Patents by Inventor Wen-Lung Lai

Wen-Lung Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packaging substrate having a holder, method of fabricating the packaging substrate, package structure having a holder, and method of fabricating the package structure
    Patent number: 9916990
    Abstract: A packaging substrate includes a holder, a first conductive pad disposed on the holder, a core layer disposed on the holder, a circuit layer disposed on the core layer, a plurality of conductive vias disposed in the core layer, and an insulating protection layer disposed on the core layer, wherein the first electrical pad is embedded in the core layer. By combining the holder on one side of the packaging substrate, cracks due to over-thinness can be prevented during transferring or packaging. A method of fabricating the packaging substrate, a package structure having a holder, a method of fabricating the package structure are also provided.
    Type: Grant
    Filed: December 1, 2015
    Date of Patent: March 13, 2018
    Assignee: Unimicron Technology Corp.
    Inventors: Wen-Lung Lai, Yuan-Liang Lo
  • Integrated circuit and manufacturing method thereof
    Patent number: 9721883
    Abstract: Integrated circuits and manufacturing methods of the same are disclosed. The integrated circuit includes a transistor, a first dielectric layer, an etch stop layer, a first via and a first conductive layer. The first dielectric layer is disposed between the transistor and the etch stop layer. The first via is disposed in the first dielectric layer and the etch stop layer, and electrically connected to the transistor. The first conductive layer is in contact with the first via, wherein the first via is disposed between the first conductive layer and the transistor, and the etch stop layer is aside a portion of the first via adjacent to the first conductive layer.
    Type: Grant
    Filed: March 4, 2016
    Date of Patent: August 1, 2017
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wen-Lung Lai, Chen-Chieh Chiang, Chi-Cherng Jeng, Shiu-Ko JangJian
  • PACKAGING SUBSTRATE HAVING A HOLDER, METHOD OF FABRICATING THE PACKAGING SUBSTRATE, PACKAGE STRUCTURE HAVING A HOLDER, AND METHOD OF FABRICATING THE PACKAGE STRUCTURE
    Publication number: 20160086822
    Abstract: A packaging substrate includes a holder, a first conductive pad disposed on the holder, a core layer disposed on the holder, a circuit layer disposed on the core layer, a plurality of conductive vias disposed in the core layer, and an insulating protection layer disposed on the core layer, wherein the first electrical pad is embedded in the core layer. By combining the holder on one side of the packaging substrate, cracks due to over-thinness can be prevented during transferring or packaging. A method of fabricating the packaging substrate, a package structure having a holder, a method of fabricating the package structure are also provided.
    Type: Application
    Filed: December 1, 2015
    Publication date: March 24, 2016
    Inventors: Wen-Lung Lai, Yuan-Liang Lo
  • Packaging substrate having a holder, method of fabricating the packaging substrate, package structure having a holder, and method of fabricating the package structure
    Patent number: 9230899
    Abstract: A packaging substrate includes a holder, a first conductive pad disposed on the holder, a core layer disposed on the holder, a circuit layer disposed on the core layer, a plurality of conductive vias disposed in the core layer, and an insulating protection layer disposed on the core layer, wherein the first electrical pad is embedded in the core layer. By combining the holder on one side of the packaging substrate, cracks due to over-thinness can be prevented during transferring or packaging. A method of fabricating the packaging substrate, a package structure having a holder, a method of fabricating the package structure are also provided.
    Type: Grant
    Filed: February 28, 2012
    Date of Patent: January 5, 2016
    Assignee: Unimicron Technology Corporation
    Inventors: Wen-Lung Lai, Yuan-Liang Lo
  • PACKAGING SUBSTRATE HAVING A HOLDER, METHOD OF FABRICATING THE PACKAGING SUBSTRATE, PACKAGE STRUCTURE HAVING A HOLDER, AND METHOD OF FABRICATING THE PACKAGE STRUCTURE
    Publication number: 20130083503
    Abstract: A packaging substrate includes a holder, a first conductive pad disposed on the holder, a core layer disposed on the holder, a circuit layer disposed on the core layer, a plurality of conductive vias disposed in the core layer, and an insulating protection layer disposed on the core layer, wherein the first electrical pad is embedded in the core layer. By combining the holder on one side of the packaging substrate, cracks due to over-thinness can be prevented during transferring or packaging. A method of fabricating the packaging substrate, a package structure having a holder, a method of fabricating the package structure are also provided.
    Type: Application
    Filed: February 28, 2012
    Publication date: April 4, 2013
    Applicant: UNIMICRON TECHNOLOGY CORPORATION
    Inventors: Wen-Lung Lai, Yuan-Liang Lo