Abstract: A manufacturing method of a metal bump structure is provided. A driving base is provided. At least one pad and an insulating layer are formed on the driving base. The pad is formed on an arrangement surface of the driving base and has an upper surface. The insulating layer covers the arrangement surface of the driving base and the pad, and exposes a part of the upper surface of the pad. A patterned metal layer is formed on the upper surface of the pad exposed by the insulating layer, and extends to cover a part of the insulating layer. An electro-less plating process is performed to form at least one metal bump on the patterned metal layer. A first extension direction of the metal bump is perpendicular to a second extension direction of the driving base.

Abstract: A manufacturing method of a metal bump structure is provided. A driving base is provided. At least one pad and an insulating layer are formed on the driving base. The pad is formed on an arrangement surface of the driving base and has an upper surface. The insulating layer covers the arrangement surface of the driving base and the pad, and exposes a part of the upper surface of the pad. A patterned metal layer is formed on the upper surface of the pad exposed by the insulating layer, and extends to cover a part of the insulating layer. An electro-less plating process is performed to form at least one metal bump on the patterned metal layer. A first extension direction of the metal bump is perpendicular to a second extension direction of the driving base.

Abstract: The present invention is an event handling system executed in a computer with a Windows operating system. Event setup codes are used to setup which system events and application events are needed to be monitored, and to setup to use one of colors of a full-color notifying light corresponding to the event when the events occur. A notifier manager is used to detect monitored system events and application events and to send a command to notifier interface codes. A notifier connected to the computer comprises: a full-color notifying light and a firmware. The notifier executes the firmware and makes a light emit light of a color corresponding to the event. The notifier interface codes are used as a device driver of the notifier which receives the command sent by the notifier manager and sends the command to the notifier.

Abstract: A flip-chip bonding structure with stress-buffering property is proposed, which can help prevent cracking and warpage to the flip-chip construction due to thermal stress. The proposed flip-chip bonding structure used to bond a flip chip to a substrate, and is characterized in the provision of a first electrically-conductive stress-buffering layer over the chip-side bond pad and a second electrically-conductive stress-buffering layer over the substrate-side bond pad, so that under high-temperature conditions, the thermal stress from the flip chip can be buffered by the first electrically-conductive stress-buffering layer, while the thermal stress from the substrate can be buffered by the second electrically-conductive stress-buffering layer, thus preventing cracking and warpage to the flip-chip construction. As a result, the finished flip-chip package can be more assured in quality and reliability than the prior art.