Abstract: A semiconductor package assembly is provided. The semiconductor package assembly includes first semiconductor die, a second semiconductor die and a memory package. The first semiconductor die and the second semiconductor die are stacked on each other. The first semiconductor die includes a first interface and a third interface. The first interface overlaps and is electrically connected to the second interface arranged on the second semiconductor die. The third interface is arranged on a first edge of the first semiconductor die. The memory package is disposed beside the first semiconductor die, wherein the memory package is electrically connected to the first semiconductor die by the third interface.

Abstract: A semiconductor memory package is provided. The package includes a semiconductor die having a first die portion and a second die portion. A post-passivation layer is on the semiconductor die. A first post-passivation interconnect (PPI) structure includes pluralities of first and second pads arranged in first and second tiers, respectively. The first and second pads are disposed on a first die portion of the semiconductor die. A second PPI structure includes pluralities of third and fourth pads arranged in third and fourth tiers, respectively. The third and fourth pads are disposed on a second die portion of the semiconductor die. One of the first pads and one of the fourth pads are coupled to each other by a first bonding wire. One of the second pads and one of the third pads are coupled to each other.

Abstract: An embodiment of the invention provides a clock calibration method to calibrate an internal clock signal of a computer. The method comprises: receiving an external clock signal from an external clock source; generating a pulse signal with a first duration according to the external clock signal; counting the internal clock signal according to the pulse signal to get a first count value; and calibrating the internal clock according to the first count value.

Abstract: A super I/O module for controlling at least one I/O port of a computer system is provided. The super I/O module includes a controller, a signal detector and a selector. The controller supports functions corresponding to the I/O port. The signal detector receives an input signal from the I/O port, and detects whether the input signal has an identification code. When detecting that the input signal has the identification code, the signal detector generates a selection signal according to the identification code. The selector receives the selection signal and selectively provides the input signal to the controller or a function circuit of the computer system according to the selection signal.

Abstract: An embodiment of the invention provides a clock calibration method to calibrate an internal clock signal of a computer. The method comprises: receiving an external clock signal from an external clock source; generating a pulse signal with a first duration according to the external clock signal; counting the internal clock signal according to the pulse signal to get a first count value; and calibrating the internal clock according to the first count value.

Abstract: A super I/O module for controlling at least one I/O port of a computer system is provided. The super I/O module includes a controller, a signal detector and a selector. The controller supports functions corresponding to the I/O port. The signal detector receives an input signal from the I/O port, and detects whether the input signal has an identification code. When detecting that the input signal has the identification code, the signal detector generates a selection signal according to the identification code. The selector receives the selection signal and selectively provides the input signal to the controller or a function circuit of the computer system according to the selection signal.