Patents by Inventor Wen-Ren Chen

Wen-Ren Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11818838
    Abstract: A metal-clad laminate is provided. The metal-clad laminate includes: a dielectric layer, which has a first reinforcing material and a dielectric material formed on the surface of the first reinforcing material, wherein the dielectric material includes 60 wt % to 80 wt % of a first fluoropolymer and 20 wt % to 40 wt % of a first filler; an adhesive layer, which is disposed on at least one side of the dielectric layer and includes an adhesive material, wherein the adhesive material has 60 wt % to 70 wt % of a second fluoropolymer and 30 wt % to 40 wt % of a second filler; and a metal foil, which is disposed on the other side of the adhesive layer that is opposite to the dielectric layer, wherein the melting point of the second fluoropolymer is lower than the melting point of the first fluoropolymer.
    Type: Grant
    Filed: October 24, 2019
    Date of Patent: November 14, 2023
    Assignee: TAIWAN UNION TECHNOLOGY CORPORATION
    Inventors: Wen-Ren Chen, Shi-Ing Huang, Shur-Fen Liu
  • Patent number: 11529797
    Abstract: A method of manufacturing a metal-clad laminate and uses of the same are provided. The method comprises the following steps: (a) impregnating a reinforcement material with a first fluoropolymer solution, and drying the impregnated reinforcement material under a first temperature to obtain a first prepreg; (b) impregnating the first prepreg with a second fluoropolymer solution, and drying the impregnated first prepreg under a second temperature to obtain a second prepreg; and (c) laminating the second prepreg and a metal-clad to obtain a metal-clad laminate, wherein the first fluoropolymer solution has a first fluoropolymer, the second fluoropolymer solution has a second fluoropolymer, and the first fluoropolymer and the second fluoropolymer are different.
    Type: Grant
    Filed: November 14, 2017
    Date of Patent: December 20, 2022
    Assignee: TAIWAN UNION TECHNOLOGY CORPORATION
    Inventors: Wen-Ren Chen, Shur-Fen Liu
  • Publication number: 20200404782
    Abstract: A metal-clad laminate is provided. The metal-clad laminate includes: a dielectric layer, which has a first reinforcing material and a dielectric material formed on the surface of the first reinforcing material, wherein the dielectric material includes 60 wt % to 80 wt % of a first fluoropolymer and 20 wt % to 40 wt % of a first filler; an adhesive layer, which is disposed on at least one side of the dielectric layer and includes an adhesive material, wherein the adhesive material has 60 wt % to 70 wt % of a second fluoropolymer and 30 wt % to 40 wt % of a second filler; and a metal foil, which is disposed on the other side of the adhesive layer that is opposite to the dielectric layer, wherein the melting point of the second fluoropolymer is lower than the melting point of the first fluoropolymer.
    Type: Application
    Filed: October 24, 2019
    Publication date: December 24, 2020
    Inventors: Wen-Ren CHEN, Shi-Ing HUANG, Shur-Fen LIU
  • Publication number: 20180339493
    Abstract: A method of manufacturing a metal-clad laminate and uses of the same are provided. The method comprises the following steps: (a) impregnating a reinforcement material with a first fluoropolymer solution, and drying the impregnated reinforcement material under a first temperature to obtain a first prepreg; (b) impregnating the first prepreg with a second fluoropolymer solution, and drying the impregnated first prepreg under a second temperature to obtain a second prepreg; and (c) laminating the second prepreg and a metal-clad to obtain a metal-clad laminate, wherein the first fluoropolymer solution has a first fluoropolymer, the second fluoropolymer solution has a second fluoropolymer, and the first fluoropolymer and the second fluoropolymer are different.
    Type: Application
    Filed: November 14, 2017
    Publication date: November 29, 2018
    Inventors: Wen-Ren Chen, Shur-Fen Liu