Patents by Inventor Wen-pu CUI

Wen-pu CUI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9922888
    Abstract: The present invention provides a general four-port on-wafer high frequency de-embedding method. The method comprises: for each on-wafer de-embedding dummy, building a model considering the distributive nature of high frequency characteristics of the on-wafer de-embedding dummy; obtaining the intrinsic Y-parameter admittance matrix of said N on-wafer de-embedding dummies by calculation or simulation by using said models; and solving the equation set which the corresponding measurement and calculation or simulation data of said on-wafer de-embedding dummies satisfy for the elements of the related admittance matrices of the parasitic four-port network to be stripped in de-embedding and model parameters of models on which said calculation or simulation is based.
    Type: Grant
    Filed: May 2, 2016
    Date of Patent: March 20, 2018
    Assignee: Tsinghua University
    Inventors: Jun Fu, Yu-dong Wang, Jie Cui, Yue Zhao, Wen-pu Cui, Zhi-hong Liu
  • Publication number: 20170287792
    Abstract: The present invention provides a general four-port on-wafer high frequency de-embedding method. The method comprises: for each on-wafer de-embedding dummy, building a model considering the distributive nature of high frequency characteristics of the on-wafer de-embedding dummy; obtaining the intrinsic Y-parameter admittance matrix of said N on-wafer de-embedding dummies by calculation or simulation by using said models; and solving the equation set which the corresponding measurement and calculation or simulation data of said on-wafer de-embedding dummies satisfy for the elements of the related admittance matrices of the parasitic four-port network to be stripped in de-embedding and model parameters of models on which said calculation or simulation is based.
    Type: Application
    Filed: May 2, 2016
    Publication date: October 5, 2017
    Inventors: Jun FU, Yu-dong WANG, Jie CUI, Yue ZHAO, Wen-pu CUI, Zhi-hong LIU