Patents by Inventor Wen-Pin Chuang

Wen-Pin Chuang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11293973
    Abstract: An optical test equipment includes a chuck, a light receiving device corresponding in position to an opening of the chuck, a transparent heating plate disposed on the chuck or light receiving device in a way that the bottom surface of the transparent heating plate faces toward the light receiving device for a wafer to be disposed on the top surface of the transparent heating plate, allowing light to pass through the top and bottom surfaces and being powered to generate heat to heat the wafer, and a probing device including a seat and a probe protruding from the seat toward the top surface of the transparent heating plate for probing a light emitting chip of the wafer. The equipment can perform light emitting efficiency test to the light emitting chip on the wafer before dicing and heat the light emitting chip at the same time.
    Type: Grant
    Filed: November 17, 2020
    Date of Patent: April 5, 2022
    Assignee: MPI CORPORATION
    Inventors: Wen Pin Chuang, Yi Ching Lo
  • Patent number: 11162996
    Abstract: A probing apparatus includes a carrier having an opening, a supporter disposed on the carrier in a way that its bottom surface faces toward the carrier, its top surface for disposition of a wafer, and its light permeable portion allowing light to pass through the top and bottom surfaces corresponding in position to the opening, an air heating device having a covering plate and an air supply unit, and a probing device having a probe protruding out of the bottom surface of the air heating device. A thermal air source provides thermal air to a heating space between the bottom surface of the air heating device and the top surface of the supporter through an air supply passage of the air supply unit. The probing apparatus can test light emitting efficiency of a light emitting chip in the wafer and heat the chip at the same time.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: November 2, 2021
    Assignee: MPI CORPORATION
    Inventors: Wen Pin Chuang, Yi Ching Lo, Hao Duan
  • Publication number: 20210156903
    Abstract: A probing apparatus includes a carrier having an opening, a supporter disposed on the carrier in a way that its bottom surface faces toward the carrier, its top surface for disposition of a wafer, and its light permeable portion allowing light to pass through the top and bottom surfaces corresponding in position to the opening, an air heating device having a covering plate and an air supply unit, and a probing device having a probe protruding out of the bottom surface of the air heating device. A thermal air source provides thermal air to a heating space between the bottom surface of the air heating device and the top surface of the supporter through an air supply passage of the air supply unit. The probing apparatus can test light emitting efficiency of a light emitting chip in the wafer and heat the chip at the same time.
    Type: Application
    Filed: September 30, 2020
    Publication date: May 27, 2021
    Applicant: MPI CORPORATION
    Inventors: WEN PIN CHUANG, YI CHING LO, HAO DUAN
  • Publication number: 20210156907
    Abstract: An optical test equipment includes a chuck, a light receiving device corresponding in position to an opening of the chuck, a transparent heating plate disposed on the chuck or light receiving device in a way that the bottom surface of the transparent heating plate faces toward the light receiving device for a wafer to be disposed on the top surface of the transparent heating plate, allowing light to pass through the top and bottom surfaces and being powered to generate heat to heat the wafer, and a probing device including a seat and a probe protruding from the seat toward the top surface of the transparent heating plate for probing a light emitting chip of the wafer. The equipment can perform light emitting efficiency test to the light emitting chip on the wafer before dicing and heat the light emitting chip at the same time.
    Type: Application
    Filed: November 17, 2020
    Publication date: May 27, 2021
    Applicant: MPI CORPORATION
    Inventors: WEN PIN CHUANG, YI CHING LO
  • Patent number: 10913653
    Abstract: A method for fabricating a MEMS sensor device. The method can include providing a substrate, forming an IC layer overlying the substrate, forming an oxide layer overlying the IC layer, forming a metal layer coupled to the IC layer through the oxide layer, forming a MEMS layer having a pair of designated sense electrode portions and a designated proof mass portion overlying the oxide layer, forming a via structure within each of the designated sense electrode portions, and etching the MEMS layer to form a pair of sense electrodes and a proof mass from the designated sense electrode portions and proof mass portions, respectively. The via structure can include a ground post and the proof mass can include a sense comb. The MEMS sensor device formed using this method can result is more well-defined edges of the proof mass structure.
    Type: Grant
    Filed: March 13, 2015
    Date of Patent: February 9, 2021
    Assignee: MCUBE INC.
    Inventors: Ben (Wen-Pin) Chuang, M H (Ming-Hong) Kuo, W J (Wen-Chih) Chen, Tse-Hsi “Terrence” Lee
  • Publication number: 20190382522
    Abstract: A polycarbonate diol is provided. The polycarbonate diol includes repeating units represented by formula (A) and formula (B), and hydroxyl groups located at both ends of the polycarbonate diol. The molar ratio of formula (A) to formula (B) is in a range from 1:99 to 99:1. R1 is a linear, branched or cyclic C2-20 alkylene group. R2 is a linear or branched C2-10 alkylene group; m and n are independently and can be an integer from 0 to 10, and m+n?1. A is a C2-20 alicyclic hydrocarbon, aromatic ring or a structure represented by formula (C). R3 and R4 are independently and can be a hydrogen atom or a C1-6 alkyl group; S is 0 or 1; and Z is selected from R5 and R6 are independently and can be a hydrogen atom or a C1-12 hydrocarbon group.
    Type: Application
    Filed: November 19, 2018
    Publication date: December 19, 2019
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Cheng-Po KUO, Kuo-Ching WU, Wen-Pin CHUANG, Shu-Jiuan HUANG, Hsi-Yen HSU, Chiou-Hwang LEE
  • Patent number: 10414852
    Abstract: A biomass-based thermoplastic polyurethane is provided. The biomass-based thermoplastic polyurethane is a reaction product of a composition. The composition includes 1-50 parts by weight of a modified lignin, 50-99 parts by weight of a first polyol, and 40-60 parts by weight of a diisocyanate. The modified lignin has an OH value of less than 3.0 mmol/g. The sum of the modified lignin and the first polyol is 100 parts by weight.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: September 17, 2019
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Wen-Pin Chuang, Yi-Che Su, Yun-Ya Huang, Chao-Chieh Chiang, Cheng-Han Hsieh
  • Publication number: 20190202971
    Abstract: A biomass-based thermoplastic polyurethane is provided. The biomass-based thermoplastic polyurethane is a reaction product of a composition. The composition includes 1-50 parts by weight of a modified lignin, 50-99 parts by weight of a first polyol, and 40-60 parts by weight of a diisocyanate. The modified lignin has an OH value of less than 3.0 mmol/g. The sum of the modified lignin and the first polyol is 100 parts by weight.
    Type: Application
    Filed: December 28, 2017
    Publication date: July 4, 2019
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Wen-Pin CHUANG, Yi-Che SU, Yun-Ya HUANG, Chao-Chieh CHIANG, Cheng-Han HSIEH
  • Patent number: 10323115
    Abstract: A bio-polyol composition and a bio-polyurethane foam are provided. The bio-polyol composition includes polyol, a surface-modified lignin, and a surfactant represented by formula 1. wherein R is represented by CnH2n+1, n is an integer of 0 to 3; x/y is between 5 and 13; a is an integer of 1 to 100; b is an integer of 1 to 100.
    Type: Grant
    Filed: September 23, 2016
    Date of Patent: June 18, 2019
    Assignee: Industrial Technology Research Institute
    Inventors: Wen-Pin Chuang, Yi-Che Su, Yun-Ya Huang, Yuung-Ching Sheen, Chao-Chieh Chiang
  • Patent number: 10087298
    Abstract: A bio-polyol composition and a bio-polyurethane foam material are provided. By using the modifier and applying the dispersing and grinding process, the modified lignin is uniformly dispersed in the polyol solution and a bio-polyol composition is obtained. The obtained bio-polyol composition may be used to prepare the bio-polyurethane foam material with a high lignin content, a high compression strength and superior flame-resistance.
    Type: Grant
    Filed: December 26, 2014
    Date of Patent: October 2, 2018
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Wen-Pin Chuang, Yuung-Ching Sheen, Yun-Ya Huang, Yi-Che Su
  • Patent number: 9856346
    Abstract: A method of forming a lignin-based biomass epoxy resin is provided, which includes: (a) mixing a lignin, an acid anhydride compound, and a solvent to react for forming a first intermediate product, (b) reacting the first intermediate compound with a first polyol to form a second intermediate compound, and (c) reacting the second intermediate compound with an epoxy compound to form a lignin-based biomass epoxy resin.
    Type: Grant
    Filed: October 9, 2015
    Date of Patent: January 2, 2018
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yuung-Ching Sheen, Yi-Ting Wang, Su-Mei Chen Wei, Yi-Che Su, Wen-Pin Chuang
  • Publication number: 20170158802
    Abstract: A bio-polyol composition and a bio-polyurethane foam are provided. The bio-polyol composition includes polyol, a surface-modified lignin, and a surfactant represented by formula 1. wherein R is represented by CnH2n+1, n is an integer of 0 to 3; x/y is between 5 and 13; a is an integer of 1 to 100; b is an integer of 1 to 100.
    Type: Application
    Filed: September 23, 2016
    Publication date: June 8, 2017
    Applicant: Industrial Technology Research Institute
    Inventors: Wen-Pin Chuang, Yi-Che Su, Yun-Ya Huang, Yuung-Ching Sheen, Chao-Chieh Chiang
  • Publication number: 20160257559
    Abstract: A method for fabricating a MEMS sensor device. The method can include providing a substrate, forming an IC layer overlying the substrate, forming an oxide layer overlying the IC layer, forming a metal layer coupled to the IC layer through the oxide layer, forming a MEMS layer having a pair of designated sense electrode portions and a designated proof mass portion overlying the oxide layer, forming a via structure within each of the designated sense electrode portions, and etching the MEMS layer to form a pair of sense electrodes and a proof mass from the designated sense electrode portions and proof mass portions, respectively. The via structure can include a ground post and the proof mass can include a sense comb. The MEMS sensor device formed using this method can result is more well-defined edges of the proof mass structure.
    Type: Application
    Filed: March 13, 2015
    Publication date: September 8, 2016
    Inventors: Ben (Wen-Pin) Chuang, MH (Ming-Hong) Kuo, WJ (Wen-Chih) Chen, Tse-Hsi “Terrence” Lee
  • Publication number: 20160102170
    Abstract: A method of forming a lignin-based biomass epoxy resin is provided, which includes: (a) mixing a lignin, an acid anhydride compound, and a solvent to react for forming a first intermediate product, (b) reacting the first intermediate compound with a first polyol to form a second intermediate compound, and (c) reacting the second intermediate compound with an epoxy compound to form a lignin-based biomass epoxy resin.
    Type: Application
    Filed: October 9, 2015
    Publication date: April 14, 2016
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yuung-Ching SHEEN, Yi-Ting WANG, Su-Mei CHEN WEI, Yi-Che SU, Wen-Pin CHUANG
  • Publication number: 20150183948
    Abstract: A bio-polyol composition and a bio-polyurethane foam material are provided. By using the modifier and applying the dispersing and grinding process, the modified lignin is uniformly dispersed in the polyol solution and a bio-polyol composition is obtained. The obtained bio-polyol composition may be used to prepare the bio-polyurethane foam material with a high lignin content, a high compression strength and superior flame-resistance.
    Type: Application
    Filed: December 26, 2014
    Publication date: July 2, 2015
    Inventors: Wen-Pin Chuang, Yuung-Ching Sheen, Yun-Ya Huang, Yi-Che Su
  • Patent number: 7851033
    Abstract: A photo-sensitive adhesive for a flexible liquid crystal display is provided, comprising the following components: an urethane oligomer; a reactive monomer with phenyl group; and a photo-initiator. In an embodiment, the phenyl group of the reactive monomer has a weight ratio of 40 wt %, base on the total weight of the reactive monomer.
    Type: Grant
    Filed: April 28, 2008
    Date of Patent: December 14, 2010
    Assignee: Industrial Technology Research Institute
    Inventors: Wen-Pin Chuang, Su-Mei Wei, Kung-Lung Cheng, Shih-Hsien Liu
  • Publication number: 20090059154
    Abstract: A photo-sensitive adhesive for a flexible liquid crystal display is provided, comprising the following components: an urethane oligomer; a reactive monomer with phenyl group; and a photo-initiator. In an embodiment, the phenyl group of the reactive monomer has a weight ratio of 40 wt %, base on the total weight of the reactive monomer.
    Type: Application
    Filed: April 28, 2008
    Publication date: March 5, 2009
    Inventors: Wen-Pin CHUANG, Su-Mei Wei, Kung-Lung Cheng, Shih-Hsien Liu
  • Publication number: 20070237682
    Abstract: A method for forming a fluid injection apparatus is disclosed. A first photosensitive macromolecule layer is formed on a substrate. The first photosensitive macromolecule layer is exposed to light of a first wavelength range using a first mask with pattern of a fluid chamber. A second photosensitive macromolecule layer is formed overlying the first photosensitive macromolecule layer. The second photosensitive macromolecule layer is exposed to light of a second wavelength range using a second mask with pattern of a nozzle, wherein the first wavelength range does not substantially interfere with the second wavelength range. The first photosensitive macromolecule layer and the second photosensitive macromolecule layer are developed to define a fluid chamber overlying the substrate and a nozzle in the second photosensitive macromolecule layer in a single development step.
    Type: Application
    Filed: April 10, 2007
    Publication date: October 11, 2007
    Applicant: BENQ CORPORATION
    Inventors: Wen Pin Chuang, Chung Cheng Chou
  • Patent number: 5931568
    Abstract: A Christmas lamp structure that includes a decorative casing that allows light from a bulb to pass through. The casing will typically be shaped to resemble some type of fruit. A base of the bulb includes an annular stop to secure an engaging annulus of the casing in the base so that the casing does not fall out of the base.
    Type: Grant
    Filed: September 10, 1997
    Date of Patent: August 3, 1999
    Inventor: Wen-Pin Chuang
  • Patent number: 5633618
    Abstract: A fuseless plug with an overload safety circuit breaker having a thermal reactive spring leaf and an electric conductive sheet. When in normal use, the thermal reactive spring leaf and the electric conductive sheet are electrically connected by contacting mutually. If overloading or short circuiting occurs, the temperature will rise, while the thermal reactive spring leaf made of an alloy of two kinds of metal material has different coefficients of temperature, so that the spring leaf will be bent outwardly to release the electric conductive sheet to form a broken circuit state and to assure that no disaster such as a fire alarm will occur. After clearing, a push button can be pushed down to force the electric conductive sheet into engagement again with the spring leaf for use.
    Type: Grant
    Filed: October 24, 1995
    Date of Patent: May 27, 1997
    Inventor: Wen-Pin Chuang