Abstract: The present disclosure relates to a wafer leveling device which comprises a carrier module, a fixture module and a dynamic module. A wafer, which is conveyed to and stays above a claw component of the carrier module by a robotic arm, is further carried by the lifted claw component for a continuous ascent until the wafer is contacted by a ring component of the fixture module; the clamp component of the fixture module releases the ring component; the claw component, the ring component and the wafer, all of which keep stabilized mutual positions, are lowered so that several protrudent structures on a base component of the carrier module contact the wafer; the claw component, the ring component and the wafer which completes a manufacturing process are lifted; the carrier module and the wafer are lowered with the clamp components stabilizing the ring component.

Abstract: The present disclosure relates to a wafer leveling device which comprises a carrier module, a fixture module and a dynamic module. A wafer, which is conveyed to and stays above a claw component of the carrier module by a robotic arm, is further carried by the lifted claw component for a continuous ascent until the wafer is contacted by a ring component of the fixture module; the clamp component of the fixture module releases the ring component; the claw component, the ring component and the wafer, all of which keep stabilized mutual positions, are lowered so that several protrudent structures on a base component of the carrier module contact the wafer; the claw component, the ring component and the wafer which completes a manufacturing process are lifted; the carrier module and the wafer are lowered with the clamp components stabilizing the ring component.

Abstract: The present disclosure relates to a laser marking device and a method thereof. The laser marking device comprises a laser system, a wafer leveling system, a first imaging system and a mobile system: the wafer leveling system carries and levels a warped wafer to be processed; the mobile system underneath properly adjusts a position of the wafer; the first imaging system detects the wafer to recognize a product category and positioning status; the laser system underneath labels laser marks on the wafer; all wafers are marked in the cyclic process.