Patents by Inventor Wen-Lung Liu

Wen-Lung Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140179294
    Abstract: In a method for transferring communication sessions between a first and a second electronic devices, an incoming call message is sent to the second electronic device when the first electronic device receives an incoming call. The first electronic device answers the incoming call when receiving an agreed response signal from the second electronic device. Audio/video data is transmitted between the second electronic device and a caller of the incoming call through the first electronic device. The first electronic device terminates the incoming call when the caller hangs up the incoming call, or when receiving a termination command from the second electronic device.
    Type: Application
    Filed: December 17, 2013
    Publication date: June 26, 2014
    Applicant: CHIUN MAI COMMUNICATION SYSTEMS, INC.
    Inventor: WEN-LUNG LIU
  • Patent number: 7347610
    Abstract: A light guide plate has a light exiting side, a reflection side opposite to the light exiting side, and a light entering side. A plurality of miniature diffusing entities, each having a curved surface and two slant surfaces extending from the two ends of the curved surface, are formed on the light entering side. The combination of the curved surface and the two slant surfaces cause light emitted from point-like light sources to have wider incident angles and be uniformly scattered into the light guide plate.
    Type: Grant
    Filed: January 26, 2005
    Date of Patent: March 25, 2008
    Assignee: Radiant Opto-Electronics Corporation
    Inventors: Chia-Yin Chang, Kuan-Ling Tseng, Kuan-Tun Chen, Wen-Lung Liu, Yung-Jen Chen
  • Publication number: 20070159292
    Abstract: An over-current protective device is characterized by comprising: a fuse cover, a fusible body disposed therein, and a first electrode and a second electrode respectively extending from the two ends of the fusible body. A method for fabricating the over-current protective device comprises the following steps: stamping a conductive metal sheet to form a frame with a base having two ends respectively extending as a supporting plate, and soldering a fusible unit containing the fusible body between the supporting plates; disposing the frame having the soldered fusible unit into a mold, putting a polymeric material into the mold for covering the fusible body and the supporting plates, and molding the fusible body into a required shape; taking out the frame covered by the polymeric material and cutting the base off so as to obtain an over-current protective device having two electrode plates extending from two ends thereof.
    Type: Application
    Filed: January 11, 2007
    Publication date: July 12, 2007
    Inventors: Kun-Huang Chang, Wen-Lung Liu
  • Patent number: 7138900
    Abstract: The present invention relates to a resetable over-current protection device. The device is characterized in that: disconnected areas are maintained at end faces of formed cutting regions of the protection device, wherein one or two of the end faces of the formed cutting regions are partly formed with electrically conductive layers so as to increase the lifespan of the device and allows easy manufacturing of the device. The present invention also provides a method of manufacturing the resetable over-current protection device. The method is characterized in that a polymer-based sheet is divided into a plurality of components from which resetable over-current protection devices are subsequently manufactured into the resetable over-current protection devices to save the cost of material.
    Type: Grant
    Filed: May 25, 2004
    Date of Patent: November 21, 2006
    Assignee: Inpaq Technology Co., Ltd.
    Inventors: Wen-Lung Liu, Chi-Hao Chiu, Kang-Neng Hsu, Szu-Lung Sun
  • Patent number: 7123125
    Abstract: The present invention is directed to a structure of a surface mounted resettable over-current protection device and a method for manufacturing the same. First, a raw material substrate having two ends is provided. On each of the two ends of the raw material substrate, a patterned conducting metal foil is formed. Then, the raw material substrate is cut to form a grid-shaped substrate having a plurality of strip-shaped structural parts. An insulating layer is formed to enclose the whole grid-shaped substrate, allowing parts of the patterned metal foil layers on the ends of the strip-shaped structural parts to be exposed. Next, the strip-shaped structural parts of the grid-shaped substrate are cut into a plurality of chips, each chip having two cut sections. Finally, two terminal electrodes are formed on the both cut sections of each chip.
    Type: Grant
    Filed: April 14, 2005
    Date of Patent: October 17, 2006
    Assignee: Inpaq Technology Co., Ltd.
    Inventor: Wen-Lung Liu
  • Publication number: 20060164863
    Abstract: A light guide plate that can uniformly scatter lights emitted from point light sources is provided. The light guide plate has a light exiting side, a reflection side opposite to the light exiting side, and a light entering side. On the light entering side, there are multiple miniature diffusing entities. Each of the diffusing entities has a curved surface and two slant surfaces extending from the two ends of the curved surface to the light entering side. The curved surface causes the lights from the light sources to undergo multiple-angled refractions. The two slant surfaces cause the lights from the light sources to undergo fixed-angled refraction in both left and right directions. As such, the lights emitted form the light sources could have wider incident angles and could be uniformly scattered into the light guide plate.
    Type: Application
    Filed: January 26, 2005
    Publication date: July 27, 2006
    Inventors: Chia-Yin Chang, Kuan-Ling Tseng, Kuan-Tun Chen, Wen-Lung Liu, Yung-Jen Chen
  • Publication number: 20050190522
    Abstract: The present invention is directed to a structure of a surface mounted resettable over-current protection device and a method for manufacturing the same. First, a raw material substrate having two ends is provided. On each of the two ends of the raw material substrate, a patterned conducting metal foil is formed. Then, the raw material substrate is cut to form a grid-shaped substrate having a plurality of strip-shaped structural parts. An insulating layer is formed to enclose the whole grid-shaped substrate, allowing parts of the patterned metal foil layers on the ends of the strip-shaped structural parts to be exposed. Next, the strip-shaped structural parts of the grid-shaped substrate are cut into a plurality of chips, each chip having two cut sections. Finally, two terminal electrodes are formed on the both cut sections of each chip.
    Type: Application
    Filed: April 14, 2005
    Publication date: September 1, 2005
    Inventor: Wen-Lung Liu
  • Publication number: 20040252433
    Abstract: The present invention relates to a resetable over-current protection device. The device is characterized in that: disconnected areas are maintained at end faces of formed cutting regions of the protection device, wherein one or two of the end faces of the formed cutting regions are partly formed with electrically conductive layers so as to increase the lifespan of the device and allows easy manufacturing of the device. The present invention also provides a method of manufacturing the resetable over-current protection device. The method is characterized in that a polymer-based sheet is divided into a plurality of components from which resetable over-current protection devices are subsequently manufactured into the resetable over-current protection devices to save the cost of material.
    Type: Application
    Filed: May 25, 2004
    Publication date: December 16, 2004
    Applicant: INPAQ TECHNOLOGY CO., LTD.
    Inventors: Wen-Lung Liu, Chi-Hao Chiu, Kang-Neng Hsu, Szu-Lung Sun
  • Publication number: 20040245509
    Abstract: A method for processing polymeric positive temperature coefficient conductive material comprising the steps of placing a polymer material inside a plasma processor and then evacuating air therein to form a vacuum state, supplying a reactive gas to the plasma processor; and utilizing a radio frequency power generator for generating a plasma state inside the plasma processor, wherein the reactive gas is being excited to a high-level energy state, and the excited gas will attack the surface of the material to generate active sites. After that, the plasma-treated polymer material is exposed to air, and the radicals resided on the surface of the material will absorb moisture to form peroxide. The material is ground into powder before being placed inside the plasma processor, so that the contact surface can be increased to generate more radicals.
    Type: Application
    Filed: January 5, 2004
    Publication date: December 9, 2004
    Applicant: INPAQ TECHNOLOGY CO., LTD.
    Inventors: Wen-Lung Liu, Kun-Huang Chang
  • Publication number: 20020186519
    Abstract: The present invention is directed to a structure of a surface mounted resettable over-current protection device and a method for manufacturing the same. First, a raw material substrate having two ends is provided. On each of the two ends of the raw material substrate, a patterned conducting metal foil is formed. Then, the raw material substrate is cut to form a grid-shaped substrate having a plurality of strip-shaped structural parts. An insulating layer is formed to enclose the whole grid-shaped substrate, allowing parts of the patterned metal foil layers on the ends of the strip-shaped structural parts to be exposed. Next, the strip-shaped structural parts of the grid-shaped substrate are cut into a plurality of chips, each chip having two cut sections. Finally, two terminal electrodes are formed on the both cut sections of each chip.
    Type: Application
    Filed: November 16, 2001
    Publication date: December 12, 2002
    Applicant: Inpaq Technology Co., Ltd.
    Inventor: Wen-Lung Liu