Abstract: Techniques are described for linked blockchains that allow computing devices to access information from an acceptance blockchain about acceptance reports stored in an enterprise delivery blockchain that are also linked to a product blockchain that stores information of the products of the acceptance reports. An acceptance report is indicative of operability of a product in a service provided by a service provider. A processor is configured to access the block in the enterprise delivery blockchain, retrieve the acceptance report from the block in the enterprise delivery blockchain, determine an identifier, identified in the block in the enterprise delivery blockchain, to a block in an acceptance blockchain, access the block in the acceptance blockchain via the determined identifier, retrieve from the block in the acceptance blockchain contextual information of the acceptance report, and output the acceptance report and contextual information of the acceptance report.

Abstract: A supported metallocene catalyst includes a carrier and a metallocene component. The carrier includes an inorganic oxide particle and an alkyl aluminoxane material. The inorganic oxide particle includes at least one inorganic oxide compound selected from the group consisting of an oxide of Group 3A and an oxide of Group 4A. The alkyl aluminoxane material includes an alkyl aluminoxane compound and an alkyl aluminum compound that is present in amount ranging from greater than 0.01 wt % to less than 14 wt % base on 100 wt % of the alkyl aluminoxane material. The metallocene component is supported on the carrier, and includes one of a metallocene compound containing a metal from Group 3B, a metallocene compound containing a metal from Group 4B, and a combination thereof. A method for preparing the supported metallocene catalyst and a method for preparing polyolefin using the supported metallocene catalyst are also disclosed.

Abstract: A docking station of an electronic device includes a casing having a bearing surface, a fool-proofing set, an elastic member, a connector and a linkage member. The fool-proofing set includes a protrusion protruding from or retracting back to the bearing surface and a stopper linking up with the protrusion. The elastic member is disposed in the casing and provides an elastic force so that the protrusion protrudes from the casing normally. The connector is able to operably protrude to a bearing space above the bearing surface or retracts back. When the protrusion protrudes from the bearing surface, the stopper stops at a moving path of the linkage member so that the connector is limited inside the casing. When the protrusion retracts back, the linkage member is not stopped by the stopper so that the connector is able to operably protrude to the bearing space to connect with the electronic device.

Abstract: A docking station of an electronic device includes a casing having a bearing surface, a fool-proofing set, an elastic member, a connector and a linkage member. The fool-proofing set includes a protrusion protruding from or retracting back to the bearing surface and a stopper linking up with the protrusion. The elastic member is disposed in the casing and provides an elastic force so that the protrusion protrudes from the casing normally. The connector is able to operably protrude to a bearing space above the bearing surface or retracts back. When the protrusion protrudes from the bearing surface, the stopper stops at a moving path of the linkage member so that the connector is limited inside the casing. When the protrusion retracts back, the linkage member is not stopped by the stopper so that the connector is able to operably protrude to the bearing space to connect with the electronic device.

Abstract: A tambourine is provided with a crescent shell including two tubular segment elements at both ends respectively, through holes, and two sets of two spaced grooves each extending from either end of one tubular segment element; two curved mounting members each including two groups of two spaced tubular segment members at both ends respectively, each tubular segment member including two sets of projections on an outer surface; a curved handgrip including two tubular segment unit at both ends respectively, and two collections of two spaced depressions each extending from either end of one tubular segment unit; and jingle discs each pivotably disposed in the through hole. The mounting members are pivotably secured to both ends of the shell and the handgrip is pivotably secured to both ends of the mounting members.

Abstract: A discrete circuit component is made from a substrate with the first and second surfaces thereof each having a corresponding matrix of electrically conductive segments. A plated through-hole connects each of the conductive segments of each the first and second conductive segments electrically. The through-hole is first clogged and then subsequently cleared of clogging in the fabrication stages.

Abstract: A discrete circuit component having an up-right circuit die with lateral electrical connections. The component comprises a substrate having a pair of electrically conductive traces, and a circuit die is planted between the pair of consecutive traces, wherein one electrode of the circuit die on the surface thereof vertical to the substrate is electrically bonded to one of the conductive trace immediately next thereto, while the other electrode of the circuit die on the opposite surface thereof vertical to the substrate is electrically bonded to the other of the pair of conductive traces immediately next thereto. A body of electrical insulation material hermetically seals the circuit die, and a pair of surface electrodes formed on the surface of the body of insulation material are each electrically connected to the corresponding one of the pair of electrically conductive traces extending from the circuit die.

Abstract: A method for fabricating metal bonding for a semiconductor circuit component employing prescribed feed of metal ball is disclosed. The method comprises the steps of, first, placing a metal ball at the metallization site on the surface of the circuit die of the component; then, melting the metal ball on the site; and subsequently solidifying the molten metal and forming a metal bump at the site. A circuit die having formed with one or more metal bumps can then be made into a circuit component featuring stable and reliable electrical leads and suitable to be utilized as large power rating yet with reduced component size in electronic equipment.

Abstract: process for fabricating a discrete circuit component on a substrate having fabrication stage clogged through-holes is disclosed. The first surface of the substrate has a matrix of dice surface trace sets each having a first and a second electrically conductive segments. The second surface of the substrate has a corresponding matrix of soldering surface trace sets each having a first and a second electrically conductive segments. A plated through-hole electrically connects each of the first and second conductive segments of each of the dice surface trace sets respectively to the first and second conductive segments of the corresponding soldering surface trace set.

Abstract: A method for fabricating metal bonding for a semiconductor circuit component employing prescribed feed of metal ball is disclosed. The method comprises the steps of, first, placing a metal ball at the metallization site on the surface of the circuit die of the component; then, melting the metal ball on the site; and subsequently solidifying the molten metal and forming a metal bump at the site. A circuit die having formed with one or more metal bumps can then be made into a circuit component featuring stable and reliable electrical leads and suitable to be utilized as large power rating yet with reduced component size in electronic equipment.

Abstract: A method for fabricating metal bonding for a semiconductor circuit component employing prescribed feed of metal ball is disclosed. The method comprises the steps of, first, placing a metal ball at the metallization site on the surface of the circuit die of the component; then, melting the metal ball on the site; and subsequently solidifying the molten metal and forming a metal bump at the site. A circuit die having formed with one or more metal bumps can then be made into a circuit component featuring stable and reliable electrical leads and suitable to be utilized as large power rating yet with reduced component size in electronic equipment.

Abstract: A discrete circuit component having an up-right circuit die with lateral electrical connections. The component comprises a substrate having a pair of electrically conductive traces, and a circuit die is planted between the pair of consecutive traces, wherein one electrode of the circuit die on the surface thereof vertical to the substrate is electrically bonded to one of the conductive trace immediately next thereto, while the other electrode of the circuit die on the opposite surface thereof vertical to the substrate is electrically bonded to the other of the pair of conductive traces immediately next thereto. A body of electrical insulation material hermetically seals the circuit die, and a pair of surface electrodes formed on the surface of the body of insulation material are each electrically connected to the corresponding one of the pair of electrically conductive traces extending from the circuit die.

Abstract: A discrete circuit component comprises a circuit component die having a first electrode and a second electrode. A surface of a first substrate has an electrically-conductive trace electrically connected to the first electrode of the circuit component die, and a surface of a second substrate also has an electrically-conductive trace electrically connected to the second electrode of the circuit component die. A first terminal electrode is electrically connected to the conductive trace of the first substrate, surface of the first terminal electrode is orthogonal to the longitudinal axis of the conductive trace of the first substrate. A second terminal electrode is electrically connected to the conductive trace of the second substrate, and surface of the second terminal electrode is orthogonal to the longitudinal axis of the conductive trace of the second substrate. The first and second substrates are parallel to each other and encloses the circuit component die.

Abstract: A discrete circuit component comprises a circuit component die having a first electrode and a second electrode. A surface of a first substrate has an electrically-conductive trace electrically connected to the first electrode of the circuit component die, and a surface of a second substrate also has an electrically-conductive trace electrically connected to the second electrode of the circuit component die. A first terminal electrode is electrically connected to the conductive trace of the first substrate, surface of the first terminal electrode is orthogonal to the longitudinal axis of the conductive trace of the first substrate. A second terminal electrode is electrically connected to the conductive trace of the second substrate, and surface of the second terminal electrode is orthogonal to the longitudinal axis of the conductive trace of the second substrate. The first and second substrates are parallel to each other and encloses the circuit component die.