Abstract: A successive-approximation register analog-to-digital converter (SAR ADC), a correction method and a correction system are provided. The SAR ADC generates an original weight value sequence according to multiple original weight values. The SAR ADC converts an analog time-varying signal to establish a transforming curve corresponding to the original weight values. In addition, the SAR ADC generates an offset value sequence according to an offset of the transforming curve, uses the offset value sequence to correct the original weight value sequence to generate a corrected weight value sequence, and uses multiple corrected weight values of the corrected weight sequence to improve linearity of the transforming curve.

Abstract: A successive-approximation register analog-to-digital converter (SAR ADC), a correction method and a correction system are provided. The SAR ADC generates an original weight value sequence according to multiple original weight values. The SAR ADC converts an analog time-varying signal to establish a transforming curve corresponding to the original weight values. In addition, the SAR ADC generates an offset value sequence according to an offset of the transforming curve, uses the offset value sequence to correct the original weight value sequence to generate a corrected weight value sequence, and uses multiple corrected weight values of the corrected weight sequence to improve linearity of the transforming curve.

Abstract: A chip package structure and a manufacturing method thereof are provided. The chip package structure includes a circuit board, a chip, a housing, an antenna pattern, a conductive line pattern and a shielding layer. The chip is disposed on the circuit board. The housing is disposed on the circuit board and covers the chip, wherein the housing includes a cover and sidewalls, and the housing contains catalyst particles. The antenna pattern is disposed on an outer surface of the cover. The conductive line pattern is disposed on an outer surface of the sidewalls and electrically connected to the antenna pattern and the circuit board. The shielding layer is disposed at least on an inner surface of the cover.