Abstract: A method is provided for forming an integrated circuit (IC) chip package structure. The method includes providing a substrate for an interposer, and forming a conductive interconnect structure in and on the substrate for connecting a group of selected IC dies. The method includes forming warpage-reducing trenches in non-routing regions of the interposer, wherein the warpage-reducing trenches are sized and positioned based on a warpage characteristic to reduce the warpage of the chip package structure. The method also includes depositing a warpage-relief material in the warpage-reducing trenches according to the warpage characteristic to reduce the warpage of the chip package structure, and bonding the group of selected IC dies to the interposer to form a chip package structure.

Abstract: A document sentence concept labeling system, a training method and a labeling method thereof are provided. The labeling method of the document sentence concept labeling system includes the following steps. An unlabeled document and one or more sentence concepts are inputted to a pre-trained language model to obtain a set of word embeddings of the unlabeled document. The set of word embeddings of the unlabeled document is inputted into a document analysis model to obtain a start position and an end position of a sentence set corresponding to each of the sentence concepts in the unlabeled document. According to each of the start positions and each of the end positions, each of the sentence sets is obtained.