Abstract: An antenna system includes a first antenna element and a second antenna element. The first antenna element includes a first ground element, a first radiation element, a second radiation element, and a third radiation element. The first radiation element has a first feeding point. The second radiation element is coupled to the first ground element. The third radiation element is coupled to the first ground element. The third radiation element is adjacent to the first radiation element and the second radiation element. The second antenna element includes a second ground element, a fourth radiation element, a fifth radiation element, and a sixth radiation element. The fourth radiation element has a second feeding point. The fifth radiation element is adjacent to the fourth radiation element. The fifth radiation element is coupled through the sixth radiation element to the second ground element.

Abstract: A dezincification-resistant copper alloy and a method for producing a product containing the same are proposed by the present invention. The dezincification-resistant alloy of the present invention contains 59.5 to 64 wt % of copper (Cu); 0.1 to 0.5 wt % of bismuth (Bi); 0.08 to 0.16 wt % of arsenic (As); 5 to 15 ppm of boron (B); 0.3 to 1.5 wt % of tin (Sn); 0.1 to 0.7 wt % of zirconium (Zr); less than 0.05 wt % of lead (Pb); and zinc (Zn) in balance. The dezincification-resistant copper alloy of the present invention has excellent casting properties, good toughness and machinability, and can be corrosion-resistant. Thus, the alloy can reduce dezincification on the surfaces.

Abstract: The present invention provides a lead-free brass alloy, including 0.3 to 0.8 wt % of aluminum, 0.01 to 0.4 wt % of bismuth, 0.05 to 1.5 wt % of iron and more than 96 wt % of copper and zinc, wherein the copper is present in an amount ranging from 58 to 75 wt %. The brass alloy of the present invention meets the standard of the environmental regulation, wherein the lead content is less than 0.25 wt % based on the weight of the alloy. Further, the brass alloy of the present invention has 0.05 to 1.5 wt % of iron and less than 0.4% of bismuth, so as to lower production cost, eliminate cracks and increase production yield.

Abstract: The present invention provides a lead-free brass alloy, including 0.3 to 0.8 wt % of aluminum, 0.01 to 0.4 wt % of bismuth, 0.05 to 1.5 wt % of iron and more than 96 wt % of copper and zinc, wherein the copper is present in an amount ranging from 58 to 75 wt %. The brass alloy of the present invention meets the standard of the environmental regulation, wherein the lead content is less than 0.25 wt % based on the weight of the alloy. Further, the brass alloy of the present invention has 0.05 to 1.5 wt % of iron and less than 0.4% of bismuth, so as to lower production cost, eliminate cracks and increase production yield.

Abstract: The present invention provides an environmental friendly brass alloy, including 0.4 to 0.8 wt % of aluminum; 0.6 to 1.6 wt % of nickel; 0.8 to 2.0 wt % of tin; more than 95.6 wt % of copper and zinc; and less than 0.1 wt % of iron, lead, phosphorous and impurities, wherein the copper is present in an amount ranging from 60 to 68 wt %.

Abstract: The present invention provides a low-lead copper alloy, comprising 0.05 to 0.3 wt % of lead (Pb), 0.3 to 0.8 wt % of aluminum (Al), 0.01 to 0.4 wt % of bismuth (Bi), 0.1 to 2 wt % of nickel (Ni), and more than 96.5 wt % of copper (Cu) and zinc (Zn), wherein copper is in an amount ranging from 58 to 70 wt %. The low-lead copper alloy of the present invention has excellent material properties as well as good toughness and processability, thereby increasing the alloy strength and corrosion resistance thereof.

Abstract: The present invention provides a low-lead copper alloy, which includes 0.05 to 0.3 wt % of lead, 0.3 to 0.8 wt % of aluminum, 0.01 to 3 wt % of bismuth, 1 to 4 wt % of silicon, 0.1 to 1 wt % of tin, and more than 93.6% of copper and zinc, wherein copper is in an amount ranging from 61 to 78 wt %. The low-lead copper alloy of the present invention has excellent toughness and processability, and can provide increased resistance in an environment with a high concentration of chlorine ions.

Abstract: A dezincification-resistant copper alloy is provided. The copper alloy comprises less than 0.3 wt % of lead (Pb), 0.02 to 0.15 wt % of antimony (Sb), 0.02 to 0.25 wt % of arsenic (As), 0.4 to 0.8 wt % of aluminum (Al), 1 to 20 ppm of boron (B), and more than 97 wt % of copper (Cu) and zinc (Zn), wherein the copper is in an amount ranging from 58 to 70 wt %. The dezincification-resistant copper alloy of the present invention has excellent casting properties, good toughness and machinability, and can be corrosion-resistant, thereby reducing dezincification on the surfaces of the alloy.

Abstract: A dezincification-resistant copper alloy and a method for producing a product comprising the same are proposed by the present invention. The dezincification-resistant alloy of the present invention comprises 59.5 to 64 wt % of copper (Cu); 0.1 to 0.5 wt % of bismuth (Bi); 0.08 to 0.16 wt % of arsenic (As); 5 to 15 ppm of boron (B); 0.3 to 1.5 wt % of tin (Sn); 0.1 to 0.7 wt % of zirconium (Zr); less than 0.05 wt % of lead (Pb); and zinc (Zn) in balance. The dezincification-resistant copper alloy of the present invention has excellent casting properties, good toughness and machinability, and can be corrosion-resistant. Thus, the alloy can reduce dezincification on the surfaces thereof.

Abstract: A low lead brass alloy and a method for producing a product comprising the low lead brass alloy are proposed. The low lead brass comprises 0.05 to 0.3 wt % of lead (Pb); 0.3 to 0.8 wt % of aluminum (Al); 0.01 to 0.4 wt % of bismuth (Bi); 0.1 to 0.15 wt % of microelements; and more than 97.5 wt % of copper (Cu) and zinc (Zn), wherein copper is in an amount ranging from 58 to 70 wt %.

Abstract: An anti-microbial sanitary ware includes a substrate, and an anti-microbial film formed on the substrate and including a protective layer and anti-microbial metal particles that are dispersed in the protective layer. The protective layer is made from a compound selected from the group consisting of metal nitrides and metal carbides. The anti-microbial metal particles are made from a metal selected from the group consisting of silver, zinc, and copper.