Patents by Inventor Wen-Lin Xiong

Wen-Lin Xiong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8211503
    Abstract: A method for making device housing comprises: providing a transparent film; forming a coating on one surface of the film by printing ink containing metal powder on the film and ultrasonically treating the coating; and molding a substrate onto the coating.
    Type: Grant
    Filed: November 20, 2009
    Date of Patent: July 3, 2012
    Assignees: Shenzhen Futaihong Precision Industry Co., Ltd., FIH (Hong Kong) Limited
    Inventors: Ben-Ding Tsao, Wen-Lin Xiong, Xian-Ming Wu, Jian-Bao Han, Dian-Ming Zhu, Chong Cai
  • Patent number: 8142880
    Abstract: A housing for an electronic device is disclosed, the housing comprises a base layer and a transparent film layer overlapped in the base layer, the film layer includes an inner surface abutting the base layer and an outer surface having ridges protruding thereform. The housing is formed by injection molding a molten plastic material over the transparent film layer, the ridges are formed on the transparent film layer by the molten plastic pressing the transparent film layer in injection molding. It is also disclosed a mold for making the housing and a method to make the housing.
    Type: Grant
    Filed: December 10, 2009
    Date of Patent: March 27, 2012
    Assignees: Shenzhen Futaihong Precision Industry Co., Ltd., FIH (Hong Kong) Limited
    Inventors: Ben-Ding Tsao, Wen-Lin Xiong, Qi-Quan Yan, Yue-Jun He, Man-Xiang Duan, San-Yuan Wen
  • Publication number: 20100326720
    Abstract: A housing comprise a decorative layer including a transparent base, a first conductive coating, an electrically conductive ink layer having a first electrical interface and a second conductive coating having a second electrical interface. The first conductive coating is formed on the base, the electrically conductive ink layer is laminated with and covers the first conductive coating, the second conductive coating is laminated between the electrically conductive ink layer and the outer surface of the substrate, the first electrical interface of the first conductive coating and the second electrical interface of the second conductive coating are electrically connected to a power source for creating an electrical field between the first conductive coating and the second conductive layer to make the electrically conductive ink layer present a pattern.
    Type: Application
    Filed: April 9, 2010
    Publication date: December 30, 2010
    Applicants: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., FIH (HONG KONG) LIMITED
    Inventors: BEN-DING TSAO, WEN-LIN XIONG, DIAN-MING ZHU, JIANG-YING HU, HONG-XI XU
  • Publication number: 20100314990
    Abstract: A housing comprises an exterior coating and a substrate. The housing further comprises a first conductive coating, a light emitting coating and a second conductive coating formed between the exterior coating and the substrate. The substrate formed on the second conductive coating by molding. The first and the second conductive coatings include electric contacts. An electronic device using the housing is also described there.
    Type: Application
    Filed: November 13, 2009
    Publication date: December 16, 2010
    Applicants: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., FIH (HONG KONG) LIMITED
    Inventors: BEN-DING TSAO, WEN-LIN XIONG, DONG-SHENG WENG, HONG-XI XU, QI-QUAN YAN, DIAN-MING ZHU
  • Publication number: 20100288357
    Abstract: A housing comprises a transparent exterior coating, a photoelectric conversion coating bonded with the exterior coating and a substrate molded on the photoelectric conversion coating. The photoelectric conversion coating has electrode contacts thereon. The photoelectric conversion coating is used to convert light energy to electrical energy. The disclosure also describes an electronic device using the housing and a method for making the housing there.
    Type: Application
    Filed: January 26, 2010
    Publication date: November 18, 2010
    Applicants: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., FIH (HONG KONG) LIMITED
    Inventors: CHIN-HSIEN LIANG, BEN-DING TSAO, WEN-LIN XIONG, DIAN-MING ZHU, JIANG-YING HU, XIAN-MING WU, YUE-JUN HE
  • Publication number: 20100279073
    Abstract: A housing for an electronic device is disclosed, the housing comprises a base layer and a transparent film layer overlapped in the base layer, the film layer includes an inner surface abutting the base layer and an outer surface having ridges protruding thereform. The housing is formed by injection molding a molten plastic material over the transparent film layer, the ridges are formed on the transparent film layer by the molten plastic pressing the transparent film layer in injection molding. It is also disclosed a mold for making the housing and a method to make the housing.
    Type: Application
    Filed: December 10, 2009
    Publication date: November 4, 2010
    Applicants: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., FIH (HONG KONG) LIMITED
    Inventors: BEN-DING TSAO, WEN-LIN XIONG, QI-QUAN YAN, YUE-JUN HE, MAN-XIANG DUAN, SAN-YUAN WEN
  • Publication number: 20100271281
    Abstract: A housing with a built-in antenna includes a film layer, an antenna layer, a base layer; and at least a connecting pole. The antenna layer is comprised from electro-conductive inks and printed on the film layer, the housing is formed by injection molding a molten plastic material over the film layer, the base layer is formed after the molten plastic material cooled, the antenna layer is embedded between the film layer and the base layer, the connecting pole is embedded in the base layer with an end of the connecting pole contacting the antenna and the other end of the connecting pole exposed to the out side.
    Type: Application
    Filed: December 10, 2009
    Publication date: October 28, 2010
    Applicants: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., FIH (HONG KONG) LIMITED
    Inventors: BEN-DING TSAO, WEN-LIN XIONG, FEI-FEI HUANG, GUO-HUA ZHANG, QI-QUAN YAN, WEI GAO
  • Publication number: 20100247802
    Abstract: A method for making device housing comprises: providing a transparent film; forming a coating on one surface of the film by printing ink containing metal powder on the film and ultrasonically treating the coating; and molding a substrate onto the coating.
    Type: Application
    Filed: November 20, 2009
    Publication date: September 30, 2010
    Applicants: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., FIH (HONG KONG) LIMITED
    Inventors: BEN-DING TSAO, WEN-LIN XIONG, XIAN-MING WU, JIAN-BAO HAN, DIAN-MING ZHU, CHONG CAI
  • Publication number: 20100244678
    Abstract: A housing comprises an exterior coating, a contact control coating formed on and bonded with the exterior coating, a light emitting coating formed on and bonded with the contact control coating, and a substrate molded on and bonded with the light emitting coating. The contact control coating and the light emitting coating are defined with electric contacts thereon. A method for manufacturing the housing includes providing a contact control coating; applying a light emitting coating onto the contact control coating; molding a substrate onto the light emitting coating; and defining electric contacts on the contact control coating and the light emitting coating.
    Type: Application
    Filed: December 15, 2009
    Publication date: September 30, 2010
    Applicants: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., FIH (HONG KONG) LIMITED
    Inventors: CHIN-HSIEN LIANG, BEN-DING TSAO, WEN-LIN XIONG, DIAN-MING ZHU, JIANG-YING HU, ZHUN WANG, CHONG CAI