Abstract: The present application provides a heat dissipation system and method for electronic devices. The system includes a heat dissipation unit attached to electronic component of an electronic device, a temperature and humidity sensor, a cooling unit and a controller. The controller is configured to obtain the dew point temperature of the space in which the cooling unit is disposed and to determine a coolant flow rate based on the dew point and the coolant temperature. In the event where the difference between the coolant temperature and the dew point is greater than a threshold, the heat dissipation unit receives the coolant under a first flow rate. In the event where the difference between the coolant temperature and the dew point is equal to or less than the threshold, the heat dissipation unit receives the coolant under a second flow rate lower than the first flow rate.

Abstract: The present invention relates to a method for manufacturing a composite container with different opening sizes, which is accomplished by winding with fibers impregnated with resin. First, fibers impregnated with resin are wound on a first substrate for winding a first container, wherein first openings are positioned at both ends of the first container. Then, cut the first container into two shells with a first opening each, and slip one of the shells on a second substrate. Next, fibers impregnated with resin is used for winding the second substrate and the shell such that the fibers impregnated with resin wound on the second substrate and the shell are combined to form a second container, where both ends of the second container are the first opening and a second opening with different opening sizes. Thereby, filament winding can be applied for manufacturing containers with different opening sizes on both ends, and the technique of manufacturing and performance of containers are enhanced.

Abstract: The present invention relates to a method for manufacturing a composite container with different opening sizes, which is accomplished by winding with fibers impregnated with resin. First, fibers impregnated with resin are wound on a first substrate for winding a first container, wherein first openings are positioned at both ends of the first container. Then, cut the first container into two shells with a first opening each, and slip one of the shells on a second substrate. Next, fibers impregnated with resin is used for winding the second substrate and the shell such that the fibers impregnated with resin wound on the second substrate and the shell are combined to form a second container, where both ends of the second container are the first opening and a second opening with different opening sizes. Thereby, filament winding can be applied for manufacturing containers with different opening sizes on both ends, and the technique of manufacturing and performance of containers are enhanced.

Abstract: A method for manufacturing knockdown safety soft floor tiles. The method includes steps of cleaning up an oil layer on the surface of the EVA board, using photography to print a predetermined picture on transfer printing paper, attaching the transfer printing paper with the picture to the surface of the EVA board, rolling and compressing the transfer printing paper with a high temperature roller, tearing away the transfer printing paper and leaving the picture on the EVA board and cutting the EVA board to have predetermined dimensions defining a floor tile.