Patents by Inventor Wen-Pin Chuang
Wen-Pin Chuang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220216085Abstract: An electrostatic chuck is provided, the electrostatic chuck includes a base; and an insulating layer, an electrode layer, a first dielectric layer, and a second dielectric layer sequentially stacked on the base. The first dielectric layer is aluminum oxide (Al2O3) or aluminum nitride (AlN). A material of the second dielectric layer is different from a material of the first dielectric layer, and the second dielectric layer includes titanium element, IVA group element, and oxygen element.Type: ApplicationFiled: July 23, 2021Publication date: July 7, 2022Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Yung-Hsiang HUANG, Wei-Cheng TANG, Yi-Che SU, Wen-Pin CHUANG, Su-Mei CHEN WEI, Ya-Tin YU, Yun-Shan HUANG
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Publication number: 20220204682Abstract: A bio-polyol composition, a foam composition, and a foam material are provided. The bio-polyol composition includes 25-70 parts by weight of lignin; 30-75 parts by weight of non-amine-based polyol; and, 2-17 parts by weight of amine-based polyether polyol. In particular, the sum of the weight of the lignin and the non-amine-based polyol is 100 parts by weight.Type: ApplicationFiled: December 28, 2020Publication date: June 30, 2022Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Wen-Pin CHUANG, Yi-Che SU, Chia-Ling WEN
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Patent number: 11293973Abstract: An optical test equipment includes a chuck, a light receiving device corresponding in position to an opening of the chuck, a transparent heating plate disposed on the chuck or light receiving device in a way that the bottom surface of the transparent heating plate faces toward the light receiving device for a wafer to be disposed on the top surface of the transparent heating plate, allowing light to pass through the top and bottom surfaces and being powered to generate heat to heat the wafer, and a probing device including a seat and a probe protruding from the seat toward the top surface of the transparent heating plate for probing a light emitting chip of the wafer. The equipment can perform light emitting efficiency test to the light emitting chip on the wafer before dicing and heat the light emitting chip at the same time.Type: GrantFiled: November 17, 2020Date of Patent: April 5, 2022Assignee: MPI CORPORATIONInventors: Wen Pin Chuang, Yi Ching Lo
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Patent number: 11162996Abstract: A probing apparatus includes a carrier having an opening, a supporter disposed on the carrier in a way that its bottom surface faces toward the carrier, its top surface for disposition of a wafer, and its light permeable portion allowing light to pass through the top and bottom surfaces corresponding in position to the opening, an air heating device having a covering plate and an air supply unit, and a probing device having a probe protruding out of the bottom surface of the air heating device. A thermal air source provides thermal air to a heating space between the bottom surface of the air heating device and the top surface of the supporter through an air supply passage of the air supply unit. The probing apparatus can test light emitting efficiency of a light emitting chip in the wafer and heat the chip at the same time.Type: GrantFiled: September 30, 2020Date of Patent: November 2, 2021Assignee: MPI CORPORATIONInventors: Wen Pin Chuang, Yi Ching Lo, Hao Duan
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Publication number: 20210156907Abstract: An optical test equipment includes a chuck, a light receiving device corresponding in position to an opening of the chuck, a transparent heating plate disposed on the chuck or light receiving device in a way that the bottom surface of the transparent heating plate faces toward the light receiving device for a wafer to be disposed on the top surface of the transparent heating plate, allowing light to pass through the top and bottom surfaces and being powered to generate heat to heat the wafer, and a probing device including a seat and a probe protruding from the seat toward the top surface of the transparent heating plate for probing a light emitting chip of the wafer. The equipment can perform light emitting efficiency test to the light emitting chip on the wafer before dicing and heat the light emitting chip at the same time.Type: ApplicationFiled: November 17, 2020Publication date: May 27, 2021Applicant: MPI CORPORATIONInventors: WEN PIN CHUANG, YI CHING LO
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Publication number: 20210156903Abstract: A probing apparatus includes a carrier having an opening, a supporter disposed on the carrier in a way that its bottom surface faces toward the carrier, its top surface for disposition of a wafer, and its light permeable portion allowing light to pass through the top and bottom surfaces corresponding in position to the opening, an air heating device having a covering plate and an air supply unit, and a probing device having a probe protruding out of the bottom surface of the air heating device. A thermal air source provides thermal air to a heating space between the bottom surface of the air heating device and the top surface of the supporter through an air supply passage of the air supply unit. The probing apparatus can test light emitting efficiency of a light emitting chip in the wafer and heat the chip at the same time.Type: ApplicationFiled: September 30, 2020Publication date: May 27, 2021Applicant: MPI CORPORATIONInventors: WEN PIN CHUANG, YI CHING LO, HAO DUAN
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Patent number: 10913653Abstract: A method for fabricating a MEMS sensor device. The method can include providing a substrate, forming an IC layer overlying the substrate, forming an oxide layer overlying the IC layer, forming a metal layer coupled to the IC layer through the oxide layer, forming a MEMS layer having a pair of designated sense electrode portions and a designated proof mass portion overlying the oxide layer, forming a via structure within each of the designated sense electrode portions, and etching the MEMS layer to form a pair of sense electrodes and a proof mass from the designated sense electrode portions and proof mass portions, respectively. The via structure can include a ground post and the proof mass can include a sense comb. The MEMS sensor device formed using this method can result is more well-defined edges of the proof mass structure.Type: GrantFiled: March 13, 2015Date of Patent: February 9, 2021Assignee: MCUBE INC.Inventors: Ben (Wen-Pin) Chuang, M H (Ming-Hong) Kuo, W J (Wen-Chih) Chen, Tse-Hsi “Terrence” Lee
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Publication number: 20190382522Abstract: A polycarbonate diol is provided. The polycarbonate diol includes repeating units represented by formula (A) and formula (B), and hydroxyl groups located at both ends of the polycarbonate diol. The molar ratio of formula (A) to formula (B) is in a range from 1:99 to 99:1. R1 is a linear, branched or cyclic C2-20 alkylene group. R2 is a linear or branched C2-10 alkylene group; m and n are independently and can be an integer from 0 to 10, and m+n?1. A is a C2-20 alicyclic hydrocarbon, aromatic ring or a structure represented by formula (C). R3 and R4 are independently and can be a hydrogen atom or a C1-6 alkyl group; S is 0 or 1; and Z is selected from R5 and R6 are independently and can be a hydrogen atom or a C1-12 hydrocarbon group.Type: ApplicationFiled: November 19, 2018Publication date: December 19, 2019Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Cheng-Po KUO, Kuo-Ching WU, Wen-Pin CHUANG, Shu-Jiuan HUANG, Hsi-Yen HSU, Chiou-Hwang LEE
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Patent number: 10414852Abstract: A biomass-based thermoplastic polyurethane is provided. The biomass-based thermoplastic polyurethane is a reaction product of a composition. The composition includes 1-50 parts by weight of a modified lignin, 50-99 parts by weight of a first polyol, and 40-60 parts by weight of a diisocyanate. The modified lignin has an OH value of less than 3.0 mmol/g. The sum of the modified lignin and the first polyol is 100 parts by weight.Type: GrantFiled: December 28, 2017Date of Patent: September 17, 2019Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Wen-Pin Chuang, Yi-Che Su, Yun-Ya Huang, Chao-Chieh Chiang, Cheng-Han Hsieh
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Publication number: 20190202971Abstract: A biomass-based thermoplastic polyurethane is provided. The biomass-based thermoplastic polyurethane is a reaction product of a composition. The composition includes 1-50 parts by weight of a modified lignin, 50-99 parts by weight of a first polyol, and 40-60 parts by weight of a diisocyanate. The modified lignin has an OH value of less than 3.0 mmol/g. The sum of the modified lignin and the first polyol is 100 parts by weight.Type: ApplicationFiled: December 28, 2017Publication date: July 4, 2019Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Wen-Pin CHUANG, Yi-Che SU, Yun-Ya HUANG, Chao-Chieh CHIANG, Cheng-Han HSIEH
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Patent number: 10323115Abstract: A bio-polyol composition and a bio-polyurethane foam are provided. The bio-polyol composition includes polyol, a surface-modified lignin, and a surfactant represented by formula 1. wherein R is represented by CnH2n+1, n is an integer of 0 to 3; x/y is between 5 and 13; a is an integer of 1 to 100; b is an integer of 1 to 100.Type: GrantFiled: September 23, 2016Date of Patent: June 18, 2019Assignee: Industrial Technology Research InstituteInventors: Wen-Pin Chuang, Yi-Che Su, Yun-Ya Huang, Yuung-Ching Sheen, Chao-Chieh Chiang
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Patent number: 10087298Abstract: A bio-polyol composition and a bio-polyurethane foam material are provided. By using the modifier and applying the dispersing and grinding process, the modified lignin is uniformly dispersed in the polyol solution and a bio-polyol composition is obtained. The obtained bio-polyol composition may be used to prepare the bio-polyurethane foam material with a high lignin content, a high compression strength and superior flame-resistance.Type: GrantFiled: December 26, 2014Date of Patent: October 2, 2018Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Wen-Pin Chuang, Yuung-Ching Sheen, Yun-Ya Huang, Yi-Che Su
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Patent number: 9856346Abstract: A method of forming a lignin-based biomass epoxy resin is provided, which includes: (a) mixing a lignin, an acid anhydride compound, and a solvent to react for forming a first intermediate product, (b) reacting the first intermediate compound with a first polyol to form a second intermediate compound, and (c) reacting the second intermediate compound with an epoxy compound to form a lignin-based biomass epoxy resin.Type: GrantFiled: October 9, 2015Date of Patent: January 2, 2018Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Yuung-Ching Sheen, Yi-Ting Wang, Su-Mei Chen Wei, Yi-Che Su, Wen-Pin Chuang
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Publication number: 20170158802Abstract: A bio-polyol composition and a bio-polyurethane foam are provided. The bio-polyol composition includes polyol, a surface-modified lignin, and a surfactant represented by formula 1. wherein R is represented by CnH2n+1, n is an integer of 0 to 3; x/y is between 5 and 13; a is an integer of 1 to 100; b is an integer of 1 to 100.Type: ApplicationFiled: September 23, 2016Publication date: June 8, 2017Applicant: Industrial Technology Research InstituteInventors: Wen-Pin Chuang, Yi-Che Su, Yun-Ya Huang, Yuung-Ching Sheen, Chao-Chieh Chiang
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Publication number: 20160257559Abstract: A method for fabricating a MEMS sensor device. The method can include providing a substrate, forming an IC layer overlying the substrate, forming an oxide layer overlying the IC layer, forming a metal layer coupled to the IC layer through the oxide layer, forming a MEMS layer having a pair of designated sense electrode portions and a designated proof mass portion overlying the oxide layer, forming a via structure within each of the designated sense electrode portions, and etching the MEMS layer to form a pair of sense electrodes and a proof mass from the designated sense electrode portions and proof mass portions, respectively. The via structure can include a ground post and the proof mass can include a sense comb. The MEMS sensor device formed using this method can result is more well-defined edges of the proof mass structure.Type: ApplicationFiled: March 13, 2015Publication date: September 8, 2016Inventors: Ben (Wen-Pin) Chuang, MH (Ming-Hong) Kuo, WJ (Wen-Chih) Chen, Tse-Hsi “Terrence” Lee
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Publication number: 20160102170Abstract: A method of forming a lignin-based biomass epoxy resin is provided, which includes: (a) mixing a lignin, an acid anhydride compound, and a solvent to react for forming a first intermediate product, (b) reacting the first intermediate compound with a first polyol to form a second intermediate compound, and (c) reacting the second intermediate compound with an epoxy compound to form a lignin-based biomass epoxy resin.Type: ApplicationFiled: October 9, 2015Publication date: April 14, 2016Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Yuung-Ching SHEEN, Yi-Ting WANG, Su-Mei CHEN WEI, Yi-Che SU, Wen-Pin CHUANG
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Publication number: 20150183948Abstract: A bio-polyol composition and a bio-polyurethane foam material are provided. By using the modifier and applying the dispersing and grinding process, the modified lignin is uniformly dispersed in the polyol solution and a bio-polyol composition is obtained. The obtained bio-polyol composition may be used to prepare the bio-polyurethane foam material with a high lignin content, a high compression strength and superior flame-resistance.Type: ApplicationFiled: December 26, 2014Publication date: July 2, 2015Inventors: Wen-Pin Chuang, Yuung-Ching Sheen, Yun-Ya Huang, Yi-Che Su
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Patent number: 7851033Abstract: A photo-sensitive adhesive for a flexible liquid crystal display is provided, comprising the following components: an urethane oligomer; a reactive monomer with phenyl group; and a photo-initiator. In an embodiment, the phenyl group of the reactive monomer has a weight ratio of 40 wt %, base on the total weight of the reactive monomer.Type: GrantFiled: April 28, 2008Date of Patent: December 14, 2010Assignee: Industrial Technology Research InstituteInventors: Wen-Pin Chuang, Su-Mei Wei, Kung-Lung Cheng, Shih-Hsien Liu
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Publication number: 20090059154Abstract: A photo-sensitive adhesive for a flexible liquid crystal display is provided, comprising the following components: an urethane oligomer; a reactive monomer with phenyl group; and a photo-initiator. In an embodiment, the phenyl group of the reactive monomer has a weight ratio of 40 wt %, base on the total weight of the reactive monomer.Type: ApplicationFiled: April 28, 2008Publication date: March 5, 2009Inventors: Wen-Pin CHUANG, Su-Mei Wei, Kung-Lung Cheng, Shih-Hsien Liu
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Publication number: 20070237682Abstract: A method for forming a fluid injection apparatus is disclosed. A first photosensitive macromolecule layer is formed on a substrate. The first photosensitive macromolecule layer is exposed to light of a first wavelength range using a first mask with pattern of a fluid chamber. A second photosensitive macromolecule layer is formed overlying the first photosensitive macromolecule layer. The second photosensitive macromolecule layer is exposed to light of a second wavelength range using a second mask with pattern of a nozzle, wherein the first wavelength range does not substantially interfere with the second wavelength range. The first photosensitive macromolecule layer and the second photosensitive macromolecule layer are developed to define a fluid chamber overlying the substrate and a nozzle in the second photosensitive macromolecule layer in a single development step.Type: ApplicationFiled: April 10, 2007Publication date: October 11, 2007Applicant: BENQ CORPORATIONInventors: Wen Pin Chuang, Chung Cheng Chou