Abstract: A high-powered diode holder and a package thereof are disclosed. The high-powered diode holder includes a base and a plurality of metal electrodes. The base is made of ceramic. In the interior part of one end of the base, there is a functional area that is indented inwards. In the functional area, there are a plurality of through-hole units and a plurality of conducting areas whose polarities are different. The second end of the base is connected with a heat-conducting base. The metal electrodes are individually connected with the base, and the metal electrodes are electrically connected with the corresponding conducting areas respectively. In the functional area, there are a plurality of LED chips that correspond to the through-hole units respectively. The LED chips and the conducting areas are connected with conducting-wires respectively, and a package resin element covers the functional areas of the base.

Abstract: A frame structure includes a first metallic frame, a second metallic frame, and a plastic housing. The first metallic frame has extension portions extending outwardly, and the first metallic frame is separately positioned from the second metallic frame. The first metallic frame and the second metallic frame respectively have different electrical polarities. The plastic housing is connected with the first metallic frame and the second metallic frame, and the plastic housing and the two extension portions form a receiving space so the two extension portions are positioned at two ends of the plastic housing. The plastic housing receives the LED die and a packaging layer. The extension portions expose out of the plastic housing or are nestled within the plastic housing. The frame structure has a good efficiency of heat dissipation because the metal is not transparent and efficiency of heat dissipation is high without light leakage.

Abstract: A package allowing agile deployment of the location of each LED chip includes a heat slug to secure multiple LED chips, two lead frames, a conducting area extending along the edge of the heat slug, and a non-conductive material that connects the heat slug and the lead frame for those multiple LED chips to connect to the conducting area by means of a gold wire without being subject to the presence of the lead frame.

Abstract: A surface mount device (SMD) light emitting diode (LED) package structure is disclosed. The structure includes a cup-structure substrate, a lead frame, an LED chip, a set of conducting wires, and a transparent or semi-transparent seal. The inner or outer surface of the cup-structure substrate includes a plurality of indentations that may be different in number, size, depth, and shape. The indentations are formed by injection molding techniques or pressure stamping. By filling the indentations with the transparent or semi-transparent seal, the SMD LED package structure is able to enhance the attachment between the cup-structure substrate and the seal and thereby effectively prevent any separation from the two bodies as a result of an external force.