Abstract: An active heat-dissipating mechanism includes a fan module, an airflow-guiding part and an airflow shunt part. The fan module includes an airflow inlet and an airflow outlet. The airflow-guiding part is disposed at the same side of the airflow outlet of the fan module and in communication with the fan module. An airflow channel is defined by the airflow-guiding part. An airflow inhaled by the fan module is guided to a hotspot region of the electronic device through the airflow channel so as to remove the heat generated from the hotspot region. The airflow shunt part is formed on the airflow-guiding part. The airflow shunt part defines a stopping block in the airflow channel. A portion of the airflow is hindered by the stopping block and guided into a sub-hotspot region of the electronic device so as to remove the heat generated from the sub-hotspot region.

Abstract: An active heat-dissipating mechanism includes a fan module, an airflow-guiding part and an airflow shunt part. The fan module includes an airflow inlet and an airflow outlet. The airflow-guiding part is disposed at the same side of the airflow outlet of the fan module and in communication with the fan module. An airflow channel is defined by the airflow-guiding part. An airflow inhaled by the fan module is guided to a hotspot region of the electronic device through the airflow channel so as to remove the heat generated from the hotspot region. The airflow shunt part is formed on the airflow-guiding part. The airflow shunt part defines a stopping block in the airflow channel. A portion of the airflow is hindered by the stopping block and guided into a sub-hotspot region of the electronic device so as to remove the heat generated from the sub-hotspot region.

Abstract: An electronic device includes a casing, a plug, a fixing plate, a circuit board and a first retaining part. The casing has a support member and multiple perforations. The plug has a rotating shaft and multiple pins. The pins are mounted on the rotating shaft. The rotating shaft is pivotally supported on the support member such that the pins are rotatable with respect to the rotating shaft. The pins are substantially perpendicular to the casing when the pins are rotated to a first position. The pins are received in the perforations when the pins are rotated to a second position. The fixing plate is disposed on the support member. The circuit board includes multiple contact elements corresponding to the pins. The first retaining part is engaged with or sustained against an engaging part of the rotating shaft, thereby positioning the pins of the plug in the first position.

Abstract: A heat sink fastening device is used for facilitating fixing a heat sink on a circuit board. The heat sink fastening device includes a first connecting portion, a second connecting portion and at least a connecting member. The first connecting portion is included in the circuit board. The second connecting portion is included in the heat sink. The connecting member is disposed on a first surface of the circuit board and includes a first connecting part and a second connecting part. The first connecting part is coupled to the first connecting portion of the circuit board and the second connecting part is coupled to the second connecting portion of the heat sink, thereby facilitating fixing the heat sink on the first surface of the circuit board.

Abstract: An electronic device includes a casing, a plug, a fixing plate, a circuit board and a first retaining part. The casing has a support member and multiple perforations. The plug has a rotating shaft and multiple pins. The pins are mounted on the rotating shaft. The rotating shaft is pivotally supported on the support member such that the pins are rotatable with respect to the rotating shaft. The pins are substantially perpendicular to the casing when the pins are rotated to a first position. The pins are received in the perforations when the pins are rotated to a second position. The fixing plate is disposed on the support member. The circuit board includes multiple contact elements corresponding to the pins. The first retaining part is engaged with or sustained against an engaging part of the rotating shaft, thereby positioning the pins of the plug in the first position.

Abstract: An electronic device with a waterproof structure includes a housing structure, a printed circuit board and a protective layer. The housing structure includes a receptacle, a first opening and a second opening. The printed circuit board is disposed within the receptacle and includes plural electronic components and electrical trace patterns thereon. The protective layer is formed on at least a portion of the electronic components and the electrical trace patterns to protect the printed circuit board from moisture attack.

Abstract: A heat sink fastening device is used for facilitating fixing a heat sink on a circuit board. The heat sink fastening device includes a first connecting portion, a second connecting portion and at least a connecting member. The first connecting portion is included in the circuit board. The second connecting portion is included in the heat sink. The connecting member is disposed on a first surface of the circuit board and includes a first connecting part and a second connecting part. The first connecting part is coupled to the first connecting portion of the circuit board and the second connecting part is coupled to the second connecting portion of the heat sink, thereby facilitating fixing the heat sink on the first surface of the circuit board.

Abstract: An inlet airflow guiding structure for a computer includes a computer chassis, a front bezel, an airflow guiding space defined between the front bezel and the computer chassis, and a plurality of inlet airflow openings. The airflow guiding space and the inlet airflow openings provide a low airflow impedance inlet that facilitates the movement of the incoming inlet airflow. The front cooling fan in the computer is thereby capable of providing lower-temperature air into computer for efficiently dissipating heat generated for high-speed CPU.

Abstract: A heat dissipating system provides a fast heat dissipating airflow stream inside a desktop computer and thereby greatly enhances the heat dissipating efficiency of the desktop computer. The computer heat dissipating system includes a computer chassis which has a circular opening bored on its front plate, a motherboard which has a thermal module including a front cooling fan and a set of chipsets heatsink module installed on its top surface, and a power supply with a cooling fan. The thermal module, the chipsets heatsink module, and the power supply are aligned along a single heat dissipating airflow stream. The external low temperature air first passes through the thermal module and removes the heat generated by the central processing unit, further flows into the chipsets heatsink module and removes the heat generated by the MCH chipsets and ICH chipsets, and finally enters into the power supply and removes the heat generated by the power supply.

Abstract: An inlet airflow guiding structure for a computer includes a computer chassis, a front bezel, an airflow guiding space defined between the front bezel and the computer chassis, and a plurality of inlet airflow openings. The airflow guiding space and the inlet airflow openings provide a low airflow impedance inlet that facilitates the movement of the incoming inlet airflow. The front cooling fan in the computer is thereby capable of providing lower-temperature air into computer for efficiently dissipating heat generated for high-speed CPU.

Abstract: An inlet airflow guiding structure for a computer includes a computer chassis, a front bezel, an airflow guiding space defined between the front bezel and the computer chassis, and a plurality of inlet airflow openings. The airflow guiding space and the inlet airflow openings provide a low airflow impedance inlet that facilitates the movement of the incoming inlet airflow. The front cooling fan in the computer is thereby capable of providing lower-temperature air into computer for efficiently dissipating heat generated for high-speed CPU.

Abstract: An inlet airflow guiding structure for a computer includes a computer chassis, a front bezel, an airflow guiding space defined between the front bezel and the computer chassis, and a plurality of inlet airflow openings. The airflow guiding space and the inlet airflow openings provide a low airflow impedance inlet that facilitates the movement of the incoming inlet airflow. The front cooling fan in the computer is thereby capable of providing lower-temperature air into computer for efficiently dissipating heat generated for high-speed CPU.

Abstract: A heat dissipating system provides a fast heat dissipating airflow stream inside a desktop computer and thereby greatly enhances the heat dissipating efficiency of the desktop computer. The computer heat dissipating system includes a computer chassis which has a circular opening bored on its front plate, a motherboard which has a thermal module including a front cooling fan and a set of chipsets heatsink module installed on its top surface, and a power supply with a cooling fan. The thermal module, the chipsets heatsink module, and the power supply are aligned along a single heat dissipating airflow stream. The external low temperature air first passes through the thermal module and removes the heat generated by the central processing unit, further flows into the chipsets heatsink module and removes the heat generated by the MCH chipsets and ICH chipsets, and finally enters into the power supply and removes the heat generated by the power supply.

Abstract: A computer bezel with an inlet airflow guiding device, which is not only suitable for a computer chassis with the BTX specification, but also able to provide a desktop computer an attractive appearance. The computer bezel with an inlet airflow guiding device includes a computer chassis, a front bezel, an inlet airflow guiding member, an airflow guiding space, and a plurality of inlet airflow openings. The airflow guiding space and the inlet airflow openings provide a low airflow impedance inlet that facilitates the movement of the incoming inlet airflow. The front cooling fan is thereby capable of providing the high power components of the desktop computer with low temperature air at a high velocity.

Abstract: A transformer with an associated heat-dissipating plastic element is provided. The transformer includes a hollow main body, a core, a coil and a heat-dissipating plastic element. The core is installed inside the hollow main body while the coil wraps around the core. The heat-dissipating plastic element is also installed inside the hollow main body. The heat-dissipating plastic element encloses the core and the coil. Alternatively, the heat-dissipating plastic element encloses the hollow main body, the core and the coil so that heat generated by the coil may be directly conducted away to the exterior through the heat-dissipating plastic element.

Abstract: A heat dissipation apparatus, suitable for use to direct the heat generated from an electric appliance that has a circuit board, on which several electronic devices (heat sources) are formed. The heat dissipation apparatus has a main heat sink and several connecting heat sinks. The main heat sink is mounted on each electronic device, while the connecting heat sinks are disposed between the electronic devices and the main heat sink, allowing the heat generated from each electronic device to be conducted to the main heat sink. The heat dissipation apparatus is assembled in various kinds of electric appliances such as power supply or other electric products.

Abstract: A heat dissipation apparatus, suitable for use to direct the heat generated from an electric appliance that has a circuit board, on which several electronic devices (heat sources) are formed. The heat dissipation apparatus has a main heat sink and several connecting heat sinks. The main heat sink is mounted on each electronic device, while the connecting heat sinks are disposed between the electronic devices and the main heat sink, allowing the heat generated from each electronic device to be conducted to the main heat sink. The heat dissipation apparatus is assembled in various kinds of electric appliances such as power supply or other electric products.

Abstract: A transformer with an associated heat-dissipating plastic element is provided. The transformer includes a hollow main body, a core, a coil and a heat-dissipating plastic element. The core is installed inside the hollow main body while the coil wraps around the core. The heat-dissipating plastic element is also installed inside the hollow main body. The heat-dissipating plastic element encloses the core and the coil. Alternatively, the heat-dissipating plastic element encloses the hollow main body, the core and the coil so that heat generated by the coil may be directly conducted away to the exterior through the heat-dissipating plastic element.

Abstract: An electric appliance for providing a closed space to protect a power input element thereof is disclosed. The electric appliance includes an electronic module, an isolation device integrally formed with the electronic module for mounting the power input element therein, and an open-shut device moveably connected to the isolation device for opening and shutting the isolation device, thereby providing the closed space to protect the power input element form the external damage.