Patents by Inventor WEN-PIN SHEN

WEN-PIN SHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11967546
    Abstract: A semiconductor structure includes a first interposer; a second interposer laterally adjacent to the first interposer, where the second interposer is spaced apart from the first interposer; and a first die attached to a first side of the first interposer and attached to a first side of the second interposer, where the first side of the first interposer and the first side of the second interposer face the first die.
    Type: Grant
    Filed: July 21, 2022
    Date of Patent: April 23, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shang-Yun Hou, Hsien-Pin Hu, Sao-Ling Chiu, Wen-Hsin Wei, Ping-Kang Huang, Chih-Ta Shen, Szu-Wei Lu, Ying-Ching Shih, Wen-Chih Chiou, Chi-Hsi Wu, Chen-Hua Yu
  • Publication number: 20240076422
    Abstract: A supported metallocene catalyst includes a carrier and a metallocene component. The carrier includes an inorganic oxide particle and an alkyl aluminoxane material. The inorganic oxide particle includes at least one inorganic oxide compound selected from the group consisting of an oxide of Group 3A and an oxide of Group 4A. The alkyl aluminoxane material includes an alkyl aluminoxane compound and an alkyl aluminum compound that is present in amount ranging from greater than 0.01 wt % to less than 14 wt % base on 100 wt % of the alkyl aluminoxane material. The metallocene component is supported on the carrier, and includes one of a metallocene compound containing a metal from Group 3B, a metallocene compound containing a metal from Group 4B, and a combination thereof. A method for preparing the supported metallocene catalyst and a method for preparing polyolefin using the supported metallocene catalyst are also disclosed.
    Type: Application
    Filed: September 1, 2023
    Publication date: March 7, 2024
    Inventors: Jing-Cherng TSAI, Jen-Long WU, Wen-Hao KANG, Kuei-Pin LIN, Jing-Yu LEE, Jun-Ye HONG, Zih-Yu SHIH, Cheng-Hung CHIANG, Gang-Wei SHEN, Yu-Chuan SUNG, Chung-Hua WENG, Hsing-Ya CHEN
  • Patent number: 11106241
    Abstract: The present invention provides a display device including: a backlight module, including a back bezel having a bottom surface, and a frame having a side wall portion, where the side wall portion has an inner side surface and an outer side surface, and the back bezel faces the inner side surface of the side wall portion; a display module, disposed on the backlight module and supported by the frame; a tape, attached to the outer side surface of the side wall portion of the frame and extending to the bottom surface of the back bezel; and a sealant, disposed and extending from an end edge of the display module to the bottom surface of the back bezel through an outer side of the outer side surface of the side wall portion of the frame, and at least partially covering the tape.
    Type: Grant
    Filed: December 5, 2019
    Date of Patent: August 31, 2021
    Assignee: AU OPTRONICS CORPORATION
    Inventors: Po-Lan Hung, Yu-Tsung Huang, Wen-Pin Shen, Li-Chih Hsu, Pei-Chia Wu, Yen-Po Wang
  • Publication number: 20200183454
    Abstract: The present invention provides a display device including: a backlight module, including a back bezel having a bottom surface, and a frame having a side wall portion, where the side wall portion has an inner side surface and an outer side surface, and the back bezel faces the inner side surface of the side wall portion; a display module, disposed on the backlight module and supported by the frame; a tape, attached to the outer side surface of the side wall portion of the frame and extending to the bottom surface of the back bezel; and a sealant, disposed and extending from an end edge of the display module to the bottom surface of the back bezel through an outer side of the outer side surface of the side wall portion of the frame, and at least partially covering the tape.
    Type: Application
    Filed: December 5, 2019
    Publication date: June 11, 2020
    Inventors: PO-LAN HUNG, YU-TSUNG HUANG, WEN-PIN SHEN, LI-CHIH HSU, PEI-CHIA WU, YEN-PO WANG