Abstract: A semiconductor light-emitting device includes a semiconductor stack including a first semiconductor layer and a second semiconductor layer; a first reflective layer formed on the first semiconductor layer and including a plurality of vias; a plurality of contact structures respectively filled in the vias and electrically connected to the first semiconductor layer; a second reflective layer including metal material formed on the first reflective layer and contacting the contact structures; a plurality of conductive vias surrounded by the semiconductor stack; a connecting layer formed in the conductive vias and electrically connected to the second semiconductor layer; a first pad portion electrically connected to the second semiconductor layer; and a second pad portion electrically connected to the first semiconductor layer, wherein a shortest distance between two of the conductive vias is larger than a shortest distance between the first pad portion and the second pad portion.

Abstract: The application relates to a dextran affinity tag and use thereof. The present application provides an affinity tag, which is a segment of dextran binding domain, and can purify a target protein by its affinity with the dextran. The affinity tag of the present application has the advantages of more efficient in preparation and purification, and can be widely used in industrial applications that require protein purification processes.

Abstract: An example operation may include one or more of storing access requirements of a containerized environment, identifying a plurality of types of users of the containerized environment based on the access requirements, identifying a plurality of different restriction priorities for the plurality of types of users within the containerized environment, respectively, based on the access requirements, dynamically generating an access policy that satisfies the plurality of different restriction priorities for the plurality of types of users within the containerized environment, and transforming the access policy into a plugin.

Abstract: A reticle is provided. The reticle includes a first reflective multilayer (ML) over a mask substrate and a capping layer over the first reflective ML. The reticle also includes a first absorption layer over the capping layer and a second reflective multilayer (ML) over the first absorption layer. The reticle further includes an etch stop layer over the second reflective ML and a third reflective multilayer (ML) over the etch stop layer. In addition, the reticle includes an absorption film pair over the third reflective ML.

Abstract: The present disclosure generally provides an apparatus and method for gas diffuser support structure for a vacuum chamber. The gas diffuser support structure comprises a backing plate having a central bore, and a gas deflector having a length and a width unequal to the length coupled to the backing plate by a plurality of outward fasteners coupled to a plurality of outward threaded holes formed in the backing plate, in which a spacer is disposed between the backing plate and the gas deflector, and in which a length to width ratio of the gas deflector is about 0.1:1 to about 10:1.

Abstract: The disclosure provides a method of forming a package structure, and the method includes the following steps. A plurality of semiconductor components is bonded to a substrate. A grinding process is performed to thin the plurality of semiconductor components. The plurality of semiconductor components have a first total thickness variation (TTV) after performing the grinding process. A dielectric layer is formed on the substrate. A first chemical mechanical polishing (CMP) is performed to remove a first portion of the dielectric layer on top surfaces of the plurality of semiconductor components; and performing a second CMP process to remove a second portion of the dielectric layer between the plurality of semiconductor components and a portion of the plurality of semiconductor components. After performing the second CMP process, the plurality of semiconductor components has a second TTV less than the first TTV.

Abstract: A method of forming a semiconductor structure includes forming a seed layer on a substrate, forming a photoresist layer on the seed layer with a first opening wider than a second opening, performing an electroplating process with a first plating current to grow a bottom portion of a first metal line in the first opening and a bottom portion of a second metal line in the second opening, continuing the electroplating process with a second plating current that is larger than the first plating current to grow a top portion of the first metal line and a top portion of the second metal line, removing the photoresist layer to expose a portion of the seed layer, and removing the exposed portion of the seed layer.

Abstract: The disclosure provides a method of forming a package structure, and the method includes: bonding a die to a wafer; performing a thinning process on the die, wherein the die has a first total thickness variation (TTV) after performing the thinning process; forming a dielectric layer on the wafer to cover sidewalls and a top surface the die; performing a first removal process to remove a first portion of the dielectric layer and expose the top surface of the die; and performing a second removal process to remove a second portion of the dielectric layer and a portion of the die, wherein after performing the second removal process, the die has a second TTV less than the first TTV.

Abstract: Disclosed herein is a diclofenac prodrug represented by formula (I), wherein each of the substituents is given the definition as set forth in the Specification and Claims. Also disclosed is a method for alleviating arthritis, which includes administering to a subject in need thereof the aforesaid diclofenac prodrug.

Abstract: A dental implantation system and navigation method are provided. The dental implantation system includes: a multi-axis robotic arm having an action end connected to a dental implantation device; and at least one optical device coupled to the multi-axis robotic arm to capture a real-time image information about an implant-receiving region of an implant-receiving patient during a dental implantation process. The multi-axis robotic arm drives the dental implantation device moving along a predetermined path in the implant-receiving region according to association result of a pre-implantation plan and the real-time image information. The pre-implantation plan is associated with a 3D model of the implant-receiving region and includes a predetermined entry point associated with the predetermined path, at least one predetermined relay point associated with the predetermined path, and a predetermined target point associated with the predetermined path.

Abstract: Systems, apparatuses, services, platforms, and methods are discussed herein that provide assistance for user interface devices. In one example, an assistance application is provided comprising an imaging system configured to capture an image of a scene, an interface system configured to provide data associated with the image to a distributed assistance service that responsively processes the data to recognize properties of the scene and establish feedback for a user based at least on the properties of the scene, and a user interface configured to provide the feedback to the user.

Abstract: The present invention discloses an integrated circuit structure and a design method thereof, in which a circuit passageway is arranged at each circuit element terminal in circuit design stage. The arranged circuit passageway does not only increase layout flexibility in circuit simulation stage but also simplify layout difficulty when the circuit layout needs to be modified after taping out stage. Also, the circuit passageway can minimize modified metal layers, i.e. the number of modified masks is minimized. Because the expense of fab is based on the utilized layers and number of masks instead of designs of masks, the present invention will not increase the expense in taping out stage and can save the cost of research and development when modifications are required.

Abstract: A wafer testing real-time monitoring software system and its unique open software architecture which achieves real-time monitoring of wafer test results and on-line changing of externally hooked software to satisfy customer needs without changing its main program. The software structure receives and processes binary files from different probers and converts these into readable ASCII files. The system consists of four software programs that can operate independently. These programs are an automatic transfer program, a program which converts wafer test results from a binary file to an ASCII file, a program which receives the ASCII files and performs wafer map editing, and an auto-ftp program which automatically scans data and sends data to remote locations. Additionally, multiple workstations can process data from probers simultaneously. The on-line monitor on a production line can see production results from multiple major workstations through the network drive and drive mapping functions.

Abstract: The present invention discloses an integrated circuit structure and a design method thereof, in which a circuit passageway is arranged at each circuit element terminal in circuit design stage. The arranged circuit passageway does not only increase layout flexibility in circuit simulation stage but also simplify layout difficulty when the circuit layout needs to be modified after taping out stage. Also, the circuit passageway can minimize modified metal layers, i.e. the number of modified masks is minimized. Because the expense of fab is based on the utilized layers and number of masks instead of designs of masks, the present invention will not increase the expense in taping out stage and can save the cost of research and development when modifications are required.

Abstract: An assembled and convertible decorating assembly includes at least three partition assemblies. Each partition assembly mainly includes several fixing elements, a pair of vertical rods, a pair of horizontal rods, a decorating element, and a pair of auxiliary horizontal rods. By several pivoting elements, this invention has the following three modes: a complete detached mode, a linear assembled mode that is a screen and an enclosed assembled mode that is an illuminating device. It is easy for storage or transportation. It can be assembled or re-arranged by the user. And, it has many functions such as a regular upright screen, an illuminating device, and an exhibition post, etc.

Abstract: An assembled and convertible decorating assembly includes at least three partition assemblies. Each partition assembly mainly includes several fixing elements, a pair of vertical rods, a pair of horizontal rods, a decorating element, and a pair of auxiliary horizontal rods. By several pivoting elements, this invention has the following three modes: a complete detached mode, a linear assembled mode that is a screen and an enclosed assembled mode that is an illuminating device. It is easy for storage or transportation. It can be assembled or re-arranged by the user. And, it has many functions such as a regular upright screen, an illuminating device, and an exhibition post, etc.