Patents by Inventor Wen-Long Chou

Wen-Long Chou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8247774
    Abstract: A method for adjusting output ratio of an optic sensor includes the following steps: measuring and obtaining a response spectrum of the optic sensor; analyzing optic response ratios of the response spectrum at different wavelengths; designing a ratio of light reception areas of the optic sensor, the design being carried out in accordance with three aspects of “the response spectrum” “a fixed proportional relationship being present between multiplication of the optic response ratio and the light reception area and an output of light current” and “a proportional relationship being present between the light reception area and the output of the light current”; and obtaining light current outputs of identical proportions (such as 1:1:1) or in a desired ratio (meaning any arbitrary ratio other than 1:1:1, such as 1:2:1, 1:2:3, or 3:4:5) in accordance with the design of the previous step.
    Type: Grant
    Filed: April 29, 2009
    Date of Patent: August 21, 2012
    Assignee: Tyntek Corporation
    Inventors: Wen-Long Chou, Ni-Ting Chu
  • Publication number: 20110049663
    Abstract: A structure of photodiode array includes a first electrode on which a plurality of second electrodes is arranged in a spaced manner forming an array and a plurality of isolation sections, which is each formed between adjacent ones of the spaced and arrayed second electrodes, whereby in carrying out tests of light currents, correct detection of the light currents can be realized to improve cross-talking between adjacent dodoes so as to effectively suppress interference of noise and alleviate the problem of low S/N ratio.
    Type: Application
    Filed: August 26, 2009
    Publication date: March 3, 2011
    Inventors: Wen-Long Chou, Ni-Ting Chu, Chiung-Jeng Wang
  • Publication number: 20100283111
    Abstract: Disclosed is an improved photo detector, which includes a substrate, a light reception chip, and a coating layer. The substrate includes a first electrode member and a second electrode member. The light reception chip is set on the substrate and is electrically connected to the first and second electrode members of the substrate. The coating layer is formed on the light reception chip and functions to filter out visible light and allows only invisible light to transmit therethrough. As such, efficacies of receiving only visible light and minimizing the overall size can be realized.
    Type: Application
    Filed: May 7, 2009
    Publication date: November 11, 2010
    Inventors: Wen-Long Chou, Ni-Tang Chu
  • Publication number: 20100276596
    Abstract: A method for adjusting output ratio of an optic sensor includes the following steps: measuring and obtaining a response spectrum of the optic sensor; analyzing optic response ratios of the response spectrum at different wavelengths; designing a ratio of light reception areas of the optic sensor, the design being carried out in accordance with three aspects of “the response spectrum” “a fixed proportional relationship being present between multiplication of the optic response ratio and the light reception area and an output of light current” and “a proportional relationship being present between the light reception area and the output of the light current”; and obtaining light current outputs of identical proportions (such as 1:1:1) or in a desired ratio (meaning any arbitrary ratio other than 1:1:1, such as 1:2:1, 1:2:3, or 3:4:5) in accordance with the design of the previous step.
    Type: Application
    Filed: April 29, 2009
    Publication date: November 4, 2010
    Inventors: Wen-Long Chou, Ni-Ting Chu
  • Publication number: 20100116970
    Abstract: A photo detection device includes a first lead frame, a second lead frame, a photo detection die having a coating layer, and an enclosure. The first lead frame forms a carriage section. The coating layer is formed on the photo detection die. The photo detection die is mounted on the carriage section of the first lead frame and forms electrical connection with the second lead frame through a conductor. The enclosure is a non-light-transmittable member forming therein a receiving space. The enclosure is mounted on the first and second lead frames and receives the photo detection die in the receiving space thereof. The enclosure forms an opening for light detection by the photo detection die. As such, detection of a long wavelength invisible light, such as an infrared light, by the photo detection die can be prevented to thereby provide a photo detection device with increased reliability of detection.
    Type: Application
    Filed: November 12, 2008
    Publication date: May 13, 2010
    Inventors: Wen-Long Chou, Ni-Ting Chu
  • Publication number: 20070090488
    Abstract: A high-efficiency matrix-type LED device comprises an epitaxial wafer on which a plurality of independently insulated LEDs are formed by a method of manufacturing integrated circuits; and a conducting line mounted on each one of the LEDs by an evaporation method for forming a large-sized matrix-type LED unit capable of increasing brightness, simplifying manufacturing procedure, and saving manufacturing cost effectively. In addition, a sub-mount having a two-way Zener diode embedded therein is applied to the matrix-type LED unit. By mounting the matrix-type LED unit on the sub-mount, the two-way Zener diode can protect the LEDs against damage from electrostatic discharge (ESD) so as to increase lifetime of LEDs.
    Type: Application
    Filed: October 24, 2005
    Publication date: April 26, 2007
    Inventors: Chi-Jen Teng, Wen-Long Chou, Kuo-Jui Huang
  • Patent number: 7148515
    Abstract: A LED-based light emitting device having integrated rectifier circuit driven directly by an AC voltage and a related fabrication method is provided herein. The light emitting mainly contains a lower substrate and an upper substrate. The lower substrate has a built-in rectifier circuit and appropriate electrical contacts of the rectifier circuit are exposed on the top surface of the lower substrate. The upper substrate contains multiple LEDs arranged in an N×M array and the LEDs are all electrically insulated from each other. Metallic plating techniques are applied to establish electrical connection between these LEDs so that they jointly form a circuit matching the rectifier circuit on the lower substrate. The two substrates are faced towards each other and metallic bumps are applied to connect the LED circuit on the upper substrate to the rectifier circuit on the lower substrate, completing a fully function light emitting device.
    Type: Grant
    Filed: January 7, 2006
    Date of Patent: December 12, 2006
    Assignee: Tyntek Corp.
    Inventors: Kuo-Jui Huang, Wen-Long Chou, Chia-Pin Sung