Abstract: A touch display device includes a first substrate, a touch electrode, a dummy electrode, a first dielectric layer and an electrostatic discharge layer. The touch electrode is disposed on the first substrate; the touch electrode includes a driving electrode and a sensing electrode, wherein the driving electrode is disposed adjacent to the sensing electrode. The dummy electrode is disposed on the first substrate and adjacent to at least one of the driving electrode and the sensing electrode, and two of the dummy electrode, the driving electrode and the sensing electrode are separated from each other. The first dielectric layer is disposed on the touch electrode and the dummy electrode, and the first dielectric layer has at least one first through hole disposed corresponding to the dummy electrode. The electrostatic discharge layer is disposed on the first dielectric layer and contacts with the dummy electrode through the first through hole.

Abstract: A touch display device includes a first substrate, a touch electrode, a dummy electrode, a first dielectric layer and an electrostatic discharge layer. The touch electrode is disposed on the first substrate; the touch electrode includes a driving electrode and a sensing electrode, wherein the driving electrode is disposed adjacent to the sensing electrode. The dummy electrode is disposed on the first substrate and adjacent to at least one of the driving electrode and the sensing electrode, and two of the dummy electrode, the driving electrode and the sensing electrode are separated from each other. The first dielectric layer is disposed on the touch electrode and the dummy electrode, and the first dielectric layer has at least one first through hole disposed corresponding to the dummy electrode. The electrostatic discharge layer is disposed on the first dielectric layer and contacts with the dummy electrode through the first through hole.

Abstract: A touch display device includes a first substrate, a first touch pattern and an insulation layer. The first touch pattern is disposed on the first substrate, and the insulation layer is disposed on the first substrate. The insulation layer and the first touch pattern are overlapped. The insulation layer includes a protection layer and a dielectric layer, and the dielectric layer is disposed between the protection layer and the first substrate. A material of the protection layer includes an oxide, and a material of the dielectric layer comprises silicon nitride or silicon oxynitride.

Abstract: A humidity measuring circuit includes a comparing circuit and a switch circuit. The comparing circuit measures humidity and compares the measured humidity with a preset value, to output a first control signal or a second control signal. The switch circuit receives the first or second control signal and controls a computer to be powered on or not. When humidity measured by the comparing circuit is greater than the preset value, the comparing circuit outputs the first control signal to the switch circuit. The switch circuit is turned on and controls the computer not to be powered on. When humidity measured by the comparing circuit is equal to or less than the preset value, the comparing circuit outputs the second control signal to the switch circuit. The switch circuit is turned off and controls the computer to be powered on.

Abstract: A solar glass is used for building-integrated photovoltaic (BIPV). From a light-incident side to a light-emitting side, the solar glass sequentially includes a front substrate, a first electrode layer, a photoelectric conversion layer, a second electrode layer, a low emissivity (Low-E) film, and a back substrate. The photoelectric conversion layer is used for receiving light energy and converting the light energy into electric energy. The Low-E film allows visible light to pass through and reflects infrared light. By using a structure of the solar glass, the thickness of the solar glass may be greatly reduced.

Abstract: An image sensor die comprises a substrate and an image sensor array formed over the substrate. Micro lens are disposed on the image sensor array. A protection layer is formed on the micro lens to prevent the micro lens from particle containment.

Abstract: The present invention discloses a structure of image sensor package utilizing a removable protection film. The structure comprises a substrate with a die receiving cavity and inter-connecting through holes. Terminal pads are formed under the inter-connecting through holes and metal pads are formed on an upper surface of the substrate. A die is disposed within the die receiving cavity by an adhesion material. Bonding pads are formed on the upper edge of the die. Bonding wires are coupled to the metal pads and the bonding pads. A protection layer is formed on the micro lens area to protect the micro lens from particle contamination. A removable protection film is formed over the protection layer to protect the micro lens from water, oil, dust or temporary impact during the packaging and assembling process.

Abstract: A flat panel display comprising a liquid crystal module, a backlight module, and a transition film is disclosed. The backlight module provides light to the liquid crystal module, and the transition film is disposed above the liquid crystal module. The transition film comprises a material capable of filtering light of specific wavelengths. The material can be organic dye material phthal-ocyanine Copper (CuPc) or C32H16N8Cu. The transition film can be an evaporation layer, so the transition film can be formed on the polarizer of the liquid crystal module. The transition film has a transparency ratio with respect to blue light and a transparency ratio with respect to red light, and the ratios range from 0.5 to 0.95. The transparency ratio with respect to blue light is greater than that with respect to red light. The backlight module comprises one or more light emitting diodes (LEDs) to provide light.

Abstract: The present invention provides a semiconductor device package having pseudo chips structure comprising a first substrate with die receiving through holes formed thereon; a first die having first bonding pads and a second die having second bonding pads disposed within the die receiving through holes, respectively; an adhesion material formed in the gap between the first and second die and sidewalls of the die receiving though holes of the first substrate; redistribution lines formed to couple the first contact pads formed on the first substrate to the first bonding pads and the second bonding pads, respectively; and a protection layer formed on the redistribution lines, the first die, the second die and the first substrate.

Abstract: A flat panel display comprising a liquid crystal module, a backlight module, and a transition film is disclosed. The backlight module provides light to the liquid crystal module, and the transition film is disposed above the liquid crystal module. The transition film comprises a material capable of filtering light of specific wavelengths. The material can be organic dye material phthal-ocyanine Copper (CuPc) or C32H16N8Cu. The transition film can be an evaporation layer, so the transition film can be formed on the polarizer of the liquid crystal module. The transition film has a transparency ratio with respect to blue light and a transparency ratio with respect to red light, and the ratios range from 0.5 to 0.95. The transparency ratio with respect to blue light is greater than that with respect to red light. The backlight module comprises one or more light emitting diodes (LEDs) to provide light.

Abstract: A tool of wafer level package comprises a first base, an elastic material and a second base. The elastic material is coated on the first base, and the elastic material has viscosity in common state to adhere a plurality of dies. The second base is coated by adhesive material to adhere the dies. The plurality of dies are departed from the elastic material by a special environment after adhering.

Abstract: An image sensor die comprises a substrate and an image sensor array formed over the substrate. Micro lens are disposed on the image sensor array. A protection layer is formed on the micro lens to prevent the micro lens from particle containment.

Abstract: An organic electroluminescent device, having a cathode, an indium-tin-oxide anode, an emitting layer, a hole transport layer, an electron transport layer, a hole injecting layer and a intermediate layer. The emitting layer is located between the cathode and the indium-tin-oxide anode. The hole transport layer is located between the emitting layer and the indium-tin-oxide anode, the electron transport layer is located between the emitting layer and the cathode, the hole injecting layer is located between the hole transport layer and the indium-tin-oxide anode, and the intermediate layer is located between the hole injecting layer and the hole transport layer.

Abstract: An organic electroluminescent device, having a cathode, an indium-tin-oxide anode, an emitting layer, a hole transport layer, an electron transport layer, a hole injecting layer and a intermediate layer. The emitting layer is located between the cathode and the indium-tin-oxide anode. The hole transport layer is located between the emitting layer and the indium-tin-oxide anode, the electron transport layer is located between the emitting layer and the cathode, the hole injecting layer is located between the hole transport layer and the indium-tin-oxide anode, and the intermediate layer is located between the hole injecting layer and the hole transport layer.