Patents by Inventor Wen-Lu Tai

Wen-Lu Tai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20020084098
    Abstract: A high frequency-resistant enamelled wire including a metal conductor as a core having a diameter of 0.1 to 1.5 mm and a coat layer superimposed on the core having a thickness of 0.079 to 0.13 mm. The high frequency-resistant insulated winding wire has excellent adhesion on the core and are mainly used in power supply transformers and winding materials for high frequency in electrical machines.
    Type: Application
    Filed: May 4, 2001
    Publication date: July 4, 2002
    Applicant: TAI-I ELECTRIC WIRE & CABLE CO., LTD
    Inventors: Chih-Min Jang, Ru-Shi Liu, Chi-Ting Du, Wen-Lu Tai, Yao-Chung Tu, Wen-Hsiung Liu, Wen-Chang Wu, Yung-Chin Lin, Shang-Yen Chang
  • Patent number: 6376073
    Abstract: A high frequency-resistant thermosetting coating is provided for the manufacture of high frequency-resistant enamelled wires. A high frequency-resistant enamelled wire produced from the high frequency-resistant thermosetting coating is also provided. The adhesion, crosslinking density, abrasion resistance, and softening resistance of the coating are excellent. With the same nominal diameter and a coating thickness more than 85 &mgr;m, the high frequency resistant lifetime of the enamelled wire produced from the high frequency-resistant thermosetting coating is 3 to 4 times as that of conventional thermoplastic enamelled wires.
    Type: Grant
    Filed: January 20, 2000
    Date of Patent: April 23, 2002
    Assignee: Tai-Electric Wire & Cable Co., Ltd.
    Inventors: Chih-Min Jang, Ru-Shi Liu, Chi-Ting Du, Wen-Cheng Wu, Yung-Chin Lin, Shang-Yen Chang, Wen-Lu Tai, Yao-Chung Tu, Wen-Hsiung Liu