Patents by Inventor Wen-Shian Huang

Wen-Shian Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140304639
    Abstract: In a method for triggering events of an electronic device, one or more events of the electronic device are set through a user interface, and a key combination for each of the events is received from the user interface. The key combination includes one or more distance sensors and a hot key of the electronic device. The method determines whether one of the distance sensors detects a user's finger in an effective sensing range when the hot key is approached by the user's finger. When one of the distance sensors detects the user's finger in the effective sensing range, the method triggers an event of the electronic device corresponding to the hot key, and executes a specified function of the hot key according to the event. If no distance sensor detects the user's finger in the effective sensing range, the method executes an inherent function of the hot key.
    Type: Application
    Filed: March 26, 2014
    Publication date: October 9, 2014
    Applicant: FIH (HONG KONG) LIMITED
    Inventor: WEN-SHIAN HUANG
  • Publication number: 20130135190
    Abstract: In a method for executing multiple functions of a physical button of an electronic device, multiple functions of the physical button are predefined, and a relationship between each of the multiple functions and each placement state of the electronic device is predefined. One of the placement states of the electronic device is detected when the physical button is pressed. A function of the physical button corresponding to the detected placement state of the electronic device is determined according to the predefined relationship. The electronic device is controlled to execute the determined function of the physical button.
    Type: Application
    Filed: May 1, 2012
    Publication date: May 30, 2013
    Applicant: FIH (HONG KONG) LIMITED
    Inventor: WEN-SHIAN HUANG
  • Patent number: 7839150
    Abstract: A detecting device for detecting the electrical connection between several first pads and second pads of a package substrate is provided. The first and the second pads are disposed on two opposite sides of the package substrate. The detecting device includes a socket unit, several first detecting components and several second detecting components. The socket unit is disposed on and coupled to the first pads. The first detecting components are disposed on and coupled to the socket unit. The second detecting components are disposed under and coupled to the second pads. The socket unit and the second detecting components are disposed on two opposite sides of the package substrate. While detecting, the first detecting components, the socket unit, the first pads, the second pads and the second detecting components are electrically connected sequentially, so as to determine whether the first pads are respectively and electrically connected to the second pads.
    Type: Grant
    Filed: November 13, 2007
    Date of Patent: November 23, 2010
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Heng-Lung Su, Wen-Shian Huang, Sheng-Feng Tseng, Feng-Chen Cheng, Chang-Shuo Lee
  • Publication number: 20080252300
    Abstract: A detecting device for detecting the electrical connection between several first pads and second pads of a package substrate is provided. The first and the second pads are disposed on two opposite sides of the package substrate. The detecting device includes a socket unit, several first detecting components and several second detecting components. The socket unit is disposed on and coupled to the first pads. The first detecting components are disposed on and coupled to the socket unit. The second detecting components are disposed under and coupled to the second pads. The socket unit and the second detecting components are disposed on two opposite sides of the package substrate. While detecting, the first detecting components, the socket unit, the first pads, the second pads and the second detecting components are electrically connected sequentially, so as to determine whether the first pads are respectively and electrically connected to the second pads.
    Type: Application
    Filed: November 13, 2007
    Publication date: October 16, 2008
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Heng-Lung Su, Wen-Shian Huang, Sheng-Feng Tseng, Feng-Chen Cheng, Chang-Shuo Lee