Patents by Inventor Wen-Rong Chen

Wen-Rong Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8070042
    Abstract: A process for joining a stainless steel part and a silicon carbide ceramic part, comprising steps of: providing a stainless steel part, a SiC ceramic part, and a Al foil; bringing surfaces of the stainless steel part, SiC ceramic part, and Al foil into contact, with the titanium foil inserted between the metal part and ceramic part; applying a pulsed electric current to the stainless steel part, SiC ceramic part, and Al foil, heating the stainless steel part, SiC ceramic part, and Al foil to a joining temperature of about 500-650° C., and simultaneously applying a joining pressure of about 50-100 MPa to the stainless steel part, SiC ceramic part, and Al foil while the current is applied, and maintaining the joining temperature and the joining pressure for about 10-30 minutes.
    Type: Grant
    Filed: June 28, 2011
    Date of Patent: December 6, 2011
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Hsin-Pei Chang, Wen-Rong Chen, Huann-Wu Chiang, Cheng-Shi Chen, Wen-Feng Hu
  • Publication number: 20110262769
    Abstract: A surface hardened substrate includes a base, a transition layer disposed on a surface of the base, and a hard layer disposed on the transition layer. The transition layer includes at least two kinds of transition metals. The hard layer includes a composite that comprises the at least two kinds of transition metals and a nonmetal.
    Type: Application
    Filed: September 17, 2010
    Publication date: October 27, 2011
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventors: HSIN-PEI CHANG, WEN-RONG CHEN, CHENG-SHI CHEN, HUAN-WU CHIANG, DAI-YU SUN, CONG LI
  • Publication number: 20110262767
    Abstract: A surface hardened substrate includes a base, a transition layer disposed on a surface of the base, and a hard layer disposed on the transition layer. The transition layer includes at least two kinds of transition metals. The hard layer includes an alloy and a nonmetal. The alloy includes the at least two kinds of transition metals.
    Type: Application
    Filed: September 17, 2010
    Publication date: October 27, 2011
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventors: HSIN-PEI CHANG, WEN-RONG CHEN, CHENG-SHI CHEN, HUAN-WU CHIANG, YI-CHI CHAN, HUA-YANG XU