Abstract: Present disclosure provides a method for forming a semiconductor packaged wafer, including providing a semiconductor package having a die on a first side of a wafer, partially molding the die by disposing molding material on the first side of the wafer, a peripheral of the first side is free of molding material at a completion of the partially molding, and bonding the semiconductor package with a carrier from the first side of the wafer. Present disclosure also provides a semiconductor packaged wafer, including a die on a first side of a wafer, a molding encapsulating the die and partially positioning on the first side of the wafer by retracting from a peripheral of the first side of the wafer, and a sealing structure on the peripheral of the first side of the wafer.

Abstract: External electrical connectors and methods of forming such external electrical connectors are discussed. A method includes forming an external electrical connector structure on a substrate. The forming the external electrical connector structure includes plating a pillar on the substrate at a first agitation level affected at the substrate in a first solution. The method further includes plating solder on the external electrical connector structure at a second agitation level affected at the substrate in a second solution. The second agitation level affected at the substrate is greater than the first agitation level affected at the substrate. The plating the solder further forms a shell on a sidewall of the external electrical connector structure.

Abstract: An embodiment method includes providing a wafer including a first integrated circuit die, a second integrated circuit die, and a scribe line region between the first integrated circuit die and the second integrated circuit die. The method further includes forming a kerf in the scribe line region and after forming the kerf, using a mechanical sawing process to fully separate the first integrated circuit die from the second integrated circuit die. The kerf extends through a plurality of dielectric layers into a semiconductor substrate.

Abstract: A method for forming a semiconductor device structure is provided. The method includes providing a semiconductor structure. The semiconductor structure has a central portion and a peripheral portion surrounding the central portion. The method includes forming first conductive bumps and dummy conductive bumps over a surface of the semiconductor structure. The first conductive bumps are over the central portion and electrically connected to the semiconductor structure. The dummy conductive bumps are over the peripheral portion and electrically insulated from the semiconductor structure. The first conductive bumps each have a first thickness and a first width. The dummy conductive bumps each have a second thickness and a second width. The second thickness is less than the first thickness. The second width is greater than the first width.

Abstract: A method for sawing a semiconductor wafer is provided. The method includes sawing a semiconductor wafer to form a first opening. In addition, the semiconductor wafer includes a dicing tape and a substrate attached to the dicing tape by a die attach film (DAF), and the first opening is formed in an upper portion of the substrate. The method further includes sawing through the substrate and the DAF of the semiconductor wafer from the first opening to form a middle opening under the first opening and a second opening under the middle opening, so that the semiconductor wafer is divided into two dies. In addition, a slope of a sidewall of the middle opening is different from slopes of sidewalls of the first opening and the second opening.

Abstract: External electrical connectors and methods of forming such external electrical connectors are discussed. A method includes forming an external electrical connector structure on a substrate. The forming the external electrical connector structure includes plating a pillar on the substrate at a first agitation level affected at the substrate in a first solution. The method further includes plating solder on the external electrical connector structure at a second agitation level affected at the substrate in a second solution. The second agitation level affected at the substrate is greater than the first agitation level affected at the substrate. The plating the solder further forms a shell on a sidewall of the external electrical connector structure.

Abstract: An embodiment method includes providing a wafer including a first integrated circuit die, a second integrated circuit die, and a scribe line region between the first integrated circuit die and the second integrated circuit die. The method further includes forming a kerf in the scribe line region and after forming the kerf, using a mechanical sawing process to fully separate the first integrated circuit die from the second integrated circuit die. The kerf extends through a plurality of dielectric layers into a semiconductor substrate.

Abstract: External electrical connectors and methods of forming such external electrical connectors are discussed. A method includes forming an external electrical connector structure on a substrate. The forming the external electrical connector structure includes plating a pillar on the substrate at a first agitation level affected at the substrate in a first solution. The method further includes plating solder on the external electrical connector structure at a second agitation level affected at the substrate in a second solution. The second agitation level affected at the substrate is greater than the first agitation level affected at the substrate. The plating the solder further forms a shell on a sidewall of the external electrical connector structure.

Abstract: A method includes setting a first tension value of a laminating tape during a standby mode. A second tension value of the laminating tape is set during taping on a wafer. The second tension value is different from the first tension value. A third tension value of the laminating tape is set after taping. The third tension value is different from the second tension value.

Abstract: External electrical connectors and methods of forming such external electrical connectors are discussed. A method includes forming an external electrical connector structure on a substrate. The forming the external electrical connector structure includes plating a pillar on the substrate at a first agitation level affected at the substrate in a first solution. The method further includes plating solder on the external electrical connector structure at a second agitation level affected at the substrate in a second solution. The second agitation level affected at the substrate is greater than the first agitation level affected at the substrate. The plating the solder further forms a shell on a sidewall of the external electrical connector structure.

Abstract: A bonding apparatus includes a wafer stage, a first chip stage, a first transporting device, a second stage and a second transporting device. The wafer stage is used for holding a wafer. The first chip stage is used for holding at least one first chip. The first transporting device is used for transporting the first chip from the first chip stage onto the wafer. The second chip stage is used for holding at least one second chip. The second transporting device is used for transporting the second chip from the second chip stage onto the wafer.

Abstract: A method includes setting a first tension value of a laminating tape during a standby mode. A second tension value of the laminating tape is set during taping on a wafer. The second tension value is different from the first tension value. A third tension value of the laminating tape is set after taping. The third tension value is different from the second tension value.

Abstract: The invention discloses a method for production of polyhydroxybutyrate-co-polyhydroxyvalerate (PHBV) by recombinant Escherichia coli harboring plasmid containing both phaCAB and prpE. Different percentage of hydroxyvalerate can be obtained from the recombinant E. coli when cultivated in the medium containing different concentrations of propionic acid. In this patent, we provide a method that integrated all of the genes (i.e. phaCAB, vgb and prpE) required for PHBV production into a single plasmid. The plasmids were then transformed into an E. coli host. Results showed that PHBV can be produced by this recombinant E. coli, and the ration of HV to HB in the co-polymers can be regulated by addition of different concentrations of propionic acid in the medium. The percentage of HV in the co-polymers can be adjusted from about 3% up to more than 35%.

Abstract: A pen barrel assembling device includes a base with a first frame and a second frame fixed to the top of two ends of the base. A movable rod extends through the first frame and fixed to the first frame by a first fixing bolt. An end part is connected to the first end of the movable rod and the outer section is positioned in the end part. A push rod extends through the second frame and is movable toward the movable rod by pivoting a lever. The metal section is connected to the free end of the push rod. Multiple blocks are pivotably or slidably connected to the base and each block includes an engaging recess which is removably engaged with the movable rod.

Abstract: An audio and video (AV) apparatus includes a player module for playing audio and video files, generating audio and video signals, and an internal display and an internal speaker. The AV apparatus further includes: a first switch for generating first instructions; an output module for being externally connected to output the audio and video signals; and a control module connected to the first switch. The control module being configured for disabling the internal display and internal speaker at receiving the first instructions at a situation that the output module is externally connected to output the audio and video signals, and disabling the internal display while keeping the internal speaker enabled at receiving the first instruction at a situation that the output module is not externally connected. A method for controlling the audio and video apparatus is provided as well.

Abstract: An exemplary electronic device includes a controller, a first convertor, a second convertor, and a switching unit. The first convertor is configured for receiving a first voltage from an external power supply and converting the first voltage into a second voltage. The controller is coupled to the first convertor for generating a start signal when receiving the second voltage. The second convertor is connected to the controller for receiving the first voltage, converting the first voltage into a third voltage to power an operating unit of the electronic device, and converting the first voltage into a fourth voltage to power the controller when receiving the start signal. The switching unit is coupled to the controller and the first convertor for disabling the first convertor when the controller receives the fourth voltage. A related power supply unit is also provided.

Abstract: An audio apparatus includes an input, a first resistor, a first capacitor, an amplifier, a second resistor, a second capacitor, and an output. The input is used for inputting audio signals. The first resistor and the amplifier are serially connected to the input; wherein the first resistor is connected to the inverting input of the amplifier and the non-inverting input of the amplifier is connected to ground. The first capacitor has one end connected to a node between the first resistor and the inverting input of the amplifier, the other end connected to ground. The second resistor has one end connected to a node between the first resistor and the inverting input of the amplifier, the other end connected to the output of the amplifier. The second capacitor is connected between the inverting input and the output of the amplifier. The output is connected to the output of the amplifier, for outputting the audio signals after processing.

Abstract: A pen barrel assembling device includes a base with a first frame and a second frame fixed to the top of two ends of the base. A movable rod extends through the first frame and fixed to the first frame by a first fixing bolt. An end part is connected to the first end of the movable rod and the outer section is positioned in the end part. A push rod extends through the second frame and is movable toward the movable rod by pivoting a lever. The metal section is connected to the free end of the push rod. Multiple blocks are pivotably or slidably connected to the base and each block includes an engaging recess which is removably engaged with the movable rod.

Abstract: An electronic device includes an integrated circuit, a power interface, and an interface circuit connected between the integrated circuit and the power interface for protecting the integrated circuit from being damaged by electrostatic discharge. The interface circuit includes a current limit unit connected between the power interface and the integrated circuit for limiting an electrostatic discharge current and an electrostatic protection unit connected to a common node of the power interface and the current limit unit for clamping a voltage of the common node to a predetermined value. A related integrated circuit is also provided.

Abstract: A power supply system for an electronic device includes a first and a second connector, a switch, and a controller. The first connector is used for connecting to a first power source. The second connector is used for connecting to a second power source, wherein the second power source is rechargeable. The switch establishes a connection between the first connector and the second connector so as to allow the first power source to charge the second power source. The controller detects a presence of the first power source and the second power source, and controls the switch to periodically establish the connection at the absence of the second power source, and to continuously establish the connection at the presence of the second power source.