Patents by Inventor Wen-Long Chen

Wen-Long Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190347121
    Abstract: Methods, computer program products, and systems are presented. The method computer program products, and systems can include, for instance: obtaining, by a container host node, container image configuration data that defines a specified container image configuration, wherein the container host node includes an associated container image repository for storing container images; multicasting, by the container host node, a request for one or more image of first through Nth specified container images to a set of container host nodes; receiving, by the container host node, at least one container image from at least one container host node of the set of container host nodes in response to the multicasting; building, by the container host node, a specified container image according to the specified container image configuration using the at least one container image received by the receiving; and running, by the container host node, the specified container image built by the building to define a runtime container.
    Type: Application
    Filed: May 11, 2018
    Publication date: November 14, 2019
    Inventors: Lan LUO, Jian ZHANG, Jian Dong YIN, Wen Rui ZHAO, Li Long CHEN
  • Publication number: 20190143457
    Abstract: A laser preheating control method is applied to a laser preheating control device. When a cutter processes a workpiece along a process path, a laser source of the device is provided to output a laser beam to the workpiece for selectively forming a laser spot on the workpiece surface. And according to a movement direction of the cutter, a laser controller of the device is provided to form the laser spot only on a preheating region of the workpiece, where in front of the cutter in the process path, for preheating the workpiece in the preheating region. As a result, the laser spot will not repeatedly heat the workpiece behind the cutter in the process path, and the qualitative change of the workpiece caused by repeating heating is preventable.
    Type: Application
    Filed: December 26, 2017
    Publication date: May 16, 2019
    Inventors: Yu-Ting Lu, Yu-Fu Lin, Jui-Teng Chen, Wen-Long Chang, Chih-Hung Chou
  • Patent number: 9304548
    Abstract: A docking station of an electronic device includes a casing having a bearing surface, a fool-proofing set, an elastic member, a connector and a linkage member. The fool-proofing set includes a protrusion protruding from or retracting back to the bearing surface and a stopper linking up with the protrusion. The elastic member is disposed in the casing and provides an elastic force so that the protrusion protrudes from the casing normally. The connector is able to operably protrude to a bearing space above the bearing surface or retracts back. When the protrusion protrudes from the bearing surface, the stopper stops at a moving path of the linkage member so that the connector is limited inside the casing. When the protrusion retracts back, the linkage member is not stopped by the stopper so that the connector is able to operably protrude to the bearing space to connect with the electronic device.
    Type: Grant
    Filed: June 24, 2014
    Date of Patent: April 5, 2016
    Assignee: Wistron Corporation
    Inventors: Hung-Sheng Chen, Wen-Long Chen
  • Publication number: 20150268695
    Abstract: A docking station of an electronic device includes a casing having a bearing surface, a fool-proofing set, an elastic member, a connector and a linkage member. The fool-proofing set includes a protrusion protruding from or retracting back to the bearing surface and a stopper linking up with the protrusion. The elastic member is disposed in the casing and provides an elastic force so that the protrusion protrudes from the casing normally. The connector is able to operably protrude to a bearing space above the bearing surface or retracts back. When the protrusion protrudes from the bearing surface, the stopper stops at a moving path of the linkage member so that the connector is limited inside the casing. When the protrusion retracts back, the linkage member is not stopped by the stopper so that the connector is able to operably protrude to the bearing space to connect with the electronic device.
    Type: Application
    Filed: June 24, 2014
    Publication date: September 24, 2015
    Inventors: Hung-Sheng Chen, Wen-Long Chen
  • Patent number: 8962963
    Abstract: A tambourine is provided with a crescent shell including two tubular segment elements at both ends respectively, through holes, and two sets of two spaced grooves each extending from either end of one tubular segment element; two curved mounting members each including two groups of two spaced tubular segment members at both ends respectively, each tubular segment member including two sets of projections on an outer surface; a curved handgrip including two tubular segment unit at both ends respectively, and two collections of two spaced depressions each extending from either end of one tubular segment unit; and jingle discs each pivotably disposed in the through hole. The mounting members are pivotably secured to both ends of the shell and the handgrip is pivotably secured to both ends of the mounting members.
    Type: Grant
    Filed: January 9, 2014
    Date of Patent: February 24, 2015
    Inventor: Wen-Long Chen
  • Patent number: 6989559
    Abstract: A discrete circuit component is made from a substrate with the first and second surfaces thereof each having a corresponding matrix of electrically conductive segments. A plated through-hole connects each of the conductive segments of each the first and second conductive segments electrically. The through-hole is first clogged and then subsequently cleared of clogging in the fabrication stages.
    Type: Grant
    Filed: May 8, 2003
    Date of Patent: January 24, 2006
    Assignee: Comchip Technology Co., Ltd.
    Inventors: Wen-Long Chen, Cheng-Chieh Yang, Chih-Liang Hu
  • Patent number: 6870261
    Abstract: A discrete circuit component having an up-right circuit die with lateral electrical connections. The component comprises a substrate having a pair of electrically conductive traces, and a circuit die is planted between the pair of consecutive traces, wherein one electrode of the circuit die on the surface thereof vertical to the substrate is electrically bonded to one of the conductive trace immediately next thereto, while the other electrode of the circuit die on the opposite surface thereof vertical to the substrate is electrically bonded to the other of the pair of conductive traces immediately next thereto. A body of electrical insulation material hermetically seals the circuit die, and a pair of surface electrodes formed on the surface of the body of insulation material are each electrically connected to the corresponding one of the pair of electrically conductive traces extending from the circuit die.
    Type: Grant
    Filed: February 26, 2003
    Date of Patent: March 22, 2005
    Assignee: Comchip Technology Co., Ltd.
    Inventors: Chih-Liang Hu, Wen-Long Chen, Pan-Nan Chen, Ming-Chong Liang, Cheen-Hai Yu
  • Patent number: 6818541
    Abstract: A method for fabricating metal bonding for a semiconductor circuit component employing prescribed feed of metal ball is disclosed. The method comprises the steps of, first, placing a metal ball at the metallization site on the surface of the circuit die of the component; then, melting the metal ball on the site; and subsequently solidifying the molten metal and forming a metal bump at the site. A circuit die having formed with one or more metal bumps can then be made into a circuit component featuring stable and reliable electrical leads and suitable to be utilized as large power rating yet with reduced component size in electronic equipment.
    Type: Grant
    Filed: April 21, 2003
    Date of Patent: November 16, 2004
    Assignee: Comchip Technology Co., Ltd.
    Inventors: Cheng-Chieh Yang, Wen-Long Chen, Yao-Huang Tsai, Chih-Liang Hu, Pan-Nan Chen
  • Publication number: 20040198043
    Abstract: process for fabricating a discrete circuit component on a substrate having fabrication stage clogged through-holes is disclosed. The first surface of the substrate has a matrix of dice surface trace sets each having a first and a second electrically conductive segments. The second surface of the substrate has a corresponding matrix of soldering surface trace sets each having a first and a second electrically conductive segments. A plated through-hole electrically connects each of the first and second conductive segments of each of the dice surface trace sets respectively to the first and second conductive segments of the corresponding soldering surface trace set.
    Type: Application
    Filed: May 8, 2003
    Publication date: October 7, 2004
    Inventors: Wen-Long Chen, Cheng-Chieh Yang, Chih-Liang Hu
  • Publication number: 20040183196
    Abstract: A method for fabricating metal bonding for a semiconductor circuit component employing prescribed feed of metal ball is disclosed. The method comprises the steps of, first, placing a metal ball at the metallization site on the surface of the circuit die of the component; then, melting the metal ball on the site; and subsequently solidifying the molten metal and forming a metal bump at the site. A circuit die having formed with one or more metal bumps can then be made into a circuit component featuring stable and reliable electrical leads and suitable to be utilized as large power rating yet with reduced component size in electronic equipment.
    Type: Application
    Filed: December 16, 2003
    Publication date: September 23, 2004
    Inventors: Cheng-Chieh Yang, Wen-Long Chen, Yao-Huang Tsai, Chih-Liang Hu, Pan-Nan Chen
  • Publication number: 20040185650
    Abstract: A method for fabricating metal bonding for a semiconductor circuit component employing prescribed feed of metal ball is disclosed. The method comprises the steps of, first, placing a metal ball at the metallization site on the surface of the circuit die of the component; then, melting the metal ball on the site; and subsequently solidifying the molten metal and forming a metal bump at the site. A circuit die having formed with one or more metal bumps can then be made into a circuit component featuring stable and reliable electrical leads and suitable to be utilized as large power rating yet with reduced component size in electronic equipment.
    Type: Application
    Filed: April 21, 2003
    Publication date: September 23, 2004
    Inventors: Cheng-Chieh Yang, Wen-Long Chen, Yao-Huang Tsai, Chih-Liang Hu, Pan-Nan Chen
  • Publication number: 20040164406
    Abstract: A discrete circuit component having an up-right circuit die with lateral electrical connections. The component comprises a substrate having a pair of electrically conductive traces, and a circuit die is planted between the pair of consecutive traces, wherein one electrode of the circuit die on the surface thereof vertical to the substrate is electrically bonded to one of the conductive trace immediately next thereto, while the other electrode of the circuit die on the opposite surface thereof vertical to the substrate is electrically bonded to the other of the pair of conductive traces immediately next thereto. A body of electrical insulation material hermetically seals the circuit die, and a pair of surface electrodes formed on the surface of the body of insulation material are each electrically connected to the corresponding one of the pair of electrically conductive traces extending from the circuit die.
    Type: Application
    Filed: February 26, 2003
    Publication date: August 26, 2004
    Inventors: Chih-Liang Hu, Wen-Long Chen, Pan-Nan Chen, Ming-Chong Liang, Cheen-Hai Yu
  • Patent number: 6618269
    Abstract: A discrete circuit component comprises a circuit component die having a first electrode and a second electrode. A surface of a first substrate has an electrically-conductive trace electrically connected to the first electrode of the circuit component die, and a surface of a second substrate also has an electrically-conductive trace electrically connected to the second electrode of the circuit component die. A first terminal electrode is electrically connected to the conductive trace of the first substrate, surface of the first terminal electrode is orthogonal to the longitudinal axis of the conductive trace of the first substrate. A second terminal electrode is electrically connected to the conductive trace of the second substrate, and surface of the second terminal electrode is orthogonal to the longitudinal axis of the conductive trace of the second substrate. The first and second substrates are parallel to each other and encloses the circuit component die.
    Type: Grant
    Filed: September 10, 2001
    Date of Patent: September 9, 2003
    Assignee: Comchip Technology Co., Ltd.
    Inventor: Wen Long Chen
  • Publication number: 20020162686
    Abstract: A discrete circuit component comprises a circuit component die having a first electrode and a second electrode. A surface of a first substrate has an electrically-conductive trace electrically connected to the first electrode of the circuit component die, and a surface of a second substrate also has an electrically-conductive trace electrically connected to the second electrode of the circuit component die. A first terminal electrode is electrically connected to the conductive trace of the first substrate, surface of the first terminal electrode is orthogonal to the longitudinal axis of the conductive trace of the first substrate. A second terminal electrode is electrically connected to the conductive trace of the second substrate, and surface of the second terminal electrode is orthogonal to the longitudinal axis of the conductive trace of the second substrate. The first and second substrates are parallel to each other and encloses the circuit component die.
    Type: Application
    Filed: September 10, 2001
    Publication date: November 7, 2002
    Applicant: Comchip Technology Co., Ltd.
    Inventor: Wen Long Chen
  • Patent number: D688049
    Type: Grant
    Filed: April 23, 2013
    Date of Patent: August 20, 2013
    Assignee: Sovereign Industrial (Jiaxing) Co., Ltd.
    Inventor: Wen-Long Chen
  • Patent number: D689290
    Type: Grant
    Filed: April 23, 2013
    Date of Patent: September 10, 2013
    Assignee: Sovereign Industrial (Jiaxing) Co., Ltd.
    Inventor: Wen-Long Chen