top surface of the lower mold part, and an upper mold cavity recessed from the bottom surface; b) filling and molding a first molding material in the upper mold part to form a first sole portion; and c) filling and molding a second molding material in the lower mold part to form a second sole portion having a hardness smaller than that of the first sole portion and bonding directly with the first sole portion.
    Type: Application
    Filed: April 3, 2009
    Publication date: February 11, 2010
    Inventor: Wen-Kuo Tsai