Abstract: The invention relates to a connecting plate of a multi-layers IC board, which includes the connecting plate being provided one end with an engaging step to connect with another engaging step of another connecting plate for shortening the length of the assembly. And the assembled plate can be used on a smaller multi-layers IC board that can provide a lighter and smaller product for being used effectively.

Abstract: The invention relates to a conducting structure of a multi-layers IC board, which includes conducting rod being received in aperture of the IC board to obtain an effective connection and conduction. And the conducting wire is placed horizontally on the IC board, which has its ending pin and annular metal ring to contact with two apertures respectively and to be welded thereon for perfect conduction and smaller assembled volume.