Abstract: A semiconductor package has a substrate (8) and a semiconductor die (2). The substrate (8) includes a plurality of contact pads (9) on its upper surface and a second plurality of external contact areas (10) on its bottom surface. The semiconductor die (2) includes an active surface with a plurality of die contact pads (3) electrically connected by conducting means (4) to contact pads (9) on the substrate (8) and a layer of first adhesive means (5) on the upper surface (18) of the die (2). Mold material (15) covers the first adhesive means (5), the die (2) and the upper surface of the substrate (8).

Abstract: Disclosed are methods for producing organ-, tissue-, or cell-specific antibodies, antibodies against developmentally regulated antigens, antibodies against disease-associated antigens, and antibodies against antigens that are modulated during a physiological response to an agent (e.g., in response to a drug). Also disclosed are methods for screening an agent for activity in modulating angiogenesis, as well as antibodies specific for angiogenic vessels.

Abstract: A semiconductor package has a substrate (8) and a semiconductor die (2). The substrate (8) includes a plurality of contact pads (9) on its upper surface and a second plurality of external contact areas (10) on its bottom surface. The semiconductor die (2) includes an active surface with a plurality of die contact pads (3) electrically connected by conducting means (4) to contact pads (9) on the substrate (8) and a layer of first adhesive means (5) on the upper surface (18) of the die (2). Mold material (15) covers the first adhesive means (5), the die (2) and the upper surface of the substrate (8).

Abstract: A substrate (1) is for mounting a semiconductor device (5) thereon. The substrate has a first region (2) adapted to have a semiconductor device (5) attached thereto, a second region having a number of electrical contacts (3), and a third region located between the first region (2) and the second region. The third region includes a stress relief means (4) such as an aperture.