Abstract: A transistor structure and a formation method thereof are provided. The transistor structure includes a transistor device, formed on an active region of a semiconductor substrate, and including: a gate structure, disposed on the active region; gate spacers, formed along opposite sidewalls of the gate structure; source/drain structures, formed in recesses of the active region at opposite sides of the gate structure; and buried isolation structures, separately extending along bottom sides of the source/drain structures. Further, a channel portion of the active region between the source/drain structures is strained as a result of a strained etching stop layer lying above or dislocation stressors formed in the source/drain structures.

Abstract: A memory device and a manufacturing method thereof are provided. The memory device includes an access transistor defined within an active region of a semiconductor substrate and a storage capacitor disposed on the access transistor. A recessed gate structure of the access transistor extends into the active region from above the active region. Source/drain contacts of the access transistor are disposed on the active region at opposite sides of the recessed gate structure. The storage capacitor includes: a composite bottom electrode, formed by alternately stacked first conductive layers and second conductive layers, wherein each second conductive layer is sandwiched between a pair of the first conductive layers, and tunnels laterally extend through the second conductive layers, respectively; a capacitor dielectric layer, covering inner and outer surfaces of the composite bottom electrode; and a top electrode, in contact with the composite bottom electrode through the capacitor dielectric layer.

Abstract: A heat sink fastener includes a heat sink assembly, a first stand, a second stand, a fastening plate, a fastening member, and a movable bar. The first stand includes a fastening portion. The second stand includes a restriction portion. The fastening plate is connected to the heat sink assembly. The fastening plate includes a hook portion, an extension portion, and a through hole. The hook portion is engaged with the fastening portion. The extension portion contacts with the restriction portion. The fastening member is inserted through the through hole and secured the second stand. The fastening member includes a bolt and a screw nail. The screw nail is provided with a pushing portion. The movable bar is connected to the second stand. The movable bar includes a pivot shaft, a restriction end restricting the pushing portion from movement, and a release end releasing the pushing portion to move.

Abstract: A foldable supporting bracket for a portable electronic apparatus includes a supporting arm, a holding element, and two load-bearing bars. The supporting arm has a first pivot shaft at one terminal thereof and the holding element has a second pivot shaft at one terminal thereof. The two load-bearing bars are separated to each other and pivotally arranged between the first pivot shaft and the second pivot shaft to form a hollow containing region. The supporting arm and the holding element are pivotally connected to the two load-bearing bars via the first pivot shaft and the second pivot shat, respectively, so that the supporting arm and the holding element are flipped toward the hollow containing region. Accordingly, the supporting arm and the holding element are folded in the hollow containing region and then levelly arranged to the two load-bearing bars, thus reducing occupied space and increasing carry convenience.