Abstract: An internal circuit structure of a semiconductor chip with array-type bonding pads. The semiconductor chip has a plurality of bonding pads located about periphery of the semiconductor chip, a plurality of signal circuit macros being positioned inside the bonding pads of the semiconductor chip, and an electro-static discharge clamping circuit ring between the signal circuit macros and the inner row of the bonding pads. The bonding pads are positioned in at least four rows along each side of the semiconductor chip, in which the four rows has an inner row, a mid-inner row, a mid-outer row, and an outer row. The inner row and the mid-inner row of the bonding pads consist of signal pads, and the outer row and the mid-outer row of the bonding pads consist of power pads and ground pads. Each of the signal circuit macros is positioned to align to the corresponding bonding pads.

Abstract: A package of a semiconductor chip with array-type bonding pads. The semiconductor chip has a plurality of bonding pads located about periphery of the chip, in which the semiconductor chip is characterized at the bonding pads being positioned in at least four rows along each side of the chip, the four rows comprising an inner row, a mid-inner row, a mid-outer row, and an outer row. The inner row and the mid-inner row of the bonding pads consist of signal pads, and the outer row and the mid-outer row of the bonding pads consist of power pads and ground pads.

Abstract: An internal circuit structure of a semiconductor chip with array-type bonding pads. The semiconductor chip has a plurality of bonding pads located about periphery of the semiconductor chip, a plurality of signal circuit macros being positioned inside the bonding pads of the semiconductor chip, and an electro-static discharge clamping circuit ring between the signal circuit macros and the inner row of the bonding pads. The bonding pads are positioned in at least four rows along each side of the semiconductor chip, in which the four rows has an inner row, a mid-inner row, a mid-outer row, and an outer row. The inner row and the mid-inner row of the bonding pads consist of signal pads, and the outer row and the mid-outer row of the bonding pads consist of power pads and ground pads. Each of the signal circuit macros is positioned to align to the corresponding bonding pads.

Abstract: An internal circuit structure of a semiconductor chip with array-type bonding pads The semiconductor chip has a plurality of bonding pads located about periphery of the semiconductor chip, a plurality of signal circuit macros being positioned inside the bonding pads of the semiconductor chip, and an electrostatic discharge clamping circuit ring between the signal circuit macros and the inner row of the bonding pads. The bonding pads are positioned in at least four rows along each side of the semiconductor chip, in which the four rows has an inner row, a mid-inner row, a mid-outer row, and an outer row. The inner row and the mid-inner row of the bonding pads consist of signal pads, and the outer row and the mid-outer row of the bonding pads consist of power pads and ground pads. Each of the signal circuit macros is positioned to align to the corresponding bonding pads.

Abstract: A cool-wrought pressing forming method for slotted headless screws includes five steps of using five different molds and five pressing heads for processing a unit of screw material cut from linear material for forming an unfinished screw with a slot in an upper end. A clamping member is provided for clamping a screw material for moving it from a first mold in a first step to a second mold in a second step after pressed by a first pressing head and then from a second step to a third mold in a third step, and so forth. The slot of a screw is formed by pressing to make the slot neat and without any hairy sides and look very flat, enhancing production effect and lowering cost.

Abstract: A package of a semiconductor chip with array-type bonding pads. The semiconductor chip has a plurality of bonding pads located about periphery of the chip, in which the semiconductor chip is characterized at the bonding pads being positioned in at least four rows along each side of the chip, the four rows comprising an inner row, a mid-inner row, a mid-outer row, and an outer row. The inner row and the mid-inner row of the bonding pads consist of signal pads, and the outer row and the mid-outer row of the bonding pads consist of power pads and ground pads.