Patents by Inventor Wen-Li A. Chen

Wen-Li A. Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230077991
    Abstract: A data processing circuit and a fault mitigating method are provided. The method is adapted for a memory having at least one fault bit. The memory provides a block for data storage. A difference between an output of a value of a plurality of bits input to at least one computing layer in a neural network and a correct value is determined. The bits are respectively considered the at least one fault bit. A repair condition is determined based on the difference. The repair condition includes a correspondence between a position where the fault bit is located in the block and at least one non-fault bit in the memory. A value of at least one non-fault bit of the memory replaces a value of the fault bit based on the repair condition.
    Type: Application
    Filed: March 28, 2022
    Publication date: March 16, 2023
    Applicant: Skymizer Taiwan Inc.
    Inventors: Shu-Ming Liu, Kai-Chiang Wu, Chien-Fa Chen, Wen Li Tang
  • Publication number: 20230071141
    Abstract: The present disclosure relates to a home compostable label and its facestock, and a method for manufacturing such label and facestock. The facestock comprises a core layer comprising a top surface, a bottom surface, and a core compostable material; and a first skin layer comprising a first compostable material, said first skin layer being positioned proximate to at least a portion of the top surface of the core layer.
    Type: Application
    Filed: August 12, 2022
    Publication date: March 9, 2023
    Inventors: Wen-Li A. Chen, M. Scott Howarth
  • Patent number: 11579099
    Abstract: This disclosure relates to an apparatus and methods for applying X-ray reflectometry (XRR) in characterizing three dimensional nanostructures supported on a flat substrate with a miniscule sampling area and a thickness in nanometers. In particular, this disclosure is targeted for addressing the difficulties encountered when XRR is applied to samples with intricate nanostructures along all three directions, e.g. arrays of nanostructured poles or shafts. Convergent X-ray with long wavelength, greater than that from a copper anode of 0.154 nm and less than twice of the characteristic dimensions along the film thickness direction, is preferably used with appropriate collimations on both incident and detection arms to enable the XRR for measurements of samples with limited sample area and scattering volumes.
    Type: Grant
    Filed: September 29, 2020
    Date of Patent: February 14, 2023
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chun-Ting Liu, Wen-Li Wu, Bo-Ching He, Guo-Dung Chen, Sheng-Hsun Wu, Wei-En Fu
  • Patent number: 11515307
    Abstract: A method of making a semiconductor device includes: providing a substrate; forming an insulating layer on the substrate; forming a first trench in the insulating layer; forming a first semiconductor layer in the first trench; and removing a portion of the insulating layer to expose the first semiconductor layer.
    Type: Grant
    Filed: June 4, 2020
    Date of Patent: November 29, 2022
    Assignees: National Applied Research Laboratories, EPISTAR Corporation
    Inventors: Shih-Pang Chang, Guang-Li Luo, Szu-Hung Chen, Wen-Kuan Yeh, Jen-Inn Chyi, Meng-Yang Chen, Rong-Ren Lee, Shih-Chang Lee, Ta-Cheng Hsu
  • Publication number: 20220359591
    Abstract: An image sensor includes a storage device, where the storage device includes a memory element, a first dielectric layer and a light shielding element. The memory element includes a storage node and a storage transistor gate, where the storage transistor gate is located over the storage node. The first dielectric layer is located over a portion of the storage transistor gate. The light shielding element is located on the first dielectric layer and includes a semiconductor layer. The semiconductor layer is electrically isolated from the memory element, where the light shielding element is overlapped with at least a part of a perimeter of the storage transistor gate in a vertical projection on a plane along a stacking direction of the memory element and the light shielding element, and the stacking direction is normal to the plane.
    Type: Application
    Filed: July 27, 2022
    Publication date: November 10, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Lei Chen, Clark Lee, Wen-Sheng Wang, Chien-Li Kuo
  • Patent number: 11494475
    Abstract: The invention provides a safety system for a cleanroom, which comprises a cleanroom garment provided with a plurality of RFID (radio frequency identification) tags, a face recognition device arranged at an entrance of the cleanroom, and a first RFID reader arranged beside at least one machine in the cleanroom, wherein the first RFID reader is used for identifying the RFID tags on the cleanroom garment, and a KVM network power interrupter connected to a display screen of the machine.
    Type: Grant
    Filed: April 7, 2020
    Date of Patent: November 8, 2022
    Assignee: United Semiconductor (Xiamen) Co., Ltd.
    Inventors: Chao Wu, Chung-Li Chien, Cheng-Tar Lu, Zi Xin Chen, Sheng Kai Wang, Wen Yi Tan
  • Patent number: 11459230
    Abstract: A MEMS microphone includes a substrate, a backplate disposed on a side of the substrate, a diaphragm movably disposed between the substrate and the backplate, and a plurality of slots formed on the diaphragm. The slots are spaced apart from each other and have a non-constant width to relieve the residual stress on the diaphragm.
    Type: Grant
    Filed: March 31, 2020
    Date of Patent: October 4, 2022
    Assignee: FORTEMEDIA, INC.
    Inventors: Jien-Ming Chen, Feng-Chia Hsu, Wen-Shan Lin, Hsin-Li Lee, Nai-Hao Kuo
  • Publication number: 20220212618
    Abstract: Disclosed is a method for predicting collision severity, including: establishing a first learning model, and inputting vehicle data and collision accident scene feature data into the first learning model; obtaining a predicted collision acceleration curve outputted by the first learning model, the predicted collision acceleration curve being established based on a plane rectangular coordinate system; establishing a second learning model, and inputting the predicted collision acceleration curve, the occupant feature data and the restraint system feature data into the second learning model; obtaining a plurality of predicted collision kinematics and dynamics curves of human body parts outputted by the second learning model; generating a collision severity parameter according to the plurality of predicted collision kinematics and dynamics curves of the human body parts, the collision severity parameter being configured to evaluate the collision severity.
    Type: Application
    Filed: March 27, 2022
    Publication date: July 7, 2022
    Inventors: BING-BING NIE, WEN-TAO CHEN, QING-FAN WANG, QUAN LI, QING ZHOU
  • Patent number: 10350928
    Abstract: Printing layers and films for printing are disclosed. Methods for preparing such films also are disclosed.
    Type: Grant
    Filed: April 4, 2017
    Date of Patent: July 16, 2019
    Assignee: Avery Dennison Corporation
    Inventors: Osei Owusu, Shanshan Wang, Vadim Zaikov, Chieh-Wen Chen, Michael Ramsay, Wen-Li Chen
  • Publication number: 20190135012
    Abstract: Microporous structures in face films are described for improving printability of the films. Also described are laminates and pressure sensitive adhesive laminates including the microporous structured face films. Various related methods are additionally described.
    Type: Application
    Filed: December 28, 2018
    Publication date: May 9, 2019
    Inventors: David Bland, Wen-Li Chen, Michael Ramsay, Shanshan Wang
  • Patent number: 10232657
    Abstract: Microporous structures in face films are described for improving printability of the films. Also described are laminates and pressure sensitive adhesive laminates including the microporous structured face films. Various related methods are additionally described.
    Type: Grant
    Filed: February 16, 2017
    Date of Patent: March 19, 2019
    Assignee: AVERY DENNISON CORPORATION
    Inventors: David Bland, Wen-Li Chen, Michael Ramsay, Shanshan Wang
  • Patent number: 9914395
    Abstract: An electrochromic rearview mirror contains a connection assembly, and the connection assembly includes: a first substrate, a first coating layer, a second coating layer, a packaging frame, an electrochromic layer, a first conductive glue, a second conductive glue, at least one third coating layer, at least one fourth coating layer, and a second substrate. The first substrate has a first face and a second face, and the second substrate has a third face and a fourth face. The second coating layer conducts electricity, each of the at least one fourth coating layer is fixed on the third face, and each of the at least one third coating layer is disposed on the third face. Furthermore, the packaging frame and the electrochromic layer are defined among the second coating layer, the fourth coating layer and the third coating layer.
    Type: Grant
    Filed: September 8, 2016
    Date of Patent: March 13, 2018
    Assignee: Licon Technologies Inc.
    Inventors: Wen-Li Chen, Wen-Yi Chen
  • Publication number: 20180065557
    Abstract: An electrochromic rearview mirror contains a connection assembly, and the connection assembly includes: a first substrate, a first coating layer, a second coating layer, a packaging frame, an electrochromic layer, a first conductive glue, a second conductive glue, at least one third coating layer, at least one fourth coating layer, and a second substrate. The first substrate has a first face and a second face, and the second substrate has a third face and a fourth face. The second coating layer conducts electricity, each of the at least one fourth coating layer is fixed on the third face, and each of the at least one third coating layer is disposed on the third face. Furthermore, the packaging frame and the electrochromic layer are defined among the second coating layer, the fourth coating layer and the third coating layer.
    Type: Application
    Filed: September 8, 2016
    Publication date: March 8, 2018
    Inventors: Wen-Li Chen, Wen-Yi Chen
  • Publication number: 20170259604
    Abstract: Microporous structures in face films are described for improving printability of the films. Also described are laminates and pressure sensitive adhesive laminates including the microporous structured face films. Various related methods are additionally described.
    Type: Application
    Filed: February 16, 2017
    Publication date: September 14, 2017
    Inventors: David Bland, Wen-Li Chen, Michael Ramsay, Shanshan Wang
  • Publication number: 20170203598
    Abstract: Printing layers and films for printing are disclosed. Methods for preparing such films also are disclosed.
    Type: Application
    Filed: April 4, 2017
    Publication date: July 20, 2017
    Inventors: Osei OWUSU, Shanshan WANG, Vadim ZAIKOV, Chieh-Wen CHEN, Michael RAMSAY, Wen-Li CHEN
  • Patent number: 9636938
    Abstract: Printing layers and films for printing are disclosed. Methods for preparing such films also are disclosed.
    Type: Grant
    Filed: December 10, 2014
    Date of Patent: May 2, 2017
    Assignee: Avery Dennison Corporation
    Inventors: Osei Owusu, Shanshan Wang, Vadim Zaikov, Chieh-Wen Chen, Michael Ramsay, Wen-Li A. Chen
  • Publication number: 20160303833
    Abstract: Various polymeric compositions are described which are particularly well suited for use in forming films for printing. The films can be incorporated in label assemblies and can be subjected to high temperature printing operations without exhibiting excessive curling or other undesirable properties.
    Type: Application
    Filed: April 14, 2016
    Publication date: October 20, 2016
    Inventors: Shanshan WANG, Melissa ARNETT, David G. BLAND, Wen-Li A. CHEN, Ben XU
  • Publication number: 20160253927
    Abstract: Mono-layer and multi-layer compostable films are provided. The multi-layered compostable films may generally include a core layer fabricated from one or more compostable resins. Multi-layer compostable films may include at least one skin layer fabricated from the same or different compostable resin used to fabricate the core layer. Also provided are labels formed from such compostable films in combination with aqueous dispersions of bio-based pressure sensitive adhesives. These labels have many possible applications, such as labels for a variety of fruits.
    Type: Application
    Filed: December 30, 2014
    Publication date: September 1, 2016
    Inventors: Wen-Li A. CHEN, Qiang LUO, Charles R. WILLIAMS, Vadim ZAIKOV
  • Publication number: 20160185087
    Abstract: Various methods of laser cutting polyolefin films are described, and particularly using carbon dioxide lasers. Also described are modified polyolefin materials which can be subjected to laser cutting.
    Type: Application
    Filed: November 21, 2015
    Publication date: June 30, 2016
    Inventors: Kourosh KIAN, Rishikesh K. BHARADWAJ, Shanshan WANG, Wen-Li A. CHEN, Jessica ALESSANDRO
  • Patent number: 9315064
    Abstract: The present invention is directed to a printed substrate including a multilayer film having the following layered configuration: a print layer having a thickness of at least about 0.6 mils, which is receptive to eco-solvent inks, mild-solvent inks, latex inks, UV inks, or combinations thereof, and where the print layer includes one or more of eco-solvent inks, mild-solvent inks, latex inks, UV inks, or combinations thereof; a tie layer; a core layer; and an adhesive layer.
    Type: Grant
    Filed: February 20, 2013
    Date of Patent: April 19, 2016
    Assignee: Avery Dennison Corporation
    Inventors: Osei Owusu, Vadim Zaikov, Shanshan Wang, James Baker, Wen-Li A. Chen