Patents by Inventor Wen Sheng Vincent Lee

Wen Sheng Vincent Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DIE PACKAGE AND A METHOD FOR MANUFACTURING THE DIE PACKAGE
    Publication number: 20110316117
    Abstract: A die package and a method for manufacturing the die package are provided.
    Type: Application
    Filed: August 12, 2008
    Publication date: December 29, 2011
    Inventors: Vaidyanathan Kripesh, Navas Khan Oratti Kalandar, Srinivasa Rao Vempati, Aditya Kumar, Soon Wee Ho, Yak Long Samuel Lim, Gaurav Sharma, Wen Sheng Vincent Lee