Patents by Inventor Wen-Shian V. Tzeng

Wen-Shian V. Tzeng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6005191
    Abstract: A heat-shrinkable electromagnetic interference (EMI) shielding jacket sheathable over a generally elongate object of a given outer diameter extent. The jacket is formed of a tubular outer member of an indefinite length and an expanded inner diameter which is greater than the outer diameter of the object, an electrically-conductive inner member received coaxially within the outer member and extending coextensive therewith, and a generally continuous, thermoplastic interlayer interposed between the outer and inner members and extending coextensive therewith. The interlayer bonds the inner member to the outer member along substantially the entire length thereof for consolidating the jacket into an integral structure. The outer member, in turn, is heat-shrinkable to a recovered, i.e., contracted inner diameter smaller than the expanded inner diameter for substantially conforming the jacket to the outer diametric extent of the object.
    Type: Grant
    Filed: January 21, 1997
    Date of Patent: December 21, 1999
    Assignee: Parker-Hannifin Corporation
    Inventors: Wen-Shian V. Tzeng, Ronald Saccuzzo, Jonathan E. Mitchell
  • Patent number: 4734140
    Abstract: Aluminum silicon alloys are used as cores for highly conductive metal coated particles to be incorporated in resins for use as electromagnetic interference shielding. High temperature processing conditions are used after coating of the particles to improve internal and external corrosion resistance of gaskets and filled resins into which the particles are incorporated for shielding use.
    Type: Grant
    Filed: November 24, 1986
    Date of Patent: March 29, 1988
    Assignee: Chomerics, Inc.
    Inventor: Wen-Shian V. Tzeng
  • Patent number: 4678716
    Abstract: Aluminum silicon alloys are used as cores for highly conductive metal coated particles to be incorporated in resins for use as electromagnetic interference shielding. High temperature processing conditions are used after coating of the particles to improve internal and external corrosion resistance of gaskets and filled resins into which the particles are incorporated for shielding use.
    Type: Grant
    Filed: August 6, 1985
    Date of Patent: July 7, 1987
    Assignee: Chomerics, Inc.
    Inventor: Wen-Shian V. Tzeng